专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US6142361A Chip C4 assembly improvement using magnetic force and adhesive 失效
标题翻译：芯片C4组装改进使用磁力和粘合剂
公开(公告)号：US6142361A
公开(公告)日：2000-11-07
申请号：US458483
申请日：1999-12-09
申请人： Francis J. Downes, Jr. , Robert M. Japp , Mark V. Pierson
发明人： Francis J. Downes, Jr. , Robert M. Japp , Mark V. Pierson
IPC分类号： H01L21/60 , H05K3/30 , H05K3/34 , B23K1/20 , B23K31/02
CPC分类号： H01L24/81 , B23K2201/40 , H01L2224/81801 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H05K3/303 , H05K3/3436 , Y10T29/4913 , Y10T29/53196
摘要： A method, and associated structure, for adhesively coupling a chip to an organic chip carrier. The chip is attached to a top surface of the organic chip carrier by interfacing a solder bump between a C4 solder structure on the chip and a pad on a top surface of the chip carrier. The melting temperature of the solder bump is less than the melting temperature of the C4 solder structure. A block of ferrous material is placed on a top surface of the chip. A temporary or permanent stiffener of ferrous material is placed on the top surface of the chip carrier. A permanent magnet is coupled to a bottom surface of the chip carrier. Alternatively, an electromagnetic could be utilized instead of the electromagnet. Due to the permanent magnet or the electromagnet, a magnetic force on the stiffener is directed toward the magnet and substantially flattens the first surface of the chip carrier. Similarly, a magnetic force on the block is directed toward the magnet such that the electronic component and the chip carrier are held in alignment. The solder bump is reflowed at a temperature between the melting temperature of the solder bump and the melting temperature of the C4 solder structure. The reflowing reconfigures the solder bump. The magnetic force on the block frictionally clamps the reflowed solder between the C4 solder structure and the pad. The chip and carrier are cooled, resulting in the C4 solder structure being adhesively and conductively coupled to the pad.
摘要翻译：一种用于将芯片粘合地耦合到有机芯片载体的方法和相关联的结构。芯片通过在芯片上的C4焊料结构和芯片载体的顶表面上的焊盘之间接合焊料凸块来附接到有机芯片载体的顶表面。焊料凸点的熔化温度小于C4焊料结构的熔化温度。将一块黑色金属材料放置在芯片的上表面上。铁芯材料的临时或永久性加强件被放置在芯片载体的顶表面上。永磁体耦合到芯片载体的底表面。或者，可以使用电磁来代替电磁体。由于永磁体或电磁体，加强件上的磁力被引向磁体并且基本平坦化芯片载体的第一表面。类似地，块上的磁力指向磁体，使得电子部件和芯片载体保持对准。在焊料凸块的熔化温度和C4焊料结构的熔化温度之间的温度下回流焊料凸点。回流重新配置焊料凸块。块上的磁力摩擦地夹住C4焊料结构和焊盘之间的回流焊料。芯片和载体被冷却，导致C4焊料结构被粘性地导电耦合到焊盘。

