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1. 发明申请

US20140071621A1 Electronic Equipment Cooling System with Auxiliary Cooling Device 有权
标题翻译：具有辅助冷却装置的电子设备冷却系统
公开(公告)号：US20140071621A1
公开(公告)日：2014-03-13
申请号：US14077498
申请日：2013-11-12
申请人： Huawei Technologies Co., Ltd.
发明人： Yuan Dong , Liqian Zhai , Shanjiu Chi , Jun Zhao
IPC分类号： H05K7/20
CPC分类号： H05K7/20581 , H05K7/20727 , H05K7/20736
摘要： Embodiments of the present invention disclose an electronic equipment cooling system including: a cabinet; at least one electronic equipment chassis that is installed inside the cabinet; and an auxiliary cooling device including an air pressurizing device, an air supply plenum box, and an air-guiding device. The air supply plenum box is disposed on an inner side of the cabinet. The air pressurizing device is disposed at the top or bottom of the cabinet, and an air exhaust on a sidewall of the air pressurizing device is connected to a corresponding air intake on a sidewall of the air supply plenum box. The air-guiding device is installed inside the electronic equipment chassis, an air intake of the air-guiding device is connected to an air exhaust of the air supply plenum device, and an air exhaust of the air-guiding device faces a component inside the electronic equipment chassis.
摘要翻译：本发明的实施例公开了一种电子设备冷却系统，包括：机柜; 安装在机柜内的至少一个电子设备底盘; 以及辅助冷却装置，其包括空气加压装置，空气供给箱和空气引导装置。供气室被设置在机柜的内侧。空气加压装置设置在机柜的顶部或底部，空气加压装置的侧壁上的排气口与供气室的侧壁上的相应进气口连接。空气引导装置安装在电子设备底盘的内部，空气引导装置的进气口连接到供气通风装置的排气口，空气引导装置的排气面向内部的部件电子设备底盘。

2. 发明申请

US20140003615A1 NOISE REDUCTION METHOD, DEVICE, AND SYSTEM 审中-公开
标题翻译：噪声减少方法，装置和系统
公开(公告)号：US20140003615A1
公开(公告)日：2014-01-02
申请号：US13905325
申请日：2013-05-30
申请人： Huawei Technologies Co., Ltd.
发明人： Baosheng Li , Liqian Zhai , Shanjiu Chi
IPC分类号： H04R3/00
CPC分类号： H04R3/002 , G10K11/175 , G10K11/178 , G10K2210/109 , G10K2210/3033
摘要： Embodiments of the present invention provide a noise reduction method, device, and system. In the embodiments of the present invention, operating condition information of a noise source is obtained, where the operating condition information represents an operating condition of the noise source, then sound wave information corresponding to the obtained operating condition information is determined according to a pre-set mapping between the operating condition information and the sound wave information, and active noise reduction is performed by using the corresponding sound wave information. Steps such as collection, conversion, and calculation for noise generated by the noise source are not required, thereby shortening time for the active noise reduction.
摘要翻译：本发明的实施例提供了一种降噪方法，装置和系统。在本发明的实施例中，获得噪声源的工作状态信息，其中操作条件信息表示噪声源的操作条件，然后根据预先确定的所获得的操作条件信息确定与获得的操作条件信息相对应的声波信息，在操作条件信息和声波信息之间设置映射，并且通过使用相应的声波信息来执行主动降噪。不需要对由噪声源产生的噪声的采集，转换和计算等步骤，从而缩短了主动降噪的时间。

3. 发明授权

US10278309B2 Cabinet and heat dissipation system 有权
公开(公告)号：US10278309B2
公开(公告)日：2019-04-30
申请号：US15785159
申请日：2017-10-16
申请人： Huawei Technologies Co., Ltd.
发明人： Zhongjiang Qu , Shanjiu Chi , Yangfan Zhong , Jin Wang
IPC分类号： H05K7/20 , H05K7/14
摘要： The present disclosure provides a cabinet and a heat dissipation system. The cabinet includes: an operating compartment, disposed on one side of a heat dissipation substrate, where the operating compartment is configured to accommodate a server; and a heat dissipation compartment, disposed on the other side of the heat dissipation substrate. Both the heat dissipation compartment and the operating compartment share the heat dissipation substrate as a compartment wall. The operating compartment is separated from the heat dissipation compartment by using the heat dissipation substrate. The heat dissipation compartment accommodates multiple heat dissipation fins, and the multiple heat dissipation fins are connected to the heat dissipation substrate. An air intake vent is disposed in a first compartment wall of the heat dissipation compartment, and an air exhaust vent is disposed in a second compartment wall of the heat dissipation compartment disclosure.

4. 发明申请

US20170196124A1 Heat-Pipe Heat Dissipation System and Power Device 审中-公开
公开(公告)号：US20170196124A1
公开(公告)日：2017-07-06
申请号：US15468859
申请日：2017-03-24
申请人： Huawei Technologies Co., Ltd.
发明人： Yaofeng Peng , Zhijian Li , Honghui Liu , Shanjiu Chi
IPC分类号： H05K7/20 , F28D15/04 , F28D15/02
CPC分类号： H05K7/20681 , F28D15/0266 , F28D15/04 , H05K7/20327 , H05K7/20336 , H05K7/20381 , H05K7/20672 , H05K7/20809
摘要： A system, including a first pipeline and a second pipeline, where the first pipeline includes a first steam pipe, a first liquid pipe, and an evaporation section connected between the first steam pipe and the first liquid pipe, and the second pipeline includes a second steam pipe, a second liquid pipe, and a heat exchanger connected between the second steam pipe and the second liquid pipe. Two pairs of quick connectors are respectively connected between the first steam pipe and the second steam pipe and between the first liquid pipe and the second liquid pipe. The loop heat pipe includes a valve and a nozzle that are configured for vacuum pumping. Refrigerant is provided inside the loop heat pipe. A capillary structure is provided inside the evaporation section to provide a capillary suction force to enable the refrigerant to circulate in the loop heat pipe.

