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1. 发明授权

US07679189B2 Display device and manufacturing method of the same 有权
标题翻译：显示装置及其制造方法相同
公开(公告)号：US07679189B2
公开(公告)日：2010-03-16
申请号：US11600091
申请日：2006-11-16
申请人： Hideaki Abe , Makoto Sato , Mitsuru Goto
发明人： Hideaki Abe , Makoto Sato , Mitsuru Goto
IPC分类号： H01L23/48
CPC分类号： H01L24/12 , G02F1/13452 , H01L23/544 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/17 , H01L24/29 , H01L24/83 , H01L2223/5442 , H01L2223/54473 , H01L2223/5448 , H01L2224/0401 , H01L2224/05001 , H01L2224/0554 , H01L2224/05553 , H01L2224/05555 , H01L2224/1147 , H01L2224/13016 , H01L2224/13019 , H01L2224/13099 , H01L2224/13144 , H01L2224/2929 , H01L2224/293 , H01L2224/8113 , H01L2224/81132 , H01L2224/81136 , H01L2224/81903 , H01L2224/838 , H01L2224/83851 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0781 , H01L2924/07811 , H01L2924/12044 , H01L2924/181 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00
摘要： A display device includes a drive circuit chip, and a substrate on which the drive circuit chip is mounted. The drive circuit chip includes a semiconductor substrate, an insulation layer, a first conductive layer and a second conductive layer formed of metal between the semiconductor substrate and the insulation layer, and a first bump and a second bump formed over the insulation layer. The first bump is superposed with the first conductive layer, and a profile of the first bump in plan view is within a profile of the first conductive layer in plan view. The second bump is superposed with the second conductive layer, and a profile of the second pump in plan view is beyond a profile of the second conductive layer in plan view.
摘要翻译：显示装置包括驱动电路芯片和安装驱动电路芯片的基板。驱动电路芯片包括半导体衬底和绝缘层之间的半导体衬底，绝缘层，第一导电层和由金属形成的第二导电层，以及形成在绝缘层上的第一凸起和第二凸起。第一凸起与第一导电层重叠，并且平面图中的第一凸块的轮廓在平面图中位于第一导电层的轮廓内。第二凸起与第二导电层重叠，并且平面图中的第二泵的轮廓在平面图中超过第二导电层的轮廓。

2. 发明申请

US20050242436A1 Display device and manufacturing method of the same 有权
标题翻译：显示装置及其制造方法相同
公开(公告)号：US20050242436A1
公开(公告)日：2005-11-03
申请号：US11103493
申请日：2005-04-12
申请人： Hideaki Abe , Makoto Sato , Mitsuru Goto
发明人： Hideaki Abe , Makoto Sato , Mitsuru Goto
IPC分类号： H01L21/60 , G02F1/13 , G02F1/133 , G09F9/00 , G09G3/36 , H01L21/44 , H01L23/48 , H01L23/485 , H01L23/544
CPC分类号： H01L24/12 , G02F1/13452 , H01L23/544 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/17 , H01L24/29 , H01L24/83 , H01L2223/5442 , H01L2223/54473 , H01L2223/5448 , H01L2224/0401 , H01L2224/05001 , H01L2224/0554 , H01L2224/05553 , H01L2224/05555 , H01L2224/1147 , H01L2224/13016 , H01L2224/13019 , H01L2224/13099 , H01L2224/13144 , H01L2224/2929 , H01L2224/293 , H01L2224/8113 , H01L2224/81132 , H01L2224/81136 , H01L2224/81903 , H01L2224/838 , H01L2224/83851 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0781 , H01L2924/07811 , H01L2924/12044 , H01L2924/181 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00
摘要： The present invention enhances the mounting accuracy of a drive circuit chip on a substrate thus realizing a display of high quality. Bumps (for example, gold bumps) on the drive circuit chip are used for alignment. Here, to enhance the recognition property of the alignment bumps, a plane shape of a conductive layer which is formed between a semiconductor substrate (Si substrate) of the drive circuit chip and the alignment bump is set to be included within a profile of a plane shape of the alignment bump. That is, by preventing the conductive layer from being observed in a periphery of the alignment bump, it is possible to prevent a photographed pattern of the bump taken by a camera or the like from be influenced by the conductive layer.
摘要翻译：本发明提高了驱动电路芯片在基板上的安装精度，从而实现了高质量的显示。驱动电路芯片上的碰撞（例如，金凸块）用于对准。这里，为了提高取向凸块的识别特性，形成在驱动电路芯片的半导体基板（Si基板）和对准凸块之间的导电层的平面形状被设置为包括在平面的轮廓内对准凸块的形状。也就是说，通过防止在对准突起的周围观察导电层，可以防止由照相机等拍摄的凸块的拍摄图案受到导电层的影响。