2. 发明授权

US06429384B1 Chip C4 assembly improvement using magnetic force and adhesive 失效
标题翻译：芯片C4组装改进使用磁力和粘合剂
公开(公告)号：US06429384B1
公开(公告)日：2002-08-06
申请号：US09588836
申请日：2000-06-07
申请人： Francis J. Downes, Jr. , Robert M. Japp , Mark V. Pierson
发明人： Francis J. Downes, Jr. , Robert M. Japp , Mark V. Pierson
IPC分类号： H05K116
CPC分类号： H01L24/81 , B23K2101/40 , H01L2224/81801 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H05K3/303 , H05K3/3436 , Y10T29/4913 , Y10T29/53196
摘要： A structure that adhesively couples a chip to an organic chip carrier. The chip is attached to a top surface of the organic chip carrier by interfacing a solder bump between a C4 solder structure on the chip and a pad on a top surface of the chip carrier. The melting temperature of the solder bump is less than the melting temperature of the C4 solder structure. A block of ferrous material is on a top surface of the chip. A temporary or permanent stiffener of ferrous material is on the top surface of the chip carrier. A permanent magnet is coupled to a bottom surface of the chip carrier. Alternatively, an electromagnetic could be utilized instead of the electromagnet. Due to the permanent magnet or the electromagnet, a magnetic force on the stiffener is directed toward the magnet and substantially flattens the first surface of the chip carrier. Similarly, a magnetic force on the block is directed toward the magnet such that the electronic component and the chip carrier are held in alignment. After the solder bump has been reflowed at a temperature between the melting temperature of the solder bump and the melting temperature of the C4 solder structure, the solder bump is reconfigured. The magnetic force on the block frictionally clamps the reflowed solder between the C4 solder structure and the pad. After the chip and carrier are cooled, the C4 solder structure is adhesively and conductively coupled to the pad.
摘要翻译：将芯片与有机芯片载体粘接的结构。芯片通过在芯片上的C4焊料结构和芯片载体的顶表面上的焊盘之间接合焊料凸块来附接到有机芯片载体的顶表面。焊料凸点的熔化温度小于C4焊料结构的熔化温度。铁质材料块在芯片的顶表面上。铁质材料的临时或永久性加强件位于芯片载体的顶表面上。永磁体耦合到芯片载体的底表面。或者，可以使用电磁来代替电磁体。由于永磁体或电磁体，加强件上的磁力被引向磁体并且基本平坦化芯片载体的第一表面。类似地，块上的磁力指向磁体，使得电子部件和芯片载体保持对准。在焊料凸块的熔化温度和C4焊料结构的熔化温度之间的温度下回流焊料凸点之后，重新配置焊料凸点。块上的磁力摩擦地夹住C4焊料结构和焊盘之间的回流焊料。在芯片和载体被冷却之后，C4焊料结构粘合地并且导电地耦合到焊盘。

3. 发明授权

US06756680B2 Flip chip C4 extension structure and process 有权
公开(公告)号：US06756680B2
公开(公告)日：2004-06-29
申请号：US09782471
申请日：2001-02-12
申请人： Miguel A. Jimarez , Cynthia S. Milkovich , Mark V. Pierson
发明人： Miguel A. Jimarez , Cynthia S. Milkovich , Mark V. Pierson
IPC分类号： H01L2348
CPC分类号： H01L24/12 , B23K1/0016 , B23K2101/42 , H01L21/4853 , H01L23/49811 , H01L23/49816 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/05671 , H01L2224/10126 , H01L2224/13022 , H01L2224/13099 , H01L2224/13111 , H01L2224/16225 , H01L2224/81013 , H01L2224/81801 , H01L2224/81894 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01049 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/351 , H05K3/0032 , H05K3/3436 , H05K2201/0379 , H05K2201/10977 , H05K2201/10992 , H05K2203/0415 , H05K2203/043 , H05K2203/0465 , Y02P70/613 , H01L2924/00 , H01L2224/29099 , H01L2924/00014
摘要： An electrical structure, and associated method of fabrication, for reducing thermally induced strain in a structure that couples a first conductive body of a first substrate to a second conductive body of a second substrate (e.g., a chip to a chip carrier; a chip carrier to a circuit card). The melting point of the first conductive body exceeds the melting point of the second conductive body. The second conductive body may include eutectic lead-tin alloy, while the first conductive body may include non-eutectic lead-tin alloy. A portion of the first conductive body is coated with, or volumetrically surrounded by, a material that is nonsolderable and nonconductive. The first and second conductive bodies are coupled mechanically and electrically by surface adhesion at an uncoated portion of the first conductive body, by application of a temperature that lies between the melting points of the first and second conductive bodies.

