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1. 发明授权

US09905928B2 Electrical components and method of manufacture 有权
公开(公告)号：US09905928B2
公开(公告)日：2018-02-27
申请号：US14268082
申请日：2014-05-02
申请人： L. Pierre de Rochemont
发明人： L. Pierre de Rochemont
IPC分类号： H01Q15/02 , H01Q9/04 , B82Y30/00 , H01C7/00 , H01C17/00 , H01C17/065 , H01G4/10 , H01G4/33 , H01Q1/22 , H01Q1/38 , H01Q15/00 , H01L23/64 , H01L23/498 , H05K1/02 , H05K1/09 , H05K1/16 , H05K3/20
CPC分类号： H01Q9/0414 , B82Y30/00 , C04B2235/768 , C04B2235/781 , H01C7/003 , H01C17/003 , H01C17/06533 , H01G4/10 , H01G4/1209 , H01G4/33 , H01L23/49822 , H01L23/642 , H01L23/647 , H01L2224/16 , H01L2224/16225 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01025 , H01L2924/01037 , H01L2924/01057 , H01L2924/01067 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/3011 , H01L2924/3025 , H01Q1/2283 , H01Q1/38 , H01Q15/0086 , H05K1/0298 , H05K1/092 , H05K1/16 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/207 , H05K2201/017 , H05K2201/0175 , H05K2201/09763 , H05K2203/016 , H05K2203/0338 , H05K2203/121 , Y10T428/12493
摘要： An electrical component provides a ceramic element located on or in a dielectric substrate between and in contact with a pair of electrical conductors, wherein the ceramic element includes one or more metal oxides having fluctuations in metal-oxide compositional uniformity less than or equal to 1.5 mol % throughout the ceramic element. A method of fabricating an electrical component, provides or forming a ceramic element between and in contact with a pair of electrical conductors on a substrate including depositing a mixture of metalorganic precursors and causing simultaneous decomposition of the metal oxide precursors to form the ceramic element including one or more metal oxides.

2. 发明申请

US20170033033A1 SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件
公开(公告)号：US20170033033A1
公开(公告)日：2017-02-02
申请号：US15293584
申请日：2016-10-14
申请人： RENESAS ELECTRONICS CORPORATION , RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
发明人： Hajime HASEBE , Tadatoshi DANNO , Yukihiro SATOU
IPC分类号： H01L23/495 , H01L21/56 , H01L21/48 , H01L23/31
CPC分类号： H01L23/49503 , H01L21/4853 , H01L21/563 , H01L23/3107 , H01L23/3121 , H01L23/49 , H01L23/4952 , H01L23/49548 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/26175 , H01L2224/27013 , H01L2224/29339 , H01L2224/32057 , H01L2224/32245 , H01L2224/32257 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48253 , H01L2224/48257 , H01L2224/484 , H01L2224/48463 , H01L2224/48599 , H01L2224/48639 , H01L2224/49171 , H01L2224/73265 , H01L2224/83051 , H01L2224/83101 , H01L2224/83385 , H01L2224/85439 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/15151 , H01L2924/15747 , H01L2924/181 , H01L2924/351 , Y10T29/49121 , H01L2224/85 , H01L2924/00012 , H01L2924/3512 , H01L2924/00 , H01L2224/05599
摘要： In a non-leaded type semiconductor device, a tab, tab suspension leads, and other leads are exposed to one surface of a seal member. A semiconductor element is positioned within the seal member and fixed to a surface of the tab with an adhesive. The tab is formed larger than the semiconductor element so that outer peripheral edges of the tab are positioned outside outer peripheral edges of the semiconductor element. A groove is formed in the tab surface portion positioned between the area to which the semiconductor element is fixed and wire connection areas to which the wires are connected, the groove being formed so as to surround the semiconductor element fixing area, thereby preventing peeling-off between the tab to which the semiconductor element is fixed and the resin which constitutes the package.
摘要翻译：在非引线型半导体器件中，突片，突片悬挂引线和其它引线暴露于密封构件的一个表面。半导体元件被定位在密封构件内并用粘合剂固定到突片的表面。突片形成为比半导体元件大，使得突片的外周边缘位于半导体元件的外周边缘的外侧。在位于半导体元件固定的区域与电线连接的电线连接区域之间的突片表面部分中形成有沟槽，该沟槽形成为围绕半导体元件固定区域，从而防止剥离在半导体元件固定的突片与构成封装的树脂之间。

