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1. 发明授权

US08785953B2 Light emitting diode, manufacturing method thereof, light emitting diode module, and manufacturing method thereof 有权
标题翻译：发光二极管及其制造方法，发光二极管模块及其制造方法
公开(公告)号：US08785953B2
公开(公告)日：2014-07-22
申请号：US13428726
申请日：2012-03-23
申请人： Hak Hwan Kim , Min Jung Kim , Kyung Mi Moon , Jong Sup Song , Jae Sung You , Ill Heoung Choi , Cheol Jun Yoo
发明人： Hak Hwan Kim , Min Jung Kim , Kyung Mi Moon , Jong Sup Song , Jae Sung You , Ill Heoung Choi , Cheol Jun Yoo
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L21/568 , H01L33/505 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/73265 , H01L2224/73267 , H01L2224/92144 , H01L2224/97 , H01L2924/15153 , H01L2933/0041 , H01L2924/00014 , H01L2224/83
摘要： A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.
摘要翻译：提供了一种发光二极管（LED）的制造方法和LED模块的制造方法。 LED的制造方法可以包括制造多个LED芯片，制造包括多个用于安装多个LED芯片的多个安装区域的荧光体预成型件，在磷光体预成型件内部施加粘合剂，安装多个LED芯片的多个安装区域中的每一个中的LED芯片，并且将安装有多个LED芯片的荧光体预成型件切割成包括各个LED芯片的单元。

2. 发明授权

US08960984B2 Backlight unit including COB type light emitting diode module 有权
标题翻译：背光单元包括COB型发光二极管模块
公开(公告)号：US08960984B2
公开(公告)日：2015-02-24
申请号：US13594014
申请日：2012-08-24
申请人： Kyung Mi Moon , Hak Hwan Kim
发明人： Kyung Mi Moon , Hak Hwan Kim
IPC分类号： F21V8/00 , G02F1/1335 , H01L33/58
CPC分类号： G02B6/0021 , G02F1/133615 , H01L33/58
摘要： A backlight unit (BLU) is disclosed. The BLU may include a light emitting diode (LED) module including at least one LED chip mounted on a substrate in a chip-on-board (COB) type, and a light guide panel including an incidence surface configured to receive light emitted from an emission surface of the LED chip and to include at least one insertion recess disposed corresponding to the LED chip, such that the LED chip is bonded to the LED module to be inserted in the insertion recess.
摘要翻译：公开了一种背光单元（BLU）。 BLU可以包括发光二极管（LED）模块，其包括安装在基板上（COB）类型的基板上的至少一个LED芯片，以及导光板，其包括入射表面，该入射表面被配置为接收从并且包括与LED芯片相对设置的至少一个插入凹槽，使得LED芯片被结合到LED模块以插入插入凹部中。

3. 发明申请

US20130092962A1 LIGHT EMITTING DEVICE (LED), MANUFACTURING METHOD THEREOF, AND LED MODULE USING THE SAME 审中-公开
标题翻译：发光装置（LED）及其制造方法及其使用的LED模块
公开(公告)号：US20130092962A1
公开(公告)日：2013-04-18
申请号：US13655100
申请日：2012-10-18
申请人： Ho Sun Paek , Hak Hwan Kim , Ill Heung Choi , Kyung Mi Moon
发明人： Ho Sun Paek , Hak Hwan Kim , Ill Heung Choi , Kyung Mi Moon
IPC分类号： H01L33/08 , H01L33/62
CPC分类号： H01L33/62 , H01L33/44 , H01L2224/16225
摘要： A light emitting device (LED), a manufacturing method thereof, and an LED module using the same. The LED may include a first semiconductor layer, an active layer, and a second semiconductor layer formed sequentially on a light-transmitting substrate, a first electrode formed in a region exposed by removing a part of the first semiconductor layer, a second electrode formed on the second semiconductor layer, a passivation layer formed on the first electrode and the second electrode to expose a region of the first electrode and a region of the second electrode, a first bump formed in a first region including the first electrode exposed through the passivation layer, and extended to another region of the second electrode on which the passivation layer is formed, and a second bump formed in a second region including the second electrode exposed through the passivation layer.
摘要翻译：发光装置（LED）及其制造方法以及使用其的LED模块。 LED可以包括在透光性基板上依次形成的第一半导体层，有源层和第二半导体层，形成在通过去除第一半导体层的一部分而露出的区域中的第一电极，形成在所述第二半导体层，形成在所述第一电极和所述第二电极上以钝化所述第一电极的区域和所述第二电极的区域的钝化层，形成在包括通过所述钝化层暴露的所述第一电极的第一区域中的第一凸起并且延伸到其上形成有钝化层的第二电极的另一区域，以及形成在包括通过钝化层暴露的第二电极的第二区域中的第二凸块。

