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1. 发明申请

US20060113679A1 Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：US20060113679A1
公开(公告)日：2006-06-01
申请号：US11288007
申请日：2005-11-28
申请人： Hiroyuki Takatsu , Atsunori Kajiki , Takashi Tsubota , Norio Yamanishi , Sadakazu Akaike , Akinobu Inoue
发明人： Hiroyuki Takatsu , Atsunori Kajiki , Takashi Tsubota , Norio Yamanishi , Sadakazu Akaike , Akinobu Inoue
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L25/0657 , H01L24/16 , H01L24/73 , H01L25/16 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06541 , H01L2225/06555 , H01L2225/06575 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/09701 , H01L2924/15311 , H01L2924/19041 , H01L2924/19103 , H01L2924/19105 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor device includes a semiconductor chip, wirings, a substrate electrically connected to the semiconductor chip via the wirings and a plurality of discrete parts provided on a part of the substrate. The part is located closer to the center of the substrate than a wiring disposing area where the wirings are disposed.
摘要翻译：半导体器件包括半导体芯片，布线，经由布线电连接到半导体芯片的基板和设置在基板的一部分上的多个分立部件。该部分比布线布线布置区域更靠近基板的中心。

2. 发明申请

US20060125077A1 Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：US20060125077A1
公开(公告)日：2006-06-15
申请号：US11291599
申请日：2005-12-01
申请人： Sadakazu Akaike , Akinobu Inoue , Atsunori Kajiki , Hiroyuki Takatsu , Takashi Tsubota , Norio Yamanishi
发明人： Sadakazu Akaike , Akinobu Inoue , Atsunori Kajiki , Hiroyuki Takatsu , Takashi Tsubota , Norio Yamanishi
IPC分类号： H01L23/48
CPC分类号： H01L22/32 , H01L24/73 , H01L25/105 , H01L25/16 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01067 , H01L2924/01078 , H01L2924/15311 , H01L2924/15331 , H01L2924/19106 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor device is provided that includes a semiconductor chip, a substrate on which the semiconductor chip is mounted, a mounting terminal that is arranged on a first side of the substrate, and a testing terminal that is arranged on a second side of the substrate which second side is opposite the first side of the substrate.
摘要翻译：提供了一种半导体器件，其包括半导体芯片，其上安装有半导体芯片的衬底，布置在衬底的第一侧上的安装端子和布置在衬底的第二侧上的测试端子第二面与衬底的第一侧相对。

3. 发明申请

US20060113642A1 Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：US20060113642A1
公开(公告)日：2006-06-01
申请号：US11251347
申请日：2005-10-13
申请人： Atsunori Kajiki , Hiroyuki Takatsu , Takashi Tsubota , Norio Yamanishi , Sadakazu Akaike , Akinobu Inoue
发明人： Atsunori Kajiki , Hiroyuki Takatsu , Takashi Tsubota , Norio Yamanishi , Sadakazu Akaike , Akinobu Inoue
IPC分类号： H01L23/552
CPC分类号： H01L23/552 , H01L21/565 , H01L23/3121 , H01L23/50 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/165 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2924/16152 , H01L2924/16153 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H05K1/0218 , H05K3/284 , H05K3/321 , H05K2201/10371 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2924/00015 , H01L2224/05599
摘要： A semiconductor device is disclosed that includes a substrate, electronic components that are arranged at an electronic components mounting area of the substrate, a ground terminal that is arranged within the electronic components mounting area, transfer molded resin that covers the electronic components while exposing the ground terminal, a shield member that covers the electronic components and is connected to the ground terminal, and conductive adhesive that realizes electrical connection between the ground terminal and the shield member.
摘要翻译：公开了一种半导体器件，其包括基板，布置在基板的电子部件安装区域的电子部件，布置在电子部件安装区域内的接地端子，在暴露地面的同时覆盖电子部件的传递模塑树脂端子，覆盖电子元件并连接到接地端子的屏蔽构件，以及实现接地端子和屏蔽构件之间的电连接的导电粘合剂。