3. 发明授权

US07141877B2 Display device and manufacturing method of the same 有权
标题翻译：显示装置及其制造方法相同
公开(公告)号：US07141877B2
公开(公告)日：2006-11-28
申请号：US11103493
申请日：2005-04-12
申请人： Hideaki Abe , Makoto Sato , Mitsuru Goto
发明人： Hideaki Abe , Makoto Sato , Mitsuru Goto
IPC分类号： H01L23/48 , G02F1/1345
CPC分类号： H01L24/12 , G02F1/13452 , H01L23/544 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/17 , H01L24/29 , H01L24/83 , H01L2223/5442 , H01L2223/54473 , H01L2223/5448 , H01L2224/0401 , H01L2224/05001 , H01L2224/0554 , H01L2224/05553 , H01L2224/05555 , H01L2224/1147 , H01L2224/13016 , H01L2224/13019 , H01L2224/13099 , H01L2224/13144 , H01L2224/2929 , H01L2224/293 , H01L2224/8113 , H01L2224/81132 , H01L2224/81136 , H01L2224/81903 , H01L2224/838 , H01L2224/83851 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0781 , H01L2924/07811 , H01L2924/12044 , H01L2924/181 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00
摘要： The present invention enhances the mounting accuracy of a drive circuit chip on a substrate thus realizing a display of high quality. Bumps (for example, gold bumps) on the drive circuit chip are used for alignment. Here, to enhance the recognition property of the alignment bumps, a plane shape of a conductive layer which is formed between a semiconductor substrate (Si substrate) of the drive circuit chip and the alignment bump is set to be included within a profile of a plane shape of the alignment bump. That is, by preventing the conductive layer from being observed in a periphery of the alignment bump, it is possible to prevent a photographed pattern of the bump taken by a camera or the like from be influenced by the conductive layer.
摘要翻译：本发明提高了驱动电路芯片在基板上的安装精度，从而实现了高质量的显示。驱动电路芯片上的碰撞（例如，金凸块）用于对准。这里，为了提高取向凸块的识别特性，形成在驱动电路芯片的半导体基板（Si基板）和对准凸块之间的导电层的平面形状被设置为包括在平面的轮廓内对准凸块的形状。也就是说，通过防止在对准突起的周围观察导电层，可以防止由照相机等拍摄的凸块的拍摄图案受到导电层的影响。