4. 发明申请

US20120211780A1 LED PACKAGE MODULE 有权
标题翻译： LED封装模块
公开(公告)号：US20120211780A1
公开(公告)日：2012-08-23
申请号：US13404924
申请日：2012-02-24
申请人： Suk Ho Jung , Hyung Kun Kim , Hak Hwan Kim , Young Jin Lee , Ho Sun Paek
发明人： Suk Ho Jung , Hyung Kun Kim , Hak Hwan Kim , Young Jin Lee , Ho Sun Paek
IPC分类号： H01L33/50
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/504 , H01L33/508 , H01L2224/48091 , H01L2224/48235 , H01L2924/00014
摘要： An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion.
摘要翻译：根据本发明的一个方面的LED封装模块可以包括：其上具有预定电极的基板; 安装在基板上的多个LED芯片，以预定间隔彼此分开，并与电极电连接; 围绕所述多个LED芯片中的至少一个模制的第一颜色树脂部分; 围绕除了第一着色树脂部分成型的LED芯片之外的所有LED芯片的第二颜色树脂部分模制，并且具有与第一着色树脂部分不同的颜色; 以及第三颜色树脂部分，其包围第一着色树脂部分和第二颜色树脂部分，并且具有与第一着色树脂部分和第二着色树脂部分不同的颜色。

5. 发明申请

US20080035951A1 Selective growth method, nitride semiconductor light emitting device and manufacturing method of the same 有权
标题翻译：选择性生长方法，氮化物半导体发光器件及其制造方法
公开(公告)号：US20080035951A1
公开(公告)日：2008-02-14
申请号：US11822185
申请日：2007-07-03
申请人： Hee Seok Park , Gil Han Park , Sang Duk Yoo , Young Min Park , Hak Hwan Kim , Seon Young Myoung , Sang Bum Lee , Ki Tae Park , Myoung Sik Jung , Kyeong Ik Min
发明人： Hee Seok Park , Gil Han Park , Sang Duk Yoo , Young Min Park , Hak Hwan Kim , Seon Young Myoung , Sang Bum Lee , Ki Tae Park , Myoung Sik Jung , Kyeong Ik Min
IPC分类号： H01L29/24 , H01L21/36 , H01L33/00
CPC分类号： C30B25/04 , C30B25/02 , C30B29/406 , H01L21/0237 , H01L21/02458 , H01L21/0254 , H01L21/02639 , H01L21/02647 , H01L33/007 , H01L33/24
摘要： A method for selectively growing a nitride semiconductor, in which a mask is formed, with an opening formed therein, on a nitride semiconductor layer. A nitride semiconductor crystal is selectively grown on a portion of the nitride semiconductor layer exposed through the opening in the mask, the nitride semiconductor crystal shaped as a hexagonal pyramid and having crystal planes inclined with respect to a top surface of the nitride semiconductor. Here, the nitride semiconductor crystal has at least one intermediate stress-relieving area having crystal planes inclined at a greater angle than those of upper and lower areas of the nitride semiconductor crystal, the intermediate stress-relieving area relieving stress which occurs from continuity in the inclined crystal planes.
摘要翻译：一种在氮化物半导体层上选择性地生长其中形成掩模的氮化物半导体，其中形成有开口的方法。氮化物半导体晶体选择性地生长在通过掩模中的开口暴露的氮化物半导体层的一部分上，氮化物半导体晶体形状为六角锥，并具有相对于氮化物半导体的顶表面倾斜的晶面。这里，氮化物半导体晶体具有至少一个具有比氮化物半导体晶体的上部和下部区域倾斜角度大的晶面的中间应力消除区域，由中间应力消除区域的连续性产生的中间应力消除面积减轻应力斜晶面。