5. 发明授权

US11502019B2 Heat sink, heat dissipation apparatus, heat dissipation system, and communications device 有权
公开(公告)号：US11502019B2
公开(公告)日：2022-11-15
申请号：US17320533
申请日：2021-05-14
申请人： HUAWEI TECHNOLOGIES CO., LTD.
发明人： Shoubiao Xu , Shanjiu Chi , Wenhui Zeng
IPC分类号： H01L23/00 , H01L23/40 , H01L23/467 , H01L23/427 , H05K7/20 , F28F3/06
摘要： One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board. A first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip. Different heat conduction surfaces correspond to different chips.

6. 发明申请

US20210051818A1 HEAT DISSIPATION APPARATUS AND SERVER 有权
公开(公告)号：US20210051818A1
公开(公告)日：2021-02-18
申请号：US17089089
申请日：2020-11-04
申请人： HUAWEI TECHNOLOGIES CO., LTD.
发明人： Lei Cao , Shoubiao Xu , Shanjiu Chi
IPC分类号： H05K7/20 , G06F1/20
摘要： A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.

7. 发明授权

US09917029B2 Heat dissipater for main heat generating device with peripheral heat generating devices 有权
公开(公告)号：US09917029B2
公开(公告)日：2018-03-13
申请号：US14081288
申请日：2013-11-15
申请人： Huawei Technologies Co., Ltd.
发明人： Zhenzhen Liu , Xiaojing Hou , Shanjiu Chi
IPC分类号： F28F7/00 , H01L23/367 , H01L23/36 , H01L23/40 , H01L23/427
CPC分类号： H01L23/3672 , H01L23/36 , H01L23/40 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of the present invention provide a heat dissipater and relate to the communications field. The heat dissipater includes a sub heat dissipater, a connecting apparatus, and a shared bracket; the sub heat dissipater is connected to the shared bracket through the connecting apparatus; the sub heat dissipater includes a first heat conducting surface, and the sub heat dissipater contacts a first heat source through the first heat conducting surface to dissipate heat for the first heat source; the shared bracket includes a second heat conducting surface, and the shared bracket contacts a second heat source through the second heat conducting surface to dissipate heat for the second heat source; and the second heat conducting surface and the sub heat dissipater are disposed in different positions of the shared bracket respectively.

8. 发明授权

US11490545B2 Heat dissipation apparatus and server 有权
公开(公告)号：US11490545B2
公开(公告)日：2022-11-01
申请号：US17089089
申请日：2020-11-04
申请人： HUAWEI TECHNOLOGIES CO., LTD.
发明人： Lei Cao , Shoubiao Xu , Shanjiu Chi
IPC分类号： H05K7/20 , G06F1/20
摘要： A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.

9. 发明授权

US10470339B2 Heat-pipe heat dissipation system and power device 有权
公开(公告)号：US10470339B2
公开(公告)日：2019-11-05
申请号：US15468859
申请日：2017-03-24
申请人： Huawei Technologies Co., Ltd.
发明人： Yaofeng Peng , Zhijian Li , Honghui Liu , Shanjiu Chi
IPC分类号： H05K7/20 , F28D15/02 , F28D15/04
摘要： A system, including a first pipeline and a second pipeline, where the first pipeline includes a first steam pipe, a first liquid pipe, and an evaporation section connected between the first steam pipe and the first liquid pipe, and the second pipeline includes a second steam pipe, a second liquid pipe, and a heat exchanger connected between the second steam pipe and the second liquid pipe. Two pairs of quick connectors are respectively connected between the first steam pipe and the second steam pipe and between the first liquid pipe and the second liquid pipe. The loop heat pipe includes a valve and a nozzle that are configured for vacuum pumping. Refrigerant is provided inside the loop heat pipe. A capillary structure is provided inside the evaporation section to provide a capillary suction force to enable the refrigerant to circulate in the loop heat pipe.

10. 发明申请

US20180042141A1 Cabinet and Heat Dissipation System 审中-公开
公开(公告)号：US20180042141A1
公开(公告)日：2018-02-08
申请号：US15785159
申请日：2017-10-16
申请人： Huawei Technologies Co., Ltd.
发明人： Zhongjiang Qu , Shanjiu Chi , Yangfan Zhong , Jin Wang
IPC分类号： H05K7/20 , H05K7/14
CPC分类号： H05K7/20736 , H05K7/1489 , H05K7/20145 , H05K7/20172 , H05K7/20181 , H05K7/20336 , H05K7/20409 , H05K7/20745 , H05K7/20818
摘要： The present disclosure provides a cabinet and a heat dissipation system. The cabinet includes: an operating compartment, disposed on one side of a heat dissipation substrate, where the operating compartment is configured to accommodate a server; and a heat dissipation compartment, disposed on the other side of the heat dissipation substrate. Both the heat dissipation compartment and the operating compartment share the heat dissipation substrate as a compartment wall. The operating compartment is separated from the heat dissipation compartment by using the heat dissipation substrate. The heat dissipation compartment accommodates multiple heat dissipation fins, and the multiple heat dissipation fins are connected to the heat dissipation substrate. An air intake vent is disposed in a first compartment wall of the heat dissipation compartment, and an air exhaust vent is disposed in a second compartment wall of the heat dissipation compartment disclosure.

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