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    • 6. 发明申请
    • VIBRATION DETECTOR
    • 振动探测器
    • US20160109286A1
    • 2016-04-21
    • US14895396
    • 2014-05-14
    • DENSO CORPORATION
    • Yoshitaro YAZAKIYoshihiko SHIRAISHIYasuhiro TANAKAToshikazu HARADAMotoki SHIMIZUAtusi SAKAIDAToshihisa TANIGUCHINorio GOUKOKeita SAITOU
    • G01H17/00G01K17/00
    • G01H17/00G01H1/00G01K17/00H01L35/08H01L35/32H01L35/34
    • A vibration detector has a structure including a heat generation member which generates heat when subjected to at least one of deformation and friction by external vibration and a detection element for detecting a heat flux from the heat generation member, and configured to detect data regarding vibration based on a detection result of the detection element. The detection element has a structure in which an insulation base material made of thermoplastic resin is formed with first and second via holes penetrating therethrough in a thickness direction, first and second inter-layer connection members formed of different metals are embedded in the first and second via holes, and the first and second inter-layer connection members are connected in series alternately, the metals forming the first and second inter-layer connection members being sintered alloys sintered in a state in which metal atoms maintain a crystal structure thereof.
    • 振动检测器具有如下结构,该结构包括当受到外部振动的变形和摩擦中的至少一种而产生热量的发热件时,以及用于检测来自发热件的热通量的检测元件, 根据检测元件的检测结果。 检测元件具有这样的结构,其中由热塑性树脂制成的绝缘基底材料形成有沿着厚度方向穿过其中的第一和第二通孔,由不同金属形成的第一和第二层间连接构件嵌入在第一和第二 通孔,并且第一和第二层间连接构件交替地串联,形成第一和第二层间连接构件的金属是在金属原子维持其晶体结构的状态下烧结的烧结合金。
    • 7. 发明申请
    • MANUFACTURING METHOD FOR THERMOELECTRIC CONVERSION DEVICE
    • 热电转换装置的制造方法
    • US20150372215A1
    • 2015-12-24
    • US14763147
    • 2014-01-23
    • DENSO CORPORATION
    • Eijirou MIYAGAWAKeita SAITOUYoshihiko SHIRAISHIYoshitaro YAZAKIToshihisa TANIGUCHIAtusi SAKAIDA
    • H01L35/32H01L35/34
    • H01L35/32H01L35/08H01L35/34
    • An insulating substrate is prepared. In this substrate, plural via holes penetrating in a thickness direction are filled with a conductive paste. This paste is produced by adding an organic solvent to a powder of an, and by processing the power of the alloy to a paste. The substrate is then pressed from a front surface and a back surface of the substrate, while being heated. The conductive paste is solid-phase sintered and interlayer connecting members are formed. A front surface protective member is disposed on a front surface of the substrate and a back surface protective member is disposed on a back surface of the substrate, and a laminate is formed. The laminate is integrated by a lower pressure being applied while heating at a lower temperature, compared to the temperature and pressure in the process of forming the interlayer connecting members.
    • 制备绝缘基板。 在该基板中,在导电性糊料中填充有沿厚度方向贯通的多个通孔。 通过将有机溶剂加入到粉末中并通过将合金的功率加工成糊料来生产该糊料。 然后在被加热的同时从衬底的前表面和后表面压制衬底。 导电膏是固相烧结的,层间连接件形成。 前表面保护部件设置在基板的前表面上,背面保护部件设置在基板的背面,形成有层压体。 与在形成层间连接构件的过程中的温度和压力相比,在较低温度下加热时施加较低压力的层压体。