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1. 发明申请

US20220163742A1 OPTICAL CONNECTOR AND LASER APPARATUS HAVING THE SAME 有权
公开(公告)号：US20220163742A1
公开(公告)日：2022-05-26
申请号：US17437282
申请日：2020-03-02
申请人： FUJIKURA LTD.
发明人： Akira Sakamoto , Tomohisa Endo
IPC分类号： G02B6/42
摘要： An optical connector includes: an enclosure having a light propagation space; a glass block disposed at an end of the enclosure; an output beam fiber that: extends from an exterior of the enclosure through the light propagation space and connects to the glass block, and includes: a beam core that propagates an output laser beam; and a cladding disposed around the beam core; and an optical feedback fiber that: extends from an interior of the light propagation space to an exterior of the enclosure, and includes a feedback core to which light propagating within the light propagation space couples.

2. 发明授权

US10668696B2 Bonding structure on gold thin film 审中-公开
公开(公告)号：US10668696B2
公开(公告)日：2020-06-02
申请号：US15388070
申请日：2016-12-22
申请人： FUJIKURA LTD.
发明人： Shohei Kumeta , Gento Yoshino , Yohei Kasai , Akira Sakamoto
IPC分类号： B32B3/00 , B32B15/04 , C09J5/02 , C09J201/00 , C03C27/04 , H01L23/00 , B32B17/00 , B32B15/20 , B32B7/12 , B32B37/12 , B32B38/00
摘要： The present invention provides a bonding method (S1) which is capable of achieving a high adhesive force without carrying out any special treatment on the second member (14), even in a case where the first member (11) has a surface on which a gold thin film (12) is formed. The first member (11) is made of a material other than gold and has a surface on which the gold thin film (12) is formed. The bonding method (S1) includes the steps of: (S11) irradiating, with laser light, at least part of a specific region (12a) of the surface of the first member (11), so that a base of the thin film (12) is exposed in the at least part of the specific region (12a); and (S12) bonding the second member (14) to the specific region (12a) by use of an adhesive (13).

3. 发明授权

US08638826B2 Laser device 有权
公开(公告)号：US08638826B2
公开(公告)日：2014-01-28
申请号：US13628944
申请日：2012-09-27
申请人： Fujikura Ltd.
发明人： Akira Sakamoto , Nozomu Toyohara , Yohei Kasai
IPC分类号： H01S3/04
摘要： The laser device includes a semiconductor laser element having an emission surface from which laser light is emitted, an optical fiber having an end part facing the emission surface, and an optical fiber supporting member which (i) supports the optical fiber and (ii) has a bonding pad to which the optical fiber is fixed by solder. The optical fiber supporting member includes a beam part having (i) a first main surface on which the bonding pad is provided and (ii) a second main surface opposite to the first main surface, and a pillar part which is fixed to a base and is joined to the beam part on an end portion of the beam part such that the second main surface and the base face each other while being spatially away from each other.

4. 发明申请

US20130336625A1 FIBER MOUNT DEVICE, OPTICAL MODULE USING SAME, AND OPTICAL MODULE MANUFACTURING METHOD 有权
标题翻译：光纤装置，使用其的光学模块和光模块制造方法
公开(公告)号：US20130336625A1
公开(公告)日：2013-12-19
申请号：US13969716
申请日：2013-08-19
申请人： FUJIKURA LTD.
发明人： Nozomu Toyohara , Akira Sakamoto , Yohei Kasai
IPC分类号： G02B6/36 , B23K1/005
CPC分类号： G02B6/3628 , B23K1/0056 , G02B6/4202 , G02B6/424 , G02B6/4257
摘要： A fiber mount device 2 includes a fiber sub-mount main body 31 that is made of ceramic transmitting a laser beam having a predetermined wavelength, a bonding pad 33 that is provided on the upper surface of the fiber sub-mount main body 31, and a laser absorption layer 32 that is provided on at least a part of the lower surface of the fiber sub-mount main body 31 and absorbs the laser beam having the predetermined wavelength.
摘要翻译：光纤安装装置2包括由传输具有预定波长的激光束的陶瓷制成的光纤副安装主体31，设置在光纤分支架主体31的上表面上的接合焊盘33，以及激光吸收层32，其设置在光纤副安装主体31的下表面的至少一部分上并吸收具有预定波长的激光束。