4. 发明授权

US07948080B2 Display device and manufacturing method of the same 有权
标题翻译：显示装置及其制造方法相同
公开(公告)号：US07948080B2
公开(公告)日：2011-05-24
申请号：US12502379
申请日：2009-07-14
申请人： Hideaki Abe , Makoto Sato , Mitsuru Goto
发明人： Hideaki Abe , Makoto Sato , Mitsuru Goto
IPC分类号： H01L23/48
CPC分类号： H01L24/12 , G02F1/13452 , H01L23/544 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/17 , H01L24/29 , H01L24/83 , H01L2223/5442 , H01L2223/54473 , H01L2223/5448 , H01L2224/0401 , H01L2224/05001 , H01L2224/0554 , H01L2224/05553 , H01L2224/05555 , H01L2224/1147 , H01L2224/13016 , H01L2224/13019 , H01L2224/13099 , H01L2224/13144 , H01L2224/2929 , H01L2224/293 , H01L2224/8113 , H01L2224/81132 , H01L2224/81136 , H01L2224/81903 , H01L2224/838 , H01L2224/83851 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0781 , H01L2924/07811 , H01L2924/12044 , H01L2924/181 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00
摘要： A display device includes a drive circuit chip, and a substrate on which the drive circuit chip is mounted. The drive circuit chip includes a semiconductor substrate, an insulation layer, a first conductive layer and a second conductive layer formed of metal between the semiconductor substrate and the insulation layer, and a first bump and a second bump formed over the insulation layer. The first bump is superposed with the first conductive layer, and a profile of the first bump in plan view is within a profile of the first conductive layer in plan view. The second bump is superposed with the second conductive layer, and a profile of the second pump in plan view is beyond a profile of the second conductive layer in plan view.
摘要翻译：显示装置包括驱动电路芯片和安装驱动电路芯片的基板。驱动电路芯片包括半导体衬底和绝缘层之间的半导体衬底，绝缘层，第一导电层和由金属形成的第二导电层，以及形成在绝缘层上的第一凸起和第二凸起。第一凸起与第一导电层重叠，并且平面图中的第一凸块的轮廓在平面图中位于第一导电层的轮廓内。第二凸起与第二导电层重叠，并且平面图中的第二泵的轮廓在平面图中超过第二导电层的轮廓。

5. 发明申请

US20090273080A1 DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME 有权
标题翻译：其显示装置及其制造方法
公开(公告)号：US20090273080A1
公开(公告)日：2009-11-05
申请号：US12502379
申请日：2009-07-14
申请人： Hideaki ABE , Makoto Sato , Mitsuru Goto
发明人： Hideaki ABE , Makoto Sato , Mitsuru Goto
IPC分类号： H01L23/498
CPC分类号： H01L24/12 , G02F1/13452 , H01L23/544 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/17 , H01L24/29 , H01L24/83 , H01L2223/5442 , H01L2223/54473 , H01L2223/5448 , H01L2224/0401 , H01L2224/05001 , H01L2224/0554 , H01L2224/05553 , H01L2224/05555 , H01L2224/1147 , H01L2224/13016 , H01L2224/13019 , H01L2224/13099 , H01L2224/13144 , H01L2224/2929 , H01L2224/293 , H01L2224/8113 , H01L2224/81132 , H01L2224/81136 , H01L2224/81903 , H01L2224/838 , H01L2224/83851 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0781 , H01L2924/07811 , H01L2924/12044 , H01L2924/181 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00
摘要： A display device includes a drive circuit chip, and a substrate on which the drive circuit chip is mounted. The drive circuit chip includes a semiconductor substrate, an insulation layer, a first conductive layer and a second conductive layer formed of metal between the semiconductor substrate and the insulation layer, and a first bump and a second bump formed over the insulation layer. The first bump is superposed with the first conductive layer, and a profile of the first bump in plan view is within a profile of the first conductive layer in plan view. The second bump is superposed with the second conductive layer, and a profile of the second pump in plan view is beyond a profile of the second conductive layer in plan view.
摘要翻译：显示装置包括驱动电路芯片和安装驱动电路芯片的基板。驱动电路芯片包括半导体衬底和绝缘层之间的半导体衬底，绝缘层，第一导电层和由金属形成的第二导电层，以及形成在绝缘层上的第一凸起和第二凸起。第一凸起与第一导电层重叠，并且平面图中的第一凸块的轮廓在平面图中位于第一导电层的轮廓内。第二凸起与第二导电层重叠，并且平面图中的第二泵的轮廓在平面图中超过第二导电层的轮廓。