4. 发明授权

US06699736B2 Electrical coupling of a stiffener to a chip carrier 有权
标题翻译：加强筋与芯片载体的电耦合
公开(公告)号：US06699736B2
公开(公告)日：2004-03-02
申请号：US10305643
申请日：2002-11-26
申请人： Terry J. Dornbos , Raymond A. Phillips, Jr. , Mark V. Pierson , William J. Rudik , David L. Thomas
发明人： Terry J. Dornbos , Raymond A. Phillips, Jr. , Mark V. Pierson , William J. Rudik , David L. Thomas
IPC分类号： H01L2144
CPC分类号： H05K3/0061 , H01L21/4846 , H05K3/386 , H05K3/4038 , H05K2201/0305 , H05K2201/09554 , H05K2201/10977
摘要： A method and structure for conductively coupling a metallic stiffener to a chip carrier. A substrate has a conductive pad on its surface and an adhesive layer is formed on the substrate surface. The metallic stiffener is placed on the adhesive layer, wherein the adhesive layer mechanically couples the stiffener to the substrate surface and electrically couples the stiffener to the pad. The adhesive layer is then cured such as by pressurization at elevated temperature. Embodiments of the present invention form the adhesive layer by forming an electrically conductive contact on the pad and setting a dry adhesive on the substrate, such that the electrically conductive contact is within a hole in the dry adhesive. The electrically conductive contact electrically couples the stiffener to the pad. The curing step includes curing both the dry adhesive and the electrically conductive contact, resulting in the dry adhesive adhesively coupling the stiffener to the substrate. The electrically conductive contact may include an electrically conductive adhesive or a metallic solder. Additional embodiments of the present invention form the adhesive layer by applying an electrically conductive adhesive on the substrate, wherein after the stiffener is placed on the adhesive layer, the electrically conductive adhesive mechanically and electrically couples the stiffener to the surface of the substrate.
摘要翻译：用于将金属加强件导电耦合到芯片载体的方法和结构。衬底在其表面上具有导电焊盘，并且在衬底表面上形成粘合剂层。金属加强件被放置在粘合剂层上，其中粘合剂层将加强件机械地连接到基底表面，并将加强件电耦合到垫。然后将粘合剂层固化，例如通过在升高的温度下加压。本发明的实施例通过在焊盘上形成导电触点并在基板上设置干燥的粘合剂来形成粘合剂层，使得导电触点位于干粘合剂中的孔内。导电触头将加强件电耦合到焊盘。固化步骤包括固化干燥粘合剂和导电接触，导致干燥粘合剂将加强剂粘合到基底上。导电接触可包括导电粘合剂或金属焊料。本发明的另外的实施方案通过在基底上施加导电粘合剂形成粘合剂层，其中在将加强件放置在粘合剂层上之后，导电粘合剂将加强件机械地和电耦合到基底的表面。

5. 发明授权

US06487461B1 TFT panel alignment and attachment method and apparatus 失效
标题翻译： TFT面板对准和附接方法和装置
公开(公告)号：US06487461B1
公开(公告)日：2002-11-26
申请号：US09590280
申请日：2000-06-09
申请人： Michael A. Gaynes , Allan O. Johnson , Ramesh R. Kodnani , Mark V. Pierson , Edward J. Tasillo
发明人： Michael A. Gaynes , Allan O. Johnson , Ramesh R. Kodnani , Mark V. Pierson , Edward J. Tasillo
IPC分类号： G05B1918
CPC分类号： G02F1/13336 , Y10S345/903
摘要： A method for aligning a plurality of thin film transistor tiles for constructing a flat panel display. A coverplate is arranged on a coverplate support. A first layer of a bonding material is applied to at least one of a first side of each of the tiles and a surface of the coverplate on which the tiles are to be secured. The tiles are arranged on the coverplate, such that the first layer of bonding material is arranged between the tiles and the coverplate. The tiles are connected to an alignment apparatus. The tiles are aligned relative to each other and the coverplate. The tiles are at least partially secured to the coverplate.
摘要翻译：一种用于对准多个用于构建平板显示器的薄膜晶体管瓦片的方法。盖板安装在盖板支架上。接合材料的第一层被施加到每个瓷砖的第一侧中的至少一个以及待固定瓷砖的盖板的表面。瓦片布置在盖板上，使得第一层粘合材料布置在瓦片和盖板之间。瓦片连接到对准装置。瓷砖相对于彼此和盖板对准。瓦片至少部分地固定到盖板上。

6. 发明授权

US06173887B1 Method of making electrically conductive contacts on substrates 失效
标题翻译：在基板上制作导电触点的方法
公开(公告)号：US06173887B1
公开(公告)日：2001-01-16
申请号：US09339924
申请日：1999-06-24
申请人： Donald I. Mead , Mark V. Pierson
发明人： Donald I. Mead , Mark V. Pierson
IPC分类号： B23K2622
CPC分类号： H05K3/3484 , B23K1/0053 , B23K1/0056 , B23K2101/40 , H05K3/3494 , H05K2203/043 , H05K2203/0557 , H05K2203/107
摘要： A method of making an electrically conductive contact on a substrate by applying a layer of solder paste to a circuitized feature on a substrate and selectively heating and melting the solder paste over the feature to form a solder bump. The excess solder paste is removed. A focused energy heat source such as a laser beam or focused Infrared heats the solder paste. In another embodiment, a reflective mask with apertures may be used to allow focused heating source to selectively melt areas of the solder paste layer applied to a circuitized feature. In yet another embodiment, a reflective mask with apertures filled with solder paste is applied onto a substrate and then heated to cause localized solder melting. The mask and excess solder paste are removed.
摘要翻译：一种通过将衬底层施加到衬底上的电路化特征并在该特征上选择性地加热和熔化焊膏以形成焊料凸块来在衬底上形成导电接触的方法。去除多余的焊膏。聚焦能量热源如激光束或聚焦红外线加热焊膏。在另一个实施例中，具有孔的反射掩模可以用于允许聚焦的加热源选择性地熔化施加到电路化特征上的焊膏层的区域。在另一个实施例中，将具有填充有焊膏的孔的反射掩模施加到基板上，然后加热以引起局部焊料熔化。去除掩模和多余的焊膏。

