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    • 8. 发明申请
    • APPARATUS FOR FORMING THIN FILM
    • 用于形成薄膜的装置
    • US20120024228A1
    • 2012-02-02
    • US13179463
    • 2011-07-08
    • Sang-Woo Lee
    • Sang-Woo Lee
    • C23C16/455
    • C23C14/243C23C14/12
    • A thin film forming apparatus according to the embodiment includes a plurality of vapor deposition sources respectively separated from each other, a plurality of nozzle bodies connected to upper portions of the respective vapor deposition sources, and a plurality of nozzles connected to upper portions of the respective nozzle bodies. A nozzle hole of each of the nozzles is formed on a same vapor deposition line. Thus, according to the embodiment, the first organic material and the second organic material respectively sprayed through a first nozzle hole and a second nozzle hole can be uniformly mixed by disposing the first nozzle hole and the second nozzle on the same vapor deposition line.
    • 根据实施例的薄膜形成装置包括分别彼此分离的多个气相沉积源,连接到各个蒸镀源的上部的多个喷嘴体,以及连接到各个蒸镀源的上部的多个喷嘴 喷嘴体。 每个喷嘴的喷嘴孔形成在相同的蒸镀线上。 因此,根据本实施例,通过将第一喷嘴孔和第二喷嘴设置在相同的蒸镀线上,能够均匀地混合通过第一喷嘴孔和第二喷嘴孔喷射的第一有机材料和第二有机材料。
    • 9. 发明申请
    • Semiconductor Device and Method of Fabricating the Same
    • 半导体器件及其制造方法
    • US20110306205A1
    • 2011-12-15
    • US13105195
    • 2011-05-11
    • Byung-Hak LeeYu-Gyun ShinSang-Woo LeeSun-Ghil LeeJin-Bum KimJoon-Gon Lee
    • Byung-Hak LeeYu-Gyun ShinSang-Woo LeeSun-Ghil LeeJin-Bum KimJoon-Gon Lee
    • H01L21/3205
    • H01L21/28518H01L21/823807H01L21/823814
    • Methods of forming a semiconductor device include providing a substrate having an area including a source and a drain region of a transistor. A nickel (Ni) metal film is formed on the substrate area including the source and the drain region. A first heat-treatment process is performed including heating the substrate including the metal film from a first temperature to a second temperature at a first ramping rate and holding the substrate including the metal film at the second temperature for a first period of time. A second heat-treatment process is then performed including heating the substrate including the metal film from a third temperature to a fourth temperature at a second ramping rate and holding the substrate at the fourth temperature for a second period of time. The fourth temperature is different from the second temperature and the second period of time is different from the first period of time. The sequentially performed first and second heat-treatment processes convert the Ni metal layer on the source and drain regions into a NiSi layer on the source and drain regions and a NiSi2 layer between the NiSi layer and the source and drain regions.
    • 形成半导体器件的方法包括提供具有包括晶体管的源极和漏极区域的区域的衬底。 在包括源极和漏极区域的衬底区域上形成镍(Ni)金属膜。 执行第一热处理工艺,包括以第一斜率从第一温度至第二温度加热包括金属膜的基板,并将包含金属膜的基板在第二温度下保持第一时间段。 然后执行第二热处理工艺,包括以第二斜率从第三温度至第四温度加热包括金属膜的衬底,并将衬底保持在第四温度第二时间段。 第四温度与第二温度不同,第二时间段与第一时间段不同。 依次执行的第一和第二热处理工艺将源极和漏极区域上的Ni金属层转换成源极和漏极区域上的NiSi层以及NiSi层与源极和漏极区域之间的NiSi 2层。