3. 发明授权

US09496204B2 Semiconductor device 有权
公开(公告)号：US09496204B2
公开(公告)日：2016-11-15
申请号：US14090295
申请日：2013-11-26
申请人： RENESAS ELECTRONICS CORPORATION , HITACHI HOKKAI SEMICONDUCTOR LTD.
发明人： Hajime Hasebe , Tadatoshi Danno , Yukihiro Satou
IPC分类号： H01L23/49 , H01L23/31 , H01L23/495 , H01L23/00
CPC分类号： H01L23/49503 , H01L21/4853 , H01L21/563 , H01L23/3107 , H01L23/3121 , H01L23/49 , H01L23/4952 , H01L23/49548 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/26175 , H01L2224/27013 , H01L2224/29339 , H01L2224/32057 , H01L2224/32245 , H01L2224/32257 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48253 , H01L2224/48257 , H01L2224/484 , H01L2224/48463 , H01L2224/48599 , H01L2224/48639 , H01L2224/49171 , H01L2224/73265 , H01L2224/83051 , H01L2224/83101 , H01L2224/83385 , H01L2224/85439 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/15151 , H01L2924/15747 , H01L2924/181 , H01L2924/351 , Y10T29/49121 , H01L2224/85 , H01L2924/00012 , H01L2924/3512 , H01L2924/00 , H01L2224/05599
摘要： In a non-leaded type semiconductor device, a tab, tab suspension leads, and other leads are exposed to one surface of a seal member. A semiconductor element is positioned within the seal member and fixed to a surface of the tab with an adhesive. The tab is formed larger than the semiconductor element so that outer peripheral edges of the tab are positioned outside outer peripheral edges of the semiconductor element. A groove is formed in the tab surface portion positioned between the area to which the semiconductor element is fixed and wire connection areas to which the wires are connected, the groove being formed so as to surround the semiconductor element fixing area, thereby preventing peeling-off between the tab to which the semiconductor element is fixed and the resin which constitutes the package.

4. 发明申请

US20150357112A1 Power Management Module and Method of Manufacture 审中-公开
标题翻译：电源管理模块和制造方法
公开(公告)号：US20150357112A1
公开(公告)日：2015-12-10
申请号：US14560935
申请日：2014-12-04
申请人： L. Pierre de Rochemont
发明人： L. Pierre de Rochemont
IPC分类号： H01F27/28 , H01F27/24 , H01F41/04
CPC分类号： H01F27/2804 , B82Y30/00 , C04B2235/768 , C04B2235/781 , H01C7/003 , H01C17/003 , H01C17/06533 , H01F3/00 , H01F5/003 , H01F27/24 , H01F27/29 , H01F27/40 , H01F41/041 , H01F2027/2809 , H01G4/10 , H01G4/33 , H01L23/64 , H01L28/10 , H01L2224/16 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01025 , H01L2924/01037 , H01L2924/01057 , H01L2924/01067 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/3011 , H01L2924/3025 , H05K1/0298 , H05K1/092 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/207 , H05K2201/017 , H05K2201/0175 , H05K2201/09763 , H05K2203/016 , H05K2203/0338 , H05K2203/121 , Y10T29/49021
摘要： A power management module, provides an inductor including one or more electrical conductors disposed around a ferromagnetic ceramic element including one or more metal oxides having fluctuations in metal-oxide compositional uniformity less than or equal to 1.50 mol % throughout the ceramic element.
摘要翻译：电源管理模块提供一种电感器，其包括设置在铁磁性陶瓷元件周围的一个或多个电导体，所述铁磁陶瓷元件包括在整个陶瓷元件中具有小于或等于1.50摩尔％的金属氧化物组成均匀性波动的一种或多种金属氧化物。

