会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Semiconductor device
    • 半导体器件
    • US09263367B2
    • 2016-02-16
    • US14515071
    • 2014-10-15
    • HONDA MOTOR CO., LTD.FUJI ELECTRIC CO., LTD.
    • Takaki NakagawaDaisuke TakeuchiYasuhiro MaedaHiromichi GoharaAkira MorozumiTakeshi Ichimura
    • H01L23/473H01L23/04H01L23/367
    • H01L23/473H01L23/3672H01L23/3675H01L2924/0002H01L2924/00
    • Provided is a semiconductor device comprising a cooler in which, by improving the shape of the connecting portions of an inlet/outlet of a coolant or the like, the pressure loss in the connecting portion or the like can be reduced.A cooler 20 of a semiconductor device 1 includes: an inlet 27 and an outlet 28 provided on side walls 22b1, 22b2 of a case 22 opposing to each other at diagonal positions; an introduction path 24 which is connected to the inlet 27 and formed in the case 22; a discharge path 25 which is connected to the outlet 28 and formed in the case 22; and a cooling flow channel 26 between the introduction path 24 and the discharge path 25. The height of the opening of the inlet 27 is larger than the height of the introduction path 24, and a connecting portion 271 between the inlet 27 and the introduction path 24 includes an inclined surface 271b which is inclined from the bottom surface of the connecting portion 271 toward the longitudinal direction of the introduction path 24.
    • 提供了一种包括冷却器的半导体器件,其中通过改善冷却剂等的入口/出口的连接部分的形状,可以减少连接部分等中的压力损失。 半导体器件1的冷却器20包括:入口27和出口28,设置在壳体22的侧壁22b1,22b2上,在对角位置处彼此相对; 引入路径24,其连接到入口27并形成在壳体22中; 排出路径25,其连接到出口28并形成在壳体22中; 以及在引导路径24和排出路径25之间的冷却流路26.入口27的开口的高度大于引入路径24的高度,入口27与引入路径之间的连接部271 24包括从连接部271的底面朝向导入路径24的长度方向倾斜的倾斜面271b。
    • 2. 发明授权
    • Fuel cell membrane electrode assembly
    • 燃料电池膜电极组件
    • US08895202B2
    • 2014-11-25
    • US13733260
    • 2013-01-03
    • Honda Motor Co., Ltd.
    • Yukihito TanakaAkihiro NodaSeiji SugiuraShuji SatoTakaki Nakagawa
    • H01M8/10H01M8/02
    • H01M8/1004H01M8/0273Y02E60/521
    • A resin frame equipped membrane electrode assembly includes a membrane electrode assembly and a resin frame member. The membrane electrode assembly includes a solid polymer electrolyte membrane and an anode, and a cathode sandwiching the solid polymer electrolyte membrane. The resin frame member is formed around the solid polymer electrolyte membrane. The outer end of an electrode catalyst layer of the cathode protrudes beyond the outer end of a gas diffusion layer, and the resin frame member includes an inner extension protruding toward the outer periphery of the cathode to contact the outer end of the solid polymer electrolyte membrane. The inner extension of the resin frame member has an overlapped portion overlapped with the outer end of the electrode catalyst layer.
    • 具有树脂框架的膜电极组件包括膜电极组件和树脂框架构件。 膜电极组件包括固体聚合物电解质膜和阳极以及夹住固体聚合物电解质膜的阴极。 树脂框架构件形成在固体聚合物电解质膜周围。 阴极的电极催化剂层的外端突出超过气体扩散层的外端,树脂框架构件包括向阴极外周突出的内延伸部,以接触固体聚合物电解质膜的外端 。 树脂框架构件的内部延伸部具有与电极催化剂层的外端重叠的重叠部分。