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1. 发明申请

US20160246022A1 SEMICONDUCTOR LASER MODULE 有权
标题翻译：半导体激光模块
公开(公告)号：US20160246022A1
公开(公告)日：2016-08-25
申请号：US15062744
申请日：2016-03-07
申请人： FURUKAWA ELECTRIC CO., LTD.
发明人： Yuta ISHIGE , Naoki HAYAMIZU , Etsuji KATAYAMA , Toshio KIMURA
IPC分类号： G02B6/42 , H01S5/40 , H01S5/024 , H01S5/022
CPC分类号： G02B6/4296 , G02B6/262 , G02B6/4206 , H01S5/0071 , H01S5/02216 , H01S5/02252 , H01S5/02284 , H01S5/02469 , H01S5/4012 , H01S5/4043
摘要： A semiconductor laser module includes a semiconductor laser element outputting a laser light; an optical fiber; an optical component disposed at an outer periphery of the optical fiber and fixing the optical fiber; a first-fixing agent fastening the optical component and the optical fiber; a light-absorbing element disposed at an outer periphery of the optical component and fixing the optical component; a first light-blocking portion disposed between an end into which the laser light is incident of the optical fiber and the optical component; and a housing accommodating therein the semiconductor laser element, an end into which the laser light is incident of the optical fiber and the first light-blocking portion. The optical component has an optical transmittance at a wavelength of the laser light, and the light-absorbing element has an optical absorptivity at a wavelength of the laser light.
摘要翻译：半导体激光器模块包括输出激光的半导体激光元件; 光纤; 光学部件，设置在所述光纤的外周并固定所述光纤; 固定光学部件和光纤的第一固定剂; 光吸收元件，设置在所述光学部件的外周并固定所述光学部件; 第一遮光部，设置在激光入射到所述光纤的端部与所述光学部件之间; 以及容纳所述半导体激光元件的壳体，所述激光入射到所述光纤和所述第一遮光部的端部。光学部件在激光的波长处具有光透射率，并且光吸收元件在激光的波长处具有光吸收率。

2. 发明申请

US20210373256A1 OPTICAL PART AND SEMICONDUCTOR LASER MODULE 有权
公开(公告)号：US20210373256A1
公开(公告)日：2021-12-02
申请号：US17445216
申请日：2021-08-17
申请人： FURUKAWA ELECTRIC CO., LTD.
发明人： Naoki HAYAMIZU , Hiroshi HASHIMOTO , Hideyuki NASU
IPC分类号： G02B6/42
摘要： An optical part includes: an optical fiber having a core portion and a cladding portion that is formed around the core portion; a light absorber placed around the optical fiber; and an adhesive member that adheres the light absorber and the optical fiber to each other. Further, the cladding portion includes: a main portion extending along a longitudinal direction and having a main portion cladding diameter; and an input end portion positioned closer to a light input side with respect to the main portion, and an input end face cladding diameter at an input end face of the input end portion is less than the main portion cladding diameter.

3. 发明申请

US20230024623A1 SUPPORTING MEMBER, WAVELENGTH COMBINING MODULE, AND LIGHT EMITTING DEVICE 有权
公开(公告)号：US20230024623A1
公开(公告)日：2023-01-26
申请号：US17955940
申请日：2022-09-29
申请人： FURUKAWA ELECTRIC CO., LTD.
发明人： Satoshi SHIBUYA , Naoki HAYAMIZU , Tatsuya YOSHIZAKI , Ayato OKADA
IPC分类号： G02B27/10 , H01S3/04 , H01S3/00 , H01S3/23 , G02B6/36 , G02B6/02
摘要： A supporting member supports a peeled end portion formed at an end portion in longitudinal direction representing first direction of an optical fiber, the optical fiber including: a core wire including a core and a cladding; and a jacket configured to enclose the core wire, the jacket being removed at the peeled end portion to expose the core wire. The supporting member includes: a first member; a second member fixed to the first member; a housing portion provided between the first member and the second member, the housing portion extending along the peeled end portion and being configured to house the peeled end portion; and a processed member housed in the housing portion and provided around the peeled end portion, the processed member being configured to cause transmission or scattering of light leaking from the peeled end portion.