5. 发明授权

US09006910B2 Interconnection structure 有权
标题翻译：互连结构
公开(公告)号：US09006910B2
公开(公告)日：2015-04-14
申请号：US13015324
申请日：2011-01-27
申请人： Ryuichi Oikawa
发明人： Ryuichi Oikawa
IPC分类号： H01L23/538 , H01L23/495 , H01L23/66 , H01L23/00
CPC分类号： H01L23/49541 , H01L23/49503 , H01L23/66 , H01L24/48 , H01L24/49 , H01L2223/6638 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01067 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An interconnection structure includes: first and second differential signal interconnections provided to transmit a differential signal; and first and second voltage interconnections applied with predetermined voltages. The first voltage interconnection, the first differential signal interconnection, the second differential signal interconnection and the second voltage interconnection are arranged in this order. An interval between the first and second differential signal interconnections is longer than an interval between the first voltage interconnection and the first differential signal interconnection and is longer than an interval between the second differential signal interconnection and the second voltage interconnection. When a first connection point and a second connection point nearest to the first connection point are provided on any of the first and second differential signal interconnections and the first and second voltage interconnections, a distance between the first connection point and the second connection point is in a range of 1/16 of a wavelength of the differential signal to ⅛ of the wavelength thereof.
摘要翻译：互连结构包括：提供用于传输差分信号的第一和第二差分信号互连; 以及施加预定电压的第一和第二电压互连。第一电压互连，第一差分信号互连，第二差分信号互连和第二电压互连按顺序排列。第一和第二差分信号互连之间的间隔比第一电压互连和第一差分信号互连之间的间隔长，并且长于第二差分信号互连和第二电压互连之间的间隔。当在第一和第二差分信号互连以及第一和第二电压互连中的任何一个上提供最靠近第一连接点的第一连接点和第二连接点时，第一连接点和第二连接点之间的距离在其差分信号的波长的1/16的范围与其波长的⅛。

6. 发明申请

US20150064498A1 METHOD OF ROOM TEMPERATURE COVALENT BONDING 审中-公开
标题翻译：室温共价键合方法
公开(公告)号：US20150064498A1
公开(公告)日：2015-03-05
申请号：US14474501
申请日：2014-09-02
申请人： Ziptronix, Inc.
发明人： Qin-Yi TONG
IPC分类号： B32B7/04
CPC分类号： B32B7/04 , B32B2250/04 , B81C1/00357 , B81C2201/019 , B81C2203/0118 , B81C2203/019 , H01L21/3105 , H01L21/76251 , H01L24/26 , H01L24/29 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/08059 , H01L2224/29186 , H01L2224/80896 , H01L2224/81894 , H01L2224/81895 , H01L2224/8319 , H01L2224/8385 , H01L2224/83894 , H01L2224/83896 , H01L2224/9202 , H01L2224/9212 , H01L2224/92125 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01018 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01058 , H01L2924/01067 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/07802 , H01L2924/10253 , H01L2924/1305 , H01L2924/14 , H01L2924/1461 , H01L2924/351 , Y10T156/10 , Y10T428/24355 , Y10T428/24942 , Y10T428/31504 , Y10T428/31678 , H01L2924/3512 , H01L2924/00 , H01L2924/05442
摘要： A method of bonding includes using a bonding layer having a fluorinated oxide. Fluorine may be introduced into the bonding layer by exposure to a fluorine-containing solution, vapor or gas or by implantation. The bonding layer may also be formed using a method where fluorine is introduced into the layer during its formation. The surface of the bonding layer is terminated with a desired species, preferably an NH2 species. This may be accomplished by exposing the bonding layer to an NH4OH solution. High bonding strength is obtained at room temperature. The method may also include bonding two bonding layers together and creating a fluorine distribution having a peak in the vicinity of the interface between the bonding layers. One of the bonding layers may include two oxide layers formed on each other. The fluorine concentration may also have a second peak at the interface between the two oxide layers.
摘要翻译：接合方法包括使用具有氟化氧化物的接合层。可以通过暴露于含氟溶液，蒸汽或气体或通过注入将氟引入结合层。接合层也可以使用在其形成期间将氟引入层中的方法形成。接合层的表面用所需的物质，优选NH 2物质终止。这可以通过将结合层暴露于NH 4 OH溶液来实现。在室温下获得高粘结强度。该方法还可以包括将两个结合层结合在一起并产生在接合层之间的界面附近具有峰的氟分布。结合层之一可以包括彼此形成的两个氧化物层。氟浓度也可以在两个氧化物层之间的界面处具有第二个峰。