6. 发明申请

US20120205697A1 FLIP CHIP LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译： FLIP芯片发光器件封装及其制造方法
公开(公告)号：US20120205697A1
公开(公告)日：2012-08-16
申请号：US13362677
申请日：2012-01-31
申请人： Kwon Joong KIM , Ho Sun Paek , Hak Hwan Kim
发明人： Kwon Joong KIM , Ho Sun Paek , Hak Hwan Kim
IPC分类号： H01L33/48 , H01L33/32
CPC分类号： H01L33/486 , H01L33/36 , H01L33/62 , H01L2224/16245 , H01L2933/0016
摘要： A flip chip light emitting device (LED) package and a manufacturing method thereof are provided. The flip chip LED package includes a package substrate including a cavity that exposes a circuit pattern, and a chip mounting portion disposed on a bottom surface of the cavity; a solder layer disposed on the circuit pattern; a bonding tape layer disposed on the chip mounting portion; and an LED including a bonding object region and a plurality of electrode pads disposed on one surface, being mounted on the package substrate such that the plurality of electrode pads are bonded to the solder layer and the bonding object region is bonded to the bonding tape layer
摘要翻译：提供了一种倒装芯片发光器件（LED）封装及其制造方法。倒装芯片LED封装包括包括暴露电路图案的空腔的封装基板和设置在空腔的底表面上的芯片安装部分; 设置在电路图案上的焊料层; 粘合带层，设置在所述芯片安装部分上; 以及包括粘合对象区域和设置在一个表面上的多个电极焊盘的LED，安装在封装基板上，使得多个电极焊盘接合到焊料层，并且焊接对象区域接合到接合带层

7. 发明授权

US08183583B2 LED package module 有权
标题翻译： LED封装模块
公开(公告)号：US08183583B2
公开(公告)日：2012-05-22
申请号：US12571754
申请日：2009-10-01
申请人： Suk Ho Jung , Hyung Kun Kim , Hak Hwan Kim , Young Jin Lee , Ho Sun Paek
发明人： Suk Ho Jung , Hyung Kun Kim , Hak Hwan Kim , Young Jin Lee , Ho Sun Paek
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/504 , H01L33/508 , H01L2224/48091 , H01L2224/48235 , H01L2924/00014
摘要： An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion. Accordingly, a reduction in luminous efficiency of an LED caused by yellowing is prevented to thereby increase luminous efficiency and achieve a reduction in size.
摘要翻译：根据本发明的一个方面的LED封装模块可以包括：其上具有预定电极的基板; 安装在基板上的多个LED芯片，以预定间隔彼此分开，并与电极电连接; 围绕所述多个LED芯片中的至少一个模制的第一颜色树脂部分; 围绕除了第一着色树脂部分成型的LED芯片之外的所有LED芯片的第二颜色树脂部分模制，并且具有与第一着色树脂部分不同的颜色; 以及第三颜色树脂部分，其包围第一着色树脂部分和第二颜色树脂部分，并且具有与第一着色树脂部分和第二着色树脂部分不同的颜色。因此，防止由黄化引起的LED的发光效率的降低，从而提高发光效率并实现尺寸的减小。