5. 发明授权

US08553736B2 Laser device and method for manufacturing same 有权
标题翻译：激光装置及其制造方法
公开(公告)号：US08553736B2
公开(公告)日：2013-10-08
申请号：US13627668
申请日：2012-09-26
申请人： Fujikura Ltd.
发明人： Nozomu Toyohara , Akira Sakamoto , Yohei Kasai
IPC分类号： H01S3/04 , G02B6/36
CPC分类号： G02B6/4206 , G02B6/262 , G02B6/4296 , H01S5/02252 , H01S5/02284 , H01S5/02438 , H01S5/02492
摘要： A laser device includes: a semiconductor laser element having an output surface; an optical fiber having a leading end portion facing the output surface of the semiconductor laser element; and an optical fiber supporting member for supporting the optical fiber, the optical fiber supporting member being made from a non heat insulating material and having a bonding pad to which the optical fiber is fixed by use of solder. The optical fiber supporting member includes a contact portion thermally in contact with a base. The bonding pad is (i) spaced apart from the contact portion so as to be located on a side opposite from the contact portion so that a region to which laser light is applied from another laser element when the optical fiber is fixed to the bonding pad is sandwiched between the bonding pad and the base and (ii) separated spatially from the base.
摘要翻译：激光装置包括：具有输出表面的半导体激光元件; 具有面向半导体激光元件的输出面的前端部的光纤; 以及用于支撑所述光纤的光纤支撑部件，所述光纤支撑部件由非绝热材料制成，并且具有通过使用焊料固定所述光纤的接合焊盘。光纤支撑构件包括与基座热接触的接触部分。接合焊盘是（i）与接触部分隔开，以便位于与接触部分相对的一侧上，使得当光纤被固定到接合焊盘上时，从另一个激光元件施加激光的区域被夹在接合垫和基底之间，（ii）在空间上与基底分离。

6. 发明申请

US20220152731A1 LASER PROCESSING APPARATUS 有权
公开(公告)号：US20220152731A1
公开(公告)日：2022-05-19
申请号：US17434303
申请日：2020-03-10
申请人： FUJIKURA LTD.
发明人： Yuji Matsuoka , Akira Sakamoto
IPC分类号： B23K26/0622 , B23K26/06 , B23K26/70
摘要： A laser processing apparatus includes a process laser light source, a first optical system, a pulse laser light source, a second optical system, and an optical detection portion. The process laser light source generates a process laser beam having a continuous energy density during a certain period of time. The first optical system directs the process laser beam to a surface of a workpiece. The pulse laser light source generates a pulse laser beam having an energy density with a peak value that is higher than the energy density of the process laser beam. The second optical system directs the pulse laser beam to a process portion of the workpiece. The optical detection portion detects plasma light produced at the process portion of the workpiece.

7. 发明授权

US09457415B2 Water removing method, optical fiber soldering method, and semiconductor laser module manufacturing method 有权
标题翻译：除水方法，光纤焊接法和半导体激光器模块的制造方法
公开(公告)号：US09457415B2
公开(公告)日：2016-10-04
申请号：US14478383
申请日：2014-09-05
申请人： FUJIKURA LTD.
发明人： Akira Sakamoto
IPC分类号： B23K1/20 , G02B6/42 , F26B3/28 , F26B3/30
CPC分类号： B23K1/20 , B23K1/0016 , F26B3/28 , F26B3/30 , G02B6/4238
摘要： A moisture removing method disclosed removes moisture contained in a dielectric film provided on one end surface of an optical fiber. This moisture removing method causes near infrared light to enter the optical fiber through the other end surface to heat moisture in the dielectric film with use of the near infrared light.
摘要翻译：所公开的除湿方法除去了设置在光纤的一个端面上的电介质膜中含有的水分。这种除湿方法使得近红外光通过另一端面进入光纤，以通过使用近红外光来加热电介质膜中的水分。