7. 发明授权

US5969945A Electronic package assembly 失效
标题翻译：电子封装组装
公开(公告)号：US5969945A
公开(公告)日：1999-10-19
申请号：US808829
申请日：1997-02-27
申请人： Lawrence R. Cutting , Michael A. Gaynes , Eric A. Johnson , Cynthia S. Milkovich , Jeffrey S. Perkins , Mark V. Pierson , Steven E. Poetzinger , Jerzy Zalesinski
发明人： Lawrence R. Cutting , Michael A. Gaynes , Eric A. Johnson , Cynthia S. Milkovich , Jeffrey S. Perkins , Mark V. Pierson , Steven E. Poetzinger , Jerzy Zalesinski
IPC分类号： H01L21/48 , H01L23/367 , H01L23/538 , H05K1/00 , H05K1/02 , H05K1/18 , H05K3/00 , H05K3/12 , H05K3/34 , H05K7/20
CPC分类号： H05K7/20454 , H01L21/4857 , H01L21/4867 , H01L23/3672 , H01L23/5387 , H05K1/021 , H05K1/189 , H05K3/0061 , H05K3/1216 , H05K3/4691 , H01L2224/16 , H01L2924/01078 , H01L2924/01322 , H05K1/0298 , H05K1/182 , H05K2201/0154 , H05K2201/09063 , H05K2201/096 , H05K2201/09745 , H05K2201/1056 , H05K2201/2009 , H05K2203/1394 , H05K3/3415 , H05K3/3452 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144
摘要： A screen printing fixture holds a flexible circuit board having components attached to one side, to allow screening a pattern of solder paste onto the second side for subsequent attachment of components to that side. In an electronic package assembly a flexible circuit board with components is wound about a heat spreader assembly having a cavity so that at least one component on the flexible circuit board is positioned within the cavity and in thermal connection to the heat spreader.
摘要翻译：丝网印刷夹具具有安装在一侧的部件的柔性电路板，以允许将焊膏的图案屏蔽到第二侧上，以便随后将部件附接到该侧。在电子封装组件中，具有部件的柔性电路板围绕具有空腔的散热器组件缠绕，使得柔性电路板上的至少一个部件位于腔内并与散热器热连接。

8. 发明授权

US5889321A Stiffeners with improved adhesion to flexible substrates 失效
标题翻译：具有改善与柔性基材的附着力的增强剂
公开(公告)号：US5889321A
公开(公告)日：1999-03-30
申请号：US877538
申请日：1997-06-17
申请人： Thomas M. Culnane , Michael A. Gaynes , Ramesh R. Kodnani , Mark V. Pierson
发明人： Thomas M. Culnane , Michael A. Gaynes , Ramesh R. Kodnani , Mark V. Pierson
IPC分类号： H01L21/48 , H01L21/50 , H05K1/18 , H01L23/48
CPC分类号： H05K1/189 , H01L21/4803 , H01L21/50 , H01L2224/16225
摘要： A stiffener (34 or 52 or 72) includes a pathway which allows gases and fluids, such as air, to be vented from the interface between surface bonding regions (35 or 60 or 74) of the stiffener and an adhesive (38 or 56 or 80) on a flexible substrate (36 or 54 or 78). The pathway may take the form of a porous material used for the stiffener or one or more bore holes (58 or 59 or 70) formed in the stiffener. The stiffener may also include an internal cavity (76) for promoting venting of fluids and gases. By venting fluid and gases from the adhesive/stiffener interface, better adhesion between the stiffener and flexible substrate is achieved.
摘要翻译：加强件（34或52或72）包括允许气体和流体（例如空气）从加强件的表面粘合区域（35或60或74）之间的界面和粘合剂（38或56或 80）在柔性基板（36或54或78）上。该通道可以采用用于加强件的多孔材料的形式或形成在加强件中的一个或多个钻孔（58或59或70）。加强件还可以包括用于促进流体和气体排放的内腔（76）。通过从粘合剂/加强件界面排出流体和气体，实现加强件和柔性基材之间更好的粘附。