8. 发明申请

US20100051985A1 LED PACKAGE 有权
标题翻译： LED封装
公开(公告)号：US20100051985A1
公开(公告)日：2010-03-04
申请号：US12255469
申请日：2008-10-21
申请人： Hyung Kun KIM , Ho Sun Paek , Suk Ho Jung , Hak Hwan Kim , Young Jin Lee
发明人： Hyung Kun KIM , Ho Sun Paek , Suk Ho Jung , Hak Hwan Kim , Young Jin Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , F21K9/00 , H01L2224/48091 , H01L2924/00014
摘要： The present invention provides an LED package including: a heat discharge body provided with a plurality of radially protruding heat discharge fins at an outer circumferential surface and molding material filled spaces between the heat discharge fins; a package body which is received on a top surface of the heat discharge body and has a cavity; a pair of lead frames extended from upper parts of the heat discharge body to both sides thereof; and an LED chip mounted inside the cavity.
摘要翻译：本发明提供一种LED封装体，其特征在于，包括：散热体，其在外周面设置有多个径向突出的散热片，在所述散热片之间填充空间的成型材料; 封装体，其被容纳在所述散热体的顶面上并具有空腔; 一对引线框架从散热体的上部延伸到其两侧; 以及安装在腔内的LED芯片。

9. 发明授权

US08344399B2 LED package with wide emission range and effective heat dissipation 有权
标题翻译： LED封装，发射范围广，散热有效
公开(公告)号：US08344399B2
公开(公告)日：2013-01-01
申请号：US12630477
申请日：2009-12-03
申请人： Hak Hwan Kim , Sung Kyong Oh , Soo Jin Jung , Hyung Kun Kim
发明人： Hak Hwan Kim , Sung Kyong Oh , Soo Jin Jung , Hyung Kun Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/60 , H01L33/642 , H01L2224/48091 , H01L2224/8592 , H01L2924/00014
摘要： There is provided an LED package including: a body unit; an LED chip mounted onto the body unit; lead frames mounted onto the body unit and electrically connected to the LED chip; and a reflection unit having a cavity to receive the LED chip therein and reflecting light emitted from the LED chip to the outside. Here, the reflection unit has a curved cross-section.
摘要翻译：提供了一种LED封装，包括：主体单元; 安装在身体单元上的LED芯片; 引线框架安装在主体单元上并电连接到LED芯片; 以及反射单元，其具有用于在其中接收LED芯片并将从LED芯片发射的光反射到外部的空腔。这里，反射单元具有弯曲的横截面。

10. 发明授权

US08076692B2 LED package 有权
标题翻译： LED封装
公开(公告)号：US08076692B2
公开(公告)日：2011-12-13
申请号：US12255469
申请日：2008-10-21
申请人： Hyung Kun Kim , Ho Sun Paek , Suk Ho Jung , Hak Hwan Kim , Young Jin Lee
发明人： Hyung Kun Kim , Ho Sun Paek , Suk Ho Jung , Hak Hwan Kim , Young Jin Lee
IPC分类号： H01L33/00 , H01L23/34
CPC分类号： H01L33/642 , F21K9/00 , H01L2224/48091 , H01L2924/00014
摘要： The present invention provides an LED package including: a heat discharge body provided with a plurality of radially protruding heat discharge fins at an outer circumferential surface and molding material filled spaces between the heat discharge fins; a package body which is received on a top surface of the heat discharge body and has a cavity; a pair of lead frames extended from upper parts of the heat discharge body to both sides thereof; and an LED chip mounted inside the cavity.
摘要翻译：本发明提供一种LED封装体，其特征在于，包括：散热体，其在外周面设置有多个径向突出的散热片，在所述散热片之间填充空间的成型材料; 封装体，其被容纳在所述散热体的顶面上并具有空腔; 一对引线框架从散热体的上部延伸到其两侧; 以及安装在腔内的LED芯片。

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