8. 发明授权

US08687663B2 Laser device 有权
标题翻译：激光设备
公开(公告)号：US08687663B2
公开(公告)日：2014-04-01
申请号：US13628944
申请日：2012-09-27
申请人： Fujikura Ltd.
发明人： Akira Sakamoto , Nozomu Toyohara , Yohei Kasai
IPC分类号： H01S3/04
CPC分类号： H01S5/02284 , G02B6/4202 , G02B6/4238 , H01S5/02252 , H01S5/02438 , H01S5/02469
摘要： The laser device includes a semiconductor laser element having an emission surface from which laser light is emitted, an optical fiber having an end part facing the emission surface, and an optical fiber supporting member which (i) supports the optical fiber and (ii) has a bonding pad to which the optical fiber is fixed by solder. The optical fiber supporting member includes a beam part having (i) a first main surface on which the bonding pad is provided and (ii) a second main surface opposite to the first main surface, and a pillar part which is fixed to a base and is joined to the beam part on an end portion of the beam part such that the second main surface and the base face each other while being spatially away from each other.
摘要翻译：该激光装置包括具有发射激光的发射面的半导体激光元件，具有面向发光面的端部的光纤，以及（i）支撑光纤的光纤支撑部件，（ii）具有通过焊料固定光纤的接合焊盘。光纤支撑部件包括：梁部，其具有：（i）设置接合焊盘的第一主表面和（ii）与第一主表面相对的第二主表面，以及固定到基部的柱部，在波束部分的端部处连接到梁部分，使得第二主表面和基座在空间上彼此远离的同时彼此面对。

9. 发明授权

US09158078B2 Laser module 有权
标题翻译：激光模块
公开(公告)号：US09158078B2
公开(公告)日：2015-10-13
申请号：US14104507
申请日：2013-12-12
申请人： Fujikura Ltd.
发明人： Nozomu Toyohara , Akira Sakamoto , Yohei Kasai
IPC分类号： G02B6/12 , G02B6/42 , H01S5/022 , H01S5/024
CPC分类号： G02B6/4272 , G02B6/4207 , G02B6/4219 , G02B6/4236 , G02B6/4238 , G02B6/4246 , G02B6/4248 , G02B6/4257 , G02B6/426 , G02B6/4265 , G02B6/4267 , H01L2224/48091 , H01L2224/49175 , H01S5/02208 , H01S5/02236 , H01S5/02272 , H01S5/02284 , H01S5/02476 , H01L2924/00014
摘要： The semiconductor laser module (1) includes: a laser mount (31) having thereon a semiconductor laser chip (32); a fiber mount (40) having thereon an optical fiber (2); a submount (20) on which the laser mount (31) and the fiber mount (40) are placed; and a substrate (10) on which the submount 20 is placed, the substrate (10) having protrusions (11a to 11d) on a top surface thereof, the submount 20 being joined to the substrate (10) with a soft solder (61) spread between the submount (20) and the substrate (10).
摘要翻译：半导体激光器模块（1）包括：激光器安装件（31），其上具有半导体激光器芯片（32）; 具有光纤（2）的光纤安装座（40）; 激光装置（31）和光纤支架（40）放置在其上的基座（20）和基板（10），基板（10）在基板（10）上放置有基板（10），基板（10）在其顶面上具有突起（11a〜11d），基座（20）用软焊料（61）接合到基板（10）分布在基座（20）和基板（10）之间。

10. 发明申请

US20140105538A1 LASER MODULE 有权
标题翻译：激光模块
公开(公告)号：US20140105538A1
公开(公告)日：2014-04-17
申请号：US14104507
申请日：2013-12-12
申请人： Fujikura Ltd.
发明人： Nozomu Toyohara , Akira Sakamoto , Yohei Kasai
IPC分类号： G02B6/42
CPC分类号： G02B6/4272 , G02B6/4207 , G02B6/4219 , G02B6/4236 , G02B6/4238 , G02B6/4246 , G02B6/4248 , G02B6/4257 , G02B6/426 , G02B6/4265 , G02B6/4267 , H01L2224/48091 , H01L2224/49175 , H01S5/02208 , H01S5/02236 , H01S5/02272 , H01S5/02284 , H01S5/02476 , H01L2924/00014
摘要： The semiconductor laser module (1) includes: a laser mount (31) having thereon a semiconductor laser chip (32); a fiber mount (40) having thereon an optical fiber (2); a submount (20) on which the laser mount (31) and the fiber mount (40) are placed; and a substrate (10) on which the submount 20 is placed, the substrate (10) having protrusions (11a to 11d) on a top surface thereof, the submount 20 being joined to the substrate (10) with a soft solder (61) spread between the submount (20) and the substrate (10).
摘要翻译：半导体激光器模块（1）包括：激光器安装件（31），其上具有半导体激光器芯片（32）; 具有光纤（2）的光纤安装座（40）; 激光装置（31）和光纤支架（40）放置在其上的基座（20）和基板（10），基板（10）在基板（10）上放置有基板（10），基板（10）在其顶面上具有突起（11a〜11d），基座（20）用软焊料（61）接合到基板（10）分布在基座（20）和基板（10）之间。

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