7. 发明申请

US20150001462A1 Stretchable Form of Single Crystal Silicon for High Performance Electronics on Rubber Substrates 有权
标题翻译：橡胶基板上用于高性能电子的单晶硅的可拉伸形式
公开(公告)号：US20150001462A1
公开(公告)日：2015-01-01
申请号：US14220923
申请日：2014-03-20
申请人： The Board of Trustees of the University of Illinois
发明人： John A. ROGERS , Dahl-Young KHANG , Yugang SUN , Etienne MENARD
IPC分类号： H01L29/15 , H01L23/29
CPC分类号： H01L23/5387 , B81C2201/0185 , B82Y10/00 , H01L21/02422 , H01L21/02521 , H01L21/02532 , H01L21/02546 , H01L21/02628 , H01L21/6835 , H01L23/293 , H01L23/3157 , H01L23/564 , H01L24/29 , H01L24/32 , H01L24/80 , H01L27/1266 , H01L27/1285 , H01L27/1292 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/151 , H01L29/158 , H01L29/16 , H01L29/1602 , H01L29/1606 , H01L29/7781 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03925 , H01L31/03926 , H01L31/18 , H01L31/1804 , H01L2221/68368 , H01L2224/291 , H01L2224/2919 , H01L2224/80894 , H01L2224/8385 , H01L2924/0002 , H01L2924/01002 , H01L2924/01003 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01049 , H01L2924/01051 , H01L2924/01067 , H01L2924/01072 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/07802 , H01L2924/10329 , H01L2924/10336 , H01L2924/10349 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/13063 , H01L2924/13091 , H01L2924/1461 , H01L2924/3025 , H05K1/0277 , H05K1/0283 , Y02E10/547 , Y02P70/521 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.
摘要翻译：本发明提供了拉伸，压缩，弯曲或以其它方式变形时能够提供良好性能的可拉伸和可选择的可印刷的半导体和电子电路。本发明的可拉伸半导体和电子电路除了具有可拉伸性以外，对于一些应用而言是优选的，因此能够沿着一个或多个轴显着伸长，弯曲，弯曲或其它变形。此外，本发明的可拉伸半导体和电子电路可以适用于宽范围的器件配置，以提供完全灵活的电子和光电器件。

8. 发明申请

US20140315338A1 LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME 审中-公开
标题翻译：发光装置及其制造方法
公开(公告)号：US20140315338A1
公开(公告)日：2014-10-23
申请号：US14321672
申请日：2014-07-01
申请人： NICHIA CORPORATION
发明人： Masafumi KURAMOTO , Tomohide MIKI , Tomoya TSUKIOKA , Tomohisa KISHIMOTO
IPC分类号： H01L33/56 , H01L33/36 , H01L33/60
CPC分类号： H01L33/36 , C08G59/3245 , C08K3/013 , C08K5/005 , H01L33/32 , H01L33/56 , H01L33/60 , H01L2224/0603 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/01004 , H01L2924/01019 , H01L2924/01057 , H01L2924/01067 , H01L2924/01079 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a light-emitting device comprising a light-emitting element (10) composed of a gallium nitride compound semiconductor having an emission peak wavelength of not less than 430 nm; a molded body (40) provided with a recessed portion having a bottom surface on which the light-emitting element (10) is mounted and a lateral surface; and a sealing member (50) containing an epoxy resin including a triazine derivative epoxy resin, or a silicon-containing resin. The molded body (40) is obtained by using a cured product of a thermosetting epoxy resin composition essentially containing an epoxy resin including a triazine derivative epoxy resin, and has a reflectance of not less than 70% at the wavelengths of not less than 430 nm.
摘要翻译：公开了一种发光装置，其包括由发光峰值波长不小于430nm的氮化镓系化合物半导体构成的发光元件（10）设置有具有安装有发光元件（10）的底面的凹部和侧面的成型体（40）以及含有包含三嗪衍生物环氧树脂的环氧树脂或含硅树脂的密封构件（50）。成型体（40）通过使用基本上含有包含三嗪衍生物环氧树脂的环氧树脂的热固性环氧树脂组合物的固化物得到，并且在不小于430nm的波长下具有不小于70％的反射率。