4. 发明授权

US07261596B2 Shielded semiconductor device 有权
标题翻译：屏蔽半导体器件
公开(公告)号：US07261596B2
公开(公告)日：2007-08-28
申请号：US11318674
申请日：2005-12-27
申请人： Sadakazu Akaike , Akinobu Inoue , Atsunori Kajiki , Hiroyuki Takatsu , Takashi Tsubota , Norio Yamanishi
发明人： Sadakazu Akaike , Akinobu Inoue , Atsunori Kajiki , Hiroyuki Takatsu , Takashi Tsubota , Norio Yamanishi
IPC分类号： H01R13/648
CPC分类号： H01L23/552 , H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/15321 , H01L2924/15331 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H01R12/7076 , H01R13/6585 , H01R13/6594 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device is disclosed that comprises a board, a ground terminal disposed on the board, a connection terminal disposed on the board, a semiconductor chip mounted on the board, and a shield member electrically connected to the ground terminal. The semiconductor chip, the ground terminal, and the connection terminal are disposed on one side of the board, and the shield member is disposed directly on and covers the other side of the board.
摘要翻译：公开了一种半导体器件，其包括板，设置在板上的接地端子，设置在板上的连接端子，安装在板上的半导体芯片以及电连接到接地端子的屏蔽构件。半导体芯片，接地端子和连接端子设置在电路板的一侧，屏蔽部件直接设置在电路板的另一面上。

5. 发明申请

US20060148317A1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US20060148317A1
公开(公告)日：2006-07-06
申请号：US11318674
申请日：2005-12-27
申请人： Sadakazu Akaike , Akinobu Inoue , Atsunori Kajiki , Hiroyuki Takatsu , Takashi Tsubota , Norio Yamanishi
发明人： Sadakazu Akaike , Akinobu Inoue , Atsunori Kajiki , Hiroyuki Takatsu , Takashi Tsubota , Norio Yamanishi
IPC分类号： H01R13/648
CPC分类号： H01L23/552 , H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/15321 , H01L2924/15331 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H01R12/7076 , H01R13/6585 , H01R13/6594 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device is disclosed that comprises a board, a ground terminal disposed on the board, a connection terminal disposed on the board, a semiconductor chip mounted on the board, and a shield member electrically connected to the ground terminal. The semiconductor chip, the ground terminal, and the connection terminal are disposed on one side of the board, and the shield member is disposed directly on and covers the other side of the board.
摘要翻译：公开了一种半导体器件，其包括板，设置在板上的接地端子，设置在板上的连接端子，安装在板上的半导体芯片以及电连接到接地端子的屏蔽构件。半导体芯片，接地端子和连接端子设置在电路板的一侧，屏蔽部件直接设置在电路板的另一面上。

6. 发明授权

US06721612B2 Method and system for installing program in parallel computer system 失效
标题翻译：在并行计算机系统中安装程序的方法和系统
公开(公告)号：US06721612B2
公开(公告)日：2004-04-13
申请号：US09791698
申请日：2001-02-26
申请人： Hiromitsu Aramaki , Hiroyuki Takatsu , Akio Tatsumi
发明人： Hiromitsu Aramaki , Hiroyuki Takatsu , Akio Tatsumi
IPC分类号： G05B1942
CPC分类号： G06F8/60 , G06F8/61 , Y10S707/99952
摘要： A distributing node initiates an install control program in receiving nodes, and then broadcasts or multicasts program data to the receiving nodes. Thereby, the installation of the program into the nodes is carried out in shorter time. In this event, the distributing node and the receiving nodes buffer the program data in units of data block sizes of storage devices associated therewith. The distributing node executes in parallel the processing for storing data read from the storage device in a buffer, and the processing for reading the data from the buffer and broadcasting or multicasting the read data to the receiving node. The receiving node executes in parallel the processing for storing the data received from the distributing node in a buffer, and the processing for reading the program data from the buffer and storing the program data in the storage device thereof.
摘要翻译：分发节点在接收节点中发起安装控制程序，然后将节目数据广播或多播到接收节点。因此，将程序安装到节点中在较短的时间内进行。在这种情况下，分发节点和接收节点以与其相关联的存储设备的数据块大小为单位来缓冲节目数据。分发节点并行地执行用于将从存储装置读取的数据存储在缓冲器中的处理，以及用于从缓冲器读取数据并将读取的数据广播或多播到接收节点的处理。接收节点并行地执行用于将从分发节点接收的数据存储在缓冲器中的处理，以及用于从缓冲器读取节目数据并将节目数据存储在其存储装置中的处理。

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