9. 发明授权

US5862588A Method for restraining circuit board warp during area array rework 失效
标题翻译：在区域阵列返工期间抑制电路板翘曲的方法
公开(公告)号：US5862588A
公开(公告)日：1999-01-26
申请号：US514703
申请日：1995-08-14
申请人： Craig G. Heim , Russell H. Lewis , Mark V. Pierson , Karl J. Puttlitz
发明人： Craig G. Heim , Russell H. Lewis , Mark V. Pierson , Karl J. Puttlitz
IPC分类号： B23K1/012 , B23K3/08 , C08G61/00 , C08G63/91 , C08L63/00 , C08L67/02 , C08L71/12 , H05K3/34 , H05K13/04
CPC分类号： H05K3/3494 , B23K1/012 , B23K3/08 , C08G61/00 , C08G63/914 , C08L63/00 , C08L67/02 , C08L71/126 , H01L24/75 , H05K3/3415 , B23K2201/40 , B23K2201/42 , H01L2224/16225 , H05K2201/10734 , H05K2203/0173 , H05K2203/081 , H05K2203/1105 , H05K2203/1572 , H05K2203/176 , H05K3/3436 , Y02P70/613 , Y10S29/024 , Y10S29/044 , Y10T29/49144 , Y10T29/53191 , Y10T29/53265
摘要： A method for producing interconnect structures and circuit boards including placing an area array component having connection bumps on the corresponding metal contacts on a substrate disposed on a backing plate, providing heat curable joining material in communication with the bumps and contacts, contacting a gas nozzle directly to a portion of the substrate surrounding the component to press the substrate between the nozzle and the backing plate to restrain the substrate from wrapping, heating the component, the joining material and the substrate proximate the metal contacts while maintaining the nozzle on the substrate to cure the joining material, and cooling the component, the joining material and the substrate. Selected components can also be replaced utilizing the gas nozzle for restraining the substrate from wrapping.
摘要翻译：一种制造互连结构和电路板的方法，包括将布置在背板上的基板上的相应金属触点上具有连接凸块的区域阵列部件放置在一起，提供与凸块和触点相连通的热固化连接材料，直接接触气体喷嘴到围绕组件的基板的一部分，以将衬底压在喷嘴和背板之间，以限制衬底的包裹，加热组件，接合材料和接近金属触点的衬底，同时将喷嘴保持在衬底上以固化接合材料，并冷却组件，接合材料和基底。选择的部件也可以利用气体喷嘴进行更换，以限制基材的包装。

10. 发明授权

US5315227A Solar recharge station for electric vehicles 失效
标题翻译：电动汽车太阳能充电站
公开(公告)号：US5315227A
公开(公告)日：1994-05-24
申请号：US010888
申请日：1993-01-29
申请人： Mark V. Pierson , How T. Lin
发明人： Mark V. Pierson , How T. Lin
IPC分类号： B60L8/00 , B60L11/18 , H02J7/35 , H02J7/00
CPC分类号： B60L11/1818 , B60L11/1824 , B60L11/1833 , B60L11/1844 , H02J7/355 , B60L2200/26 , B60L2210/30 , B60L2230/22 , B60L2230/30 , Y02E60/721 , Y02T10/7005 , Y02T10/7088 , Y02T10/7241 , Y02T90/121 , Y02T90/125 , Y02T90/127 , Y02T90/128 , Y02T90/14 , Y02T90/163 , Y04S10/126 , Y10S136/291 , Y10S136/293
摘要： A solar recharge station is described having a contact area, a battery bank charge area and a solar panel array for maintaining the battery bank charged. The contact area includes electric contacts formed for engagement automatically by contacts on an electric powered vehicle as the vehicle enters the contact area. The battery bank is connected so that its energy is available for either recharging the vehicle or other use, and in case the vehicle needs a recharge but the battery banks lacks sufficient charge, ordinary house voltage is used.
摘要翻译：描述了具有接触区域，电池组充电区域和用于维持电池组充电的太阳能电池板阵列的太阳能充电站。接触区域包括当车辆进入接触区域时由电动车辆上的触点自动地接合形成的电触头。电池组被连接，使得其能量可用于对车辆或其他用途进行充电，并且如果车辆需要充电，但是电池组缺少足够的电量，则使用普通房屋电压。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式