9. 发明授权

US08754428B2 Light emitting device and display 失效
标题翻译：发光装置和显示器
公开(公告)号：US08754428B2
公开(公告)日：2014-06-17
申请号：US12575155
申请日：2009-10-07
申请人： Yoshinori Shimizu , Kensho Sakano , Yasunobu Noguchi , Toshio Moriguchi
发明人： Yoshinori Shimizu , Kensho Sakano , Yasunobu Noguchi , Toshio Moriguchi
IPC分类号： H01L33/00 , H01L33/50 , C09K11/77 , H05B33/14 , H01J29/20 , H01L33/56
CPC分类号： H01L33/50 , C09K11/7767 , C09K11/7774 , G02B6/0023 , G02B6/0025 , G02B6/0051 , G02B6/0073 , H01J29/20 , H01L24/45 , H01L33/501 , H01L33/502 , H01L33/504 , H01L33/56 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265 , H01L2924/01019 , H01L2924/01021 , H01L2924/01067 , H01L2924/01068 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/15747 , H01L2924/181 , H01L2924/3011 , H01L2924/3025 , H01L2933/0091 , H05B33/14 , Y02B20/181 , H01L2924/00014 , H01L2924/00 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/00012
摘要： A light emitting diode having a mount lead having a cup and a lead, an LED chip mounted in the cup of said mount lead with one of electrodes being electrically connected to said mount lead, a coating material filling the cup of said mount lead to cover said LED chip; a molding material covering said LED chip, said coating material and the cup of said mount lead, and a phosphor absorbing a part of light emitted by said LED chip and emitting light of wavelength different from that of the absorbed light, wherein said phosphor is located in said coating material, and wherein said molding material is shaped to form a concave lens.
摘要翻译：一种发光二极管，具有具有杯和引线的安装引线，安装在所述安装引线的杯中的LED芯片，其中一个电极与所述安装引线电连接，涂覆材料将所述安装引线的杯填充到盖说LED芯片; 覆盖所述LED芯片，所述涂层材料和所述安装引线的杯子的成型材料以及吸收由所述LED芯片发射的光的一部分并发射与所吸收的光的波长不同的波长的荧光体的荧光体，其中所述荧光体位于在所述涂料中，并且其中所述成型材料成形为形成凹透镜。

10. 发明授权

US08754396B2 Stretchable form of single crystal silicon for high performance electronics on rubber substrates 有权
标题翻译：用于橡胶基板上高性能电子的单晶硅的拉伸形式
公开(公告)号：US08754396B2
公开(公告)日：2014-06-17
申请号：US13441618
申请日：2012-04-06
申请人： John A. Rogers , Dahl-Young Khang , Yugang Sun , Etienne Menard
发明人： John A. Rogers , Dahl-Young Khang , Yugang Sun , Etienne Menard
IPC分类号： H01L29/72
CPC分类号： H01L23/5387 , B81C2201/0185 , B82Y10/00 , H01L21/02422 , H01L21/02521 , H01L21/02532 , H01L21/02546 , H01L21/02628 , H01L21/6835 , H01L23/293 , H01L23/3157 , H01L23/564 , H01L24/29 , H01L24/32 , H01L24/80 , H01L27/1266 , H01L27/1285 , H01L27/1292 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/151 , H01L29/158 , H01L29/16 , H01L29/1602 , H01L29/1606 , H01L29/7781 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03925 , H01L31/03926 , H01L31/18 , H01L31/1804 , H01L2221/68368 , H01L2224/291 , H01L2224/2919 , H01L2224/80894 , H01L2224/8385 , H01L2924/0002 , H01L2924/01002 , H01L2924/01003 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01049 , H01L2924/01051 , H01L2924/01067 , H01L2924/01072 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/07802 , H01L2924/10329 , H01L2924/10336 , H01L2924/10349 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/13063 , H01L2924/13091 , H01L2924/1461 , H01L2924/3025 , H05K1/0277 , H05K1/0283 , Y02E10/547 , Y02P70/521 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.
摘要翻译：本发明提供了拉伸，压缩，弯曲或以其它方式变形时能够提供良好性能的可拉伸和可选择的可印刷的半导体和电子电路。本发明的可拉伸半导体和电子电路除了具有可拉伸性以外，对于一些应用而言是优选的，因此能够沿着一个或多个轴显着伸长，弯曲，弯曲或其它变形。此外，本发明的可拉伸半导体和电子电路可以适用于宽范围的器件配置，以提供完全灵活的电子和光电器件。

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