6. 发明申请

US20070063346A1 Display device and manufacturing method of the same 有权
标题翻译：显示装置及其制造方法相同
公开(公告)号：US20070063346A1
公开(公告)日：2007-03-22
申请号：US11600091
申请日：2006-11-16
申请人： Hideaki Abe , Makoto Sato , Mitsuru Goto
发明人： Hideaki Abe , Makoto Sato , Mitsuru Goto
IPC分类号： H01L23/48
CPC分类号： H01L24/12 , G02F1/13452 , H01L23/544 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/17 , H01L24/29 , H01L24/83 , H01L2223/5442 , H01L2223/54473 , H01L2223/5448 , H01L2224/0401 , H01L2224/05001 , H01L2224/0554 , H01L2224/05553 , H01L2224/05555 , H01L2224/1147 , H01L2224/13016 , H01L2224/13019 , H01L2224/13099 , H01L2224/13144 , H01L2224/2929 , H01L2224/293 , H01L2224/8113 , H01L2224/81132 , H01L2224/81136 , H01L2224/81903 , H01L2224/838 , H01L2224/83851 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0781 , H01L2924/07811 , H01L2924/12044 , H01L2924/181 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00
摘要： A display device includes a drive circuit chip, and a substrate on which the drive circuit chip is mounted. The drive circuit chip includes a semiconductor substrate, an insulation layer, a first conductive layer and a second conductive layer formed of metal between the semiconductor substrate and the insulation layer, and a first bump and a second bump formed over the insulation layer. The first bump is superposed with the first conductive layer, and a profile of the first bump in plan view is within a profile of the first conductive layer in plan view. The second bump is superposed with the second conductive layer, and a profile of the second pump in plan view is beyond a profile of the second conductive layer in plan view.
摘要翻译：显示装置包括驱动电路芯片和安装驱动电路芯片的基板。驱动电路芯片包括半导体衬底和绝缘层之间的半导体衬底，绝缘层，第一导电层和由金属形成的第二导电层，以及形成在绝缘层上的第一凸起和第二凸起。第一凸起与第一导电层重叠，并且平面图中的第一凸块的轮廓在平面图中位于第一导电层的轮廓内。第二凸起与第二导电层重叠，并且平面图中的第二泵的轮廓在平面图中超过第二导电层的轮廓。

7. 发明授权

US09625037B2 Sealing system for slide out rooms 有权
公开(公告)号：US09625037B2
公开(公告)日：2017-04-18
申请号：US14726042
申请日：2015-05-29
申请人： Raymond Young , Marc Maloney , Roger Brown , Makoto Sato
发明人： Raymond Young , Marc Maloney , Roger Brown , Makoto Sato
IPC分类号： F16J15/02 , B65H45/02 , B60J10/00 , B60P3/34
CPC分类号： F16J15/027 , B60J10/00 , B60P3/34 , B65H45/02
摘要： A seal useful in sealing slide out rooms used in recreational vehicles. The seal may be used singularly or in pairs to straddle a wall through which the opening is located. A bulb is attached to the base in a cantilevered manner over the base. The bulb has an outer arcuate portion that is integrally joined to opposing sidewall portions. The sidewall portions extend into an inner wall that defines an enclosed space within the bulb portion. The bulb portion may also have a protrusion that can touch the base. A wiper extends from the base substantially co-linearly to the base and opposite the offsetting member. A locating leg extending from the base is movable between a first position and a second position. The first position has the locating leg perpendicular to the base and the second position places the locating leg parallel to the base.