4. 发明申请

US20170315311A1 SEMICONDUCTOR LASER MODULE 审中-公开
公开(公告)号：US20170315311A1
公开(公告)日：2017-11-02
申请号：US15653954
申请日：2017-07-19
申请人： FURUKAWA ELECTRIC CO., LTD.
发明人： Yuta ISHIGE , Naoki HAYAMIZU , Etsuji KATAYAMA , Toshia KIMURA
IPC分类号： G02B6/42 , H01S5/40 , H01S5/022 , H01S5/00 , G02B6/26
CPC分类号： G02B6/4206 , G02B6/262 , G02B6/4236 , G02B6/4257 , G02B6/4296 , H01S5/0064 , H01S5/0071 , H01S5/0078 , H01S5/02216 , H01S5/02252 , H01S5/02284 , H01S5/02469 , H01S5/4012 , H01S5/4043
摘要： A semiconductor laser module includes a package; a plurality of semiconductor laser elements provided in the package; a member having a plurality of mounting surfaces on which the semiconductor laser elements are mounted, the mounting surfaces being separated from a bottom surface of the package by respective distances, the distances being gradually different from each other in a manner that the mounting surfaces as a whole form a step-like form; a plurality of lenses collimating respective laser beams emitted from the semiconductor laser elements; a plurality of reflection mirrors reflecting the respective laser beams; a condenser lens unit condensing the laser beams; an optical fiber where the optical beams condensed by the condenser lenses are optically coupled; and an optical filter disposed on optical lines of the respective laser beams reflected by the reflection mirrors and reflecting light having wavelengths different from the wavelengths of the laser beams.

5. 发明申请

US20150131692A1 SEMICONDUCTOR LASER MODULE 有权
标题翻译：半导体激光模块
公开(公告)号：US20150131692A1
公开(公告)日：2015-05-14
申请号：US14535357
申请日：2014-11-07
申请人： FURUKAWA ELECTRIC CO., LTD.
发明人： Naoki HAYAMIZU , Yuta ISHIGE , Toshio KIMURA
IPC分类号： H01S5/06
CPC分类号： H01S5/06 , G02B6/32 , G02B6/4206 , G02B6/4214 , H01S5/005 , H01S5/02208 , H01S5/02284 , H01S5/4012
摘要： A semiconductor laser module 1 is mainly composed of a package 3, a semiconductor laser 5, lenses 7, 9, 13, reflecting mirrors 11, an optical fiber 15, and the like. The package 3 is composed of a bottom part and side surfaces 19a, 19b. The side surfaces 19a, 19b stand erect approximately vertical to the bottom part of the package. In the semiconductor laser module 1, a plurality of semiconductor laser installation surfaces 17 are formed in a step-like shape. On each semiconductor laser installation surface 17, a semiconductor laser 5 is installed. A lens 7 is arranged at the anterior (in the emission direction) of the semiconductor laser 5. Moreover, a lens 9 is arranged further to the anterior. A reflecting mirror 11 is fixed to the side surface 19a, which is provided facing the emission direction of the semiconductor laser 5.
摘要翻译：半导体激光器模块1主要由封装3，半导体激光器5，透镜7,9,13，反射镜11，光纤15等组成。包装3由底部和侧面19a，19b构成。侧表面19a，19b竖直地直立于包装的底部。在半导体激光器模块1中，形成阶梯状的多个半导体激光器安装面17。在每个半导体激光器安装表面17上安装半导体激光器5。透镜7配置在半导体激光器5的前方（发光方向）。此外，透镜9配置在前方。反射镜11固定在与半导体激光器5的发射方向相对的侧面19a上。

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