8. 发明授权

US09245659B2 X-ray imaging apparatus 有权
公开(公告)号：US09245659B2
公开(公告)日：2016-01-26
申请号：US13937268
申请日：2013-07-09
申请人： Osamu Tsujii , Makoto Sato , Masahiko Okunuki , Satoshi Shimizu , Takashi Ogura
发明人： Osamu Tsujii , Makoto Sato , Masahiko Okunuki , Satoshi Shimizu , Takashi Ogura
IPC分类号： G21K1/04 , A61B6/06 , A61B6/00
CPC分类号： G21K1/04 , A61B6/06 , A61B6/4007 , A61B6/4405 , A61B6/4441 , A61B6/587 , G21K1/046 , H01J2235/068
摘要： An X-ray imaging apparatus is provided with a multi X-ray source and a collimator in which a plurality of slits for X-rays to pass through are two-dimensionally formed, the size and position of the slits being adjustable. A control unit, as a first control mode, controls the size and position of the slits to move an examination region in parallel, when an X-ray source is changed to a different X-ray source, such that the examination directions are parallel before and after the change. Also, the control unit, as a second control mode, controls the size and position of the slits to rotate the examination direction, when an X-ray source is changed to a different X-ray source, such that the center of the examination regions is the same before and after the change.

9. 发明申请

US20140076647A1 MANNED VEHICLE CABIN STRUCTURE AND MANNED VEHICLE FOR SPECIAL ENVIRONMENT USE 有权
标题翻译：特殊环境使用的车辆客舱结构和车辆车辆
公开(公告)号：US20140076647A1
公开(公告)日：2014-03-20
申请号：US14009471
申请日：2012-01-27
申请人： Makoto Sato , Yujiro Sawasaki , Keiji Ito , Miyahito Hase , Hidehiko Makida , Makoto Morishima , Hiromasa Nishino , Yorikata Mizokami
发明人： Makoto Sato , Yujiro Sawasaki , Keiji Ito , Miyahito Hase , Hidehiko Makida , Makoto Morishima , Hiromasa Nishino , Yorikata Mizokami
IPC分类号： B66F9/075 , B62D33/06 , G21F3/00
CPC分类号： B62D33/06 , B62D33/0617 , B62D33/0621 , B66F9/07545 , B66F9/0759 , G21F3/00 , G21F5/14
摘要： A cabin 14 is formed as a casing body with a protection structure. The casing body is partitioned and separable from the vehicle body and has on a bottom side thereof support pillars 42 for secure attachment to the vehicle body 13 with restraint at least in planar coordinate directions.
摘要翻译：机舱14形成为具有保护结构的壳体。壳体主体被分隔并与车身分离，并且在其底侧具有支撑柱42，用于至少在平面坐标方向上以约束方式牢固地附接到车体13。

10. 发明授权

US08669584B2 Light emitting device including a case having an accommodating recession 有权
标题翻译：发光装置包括具有容纳凹陷的壳体
公开(公告)号：US08669584B2
公开(公告)日：2014-03-11
申请号：US13587699
申请日：2012-08-16
申请人： Makoto Sato , Satoshi Ota , Masakata Koseki
发明人： Makoto Sato , Satoshi Ota , Masakata Koseki
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L2933/0033
摘要： A light emitting device, comprises a LED chip, and a case having an accommodating recession accommodating the LED chip, wherein the light emitting device emits light from an opening portion of the accommodating recession, the case is monolithically formed by injection molding of a resin composition preparing by mixing fine grains of specular reflection material and glass fibers as diffusion reflecting material as fillers therein, an inner surface of a side wall portion of the case works as a reflector that reflects the light emitted from the LED chip so that the light is output from the opening portion, and a thickness of the side wall portion is selected to be smaller than an average length of the glass fibers.
摘要翻译：一种发光装置，包括LED芯片和具有容纳LED芯片的容纳凹部的壳体，其中，所述发光装置从所述容纳凹部的开口部发射光，所述壳体通过树脂组合物的注射成型通过将镜面反射材料和玻璃纤维的细晶粒作为扩散反射材料作为填料来制备，壳体的侧壁部分的内表面用作反射从LED芯片发射的光以使得光输出的反射器从所述开口部开始，所述侧壁部的厚度选择为小于所述玻璃纤维的平均长度。

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