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1. 发明授权

US07883244B2 Illuminating device with drying agent 有权
标题翻译：带干燥剂的照明装置
公开(公告)号：US07883244B2
公开(公告)日：2011-02-08
申请号：US12177390
申请日：2008-07-22
申请人： Hung-Kuang Hsu , Wen-Jang Jiang , Tse-An Lee
发明人： Hung-Kuang Hsu , Wen-Jang Jiang , Tse-An Lee
IPC分类号： B60Q3/04 , F21V21/00 , F21V29/00
CPC分类号： F21V31/03 , F21V29/76 , F21Y2115/10
摘要： An exemplary illuminating device includes a light source container, a light source and a drying chamber. The light source container includes a receiving room. The light source is received in the receiving room. The drying chamber has desiccant received therein and communicates with the receiving room. The desiccant is configured for absorbing moisture in the illuminating device, therefore, drying the illuminating device.
摘要翻译：示例性照明装置包括光源容器，光源和干燥室。光源容器包括接收室。光源被接收在接收室中。干燥室具有干燥剂，并与接收室连通。干燥剂被配置为吸收照明装置中的水分，因此干燥照明装置。

2. 发明授权

US08053796B2 Solid state light emitting device 失效
标题翻译：固态发光装置
公开(公告)号：US08053796B2
公开(公告)日：2011-11-08
申请号：US11964845
申请日：2007-12-27
申请人： Chun-Wei Wang , Hung-Kuang Hsu , Wen-Jang Jiang
发明人： Chun-Wei Wang , Hung-Kuang Hsu , Wen-Jang Jiang
IPC分类号： H01L33/00
CPC分类号： H01L25/167 , H01L33/486 , H01L2224/45144 , H01L2224/48227 , H01L2924/09701 , H01L2924/12032 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A solid state light emitting device includes a laminated substrate structure (120), an LED chip (30), a transparent capsulation material (50) and an electric component (40). The laminated substrate structure includes a first substrate (10) and a second substrate (20) attached to each other by a sintering process. The first substrate has a mounting surface (100) and a receiving through hole (11) defined in the mounting surface thereof. The LED chip is mounted on the mounting surface of the first substrate. The transparent capsulation material envelops the LED chip therein. The electric component is received in the receiving hole and mounted on the second substrate. The electric component is located below the mounting surface of the first substrate.
摘要翻译：固态发光器件包括层叠基板结构（120），LED芯片（30），透明封装材料（50）和电气部件（40）。层压基板结构包括通过烧结工艺彼此连接的第一基板（10）和第二基板（20）。第一基板具有在其安装表面中限定的安装表面（100）和接收通孔（11）。 LED芯片安装在第一基板的安装表面上。透明封装材料包围其中的LED芯片。电气部件容纳在接收孔中并安装在第二基板上。电气部件位于第一基板的安装面的下方。

3. 发明授权

US07994518B2 Light-emitting diode 失效
标题翻译：发光二极管
公开(公告)号：US07994518B2
公开(公告)日：2011-08-09
申请号：US12202555
申请日：2008-09-02
申请人： Chun-Wei Wang , Hung-Kuang Hsu , Wen-Jang Jiang
发明人： Chun-Wei Wang , Hung-Kuang Hsu , Wen-Jang Jiang
IPC分类号： H01L33/00
CPC分类号： H01L31/14 , H01L33/54 , H01L33/60 , H01L2924/0002 , H01L2924/1815 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： An LED includes a substrate having a substantially flat substrate surface, a plurality of electrodes extending through the substrate, an LED chip configured for emitting light, a first and a second coplanar reflective layers formed on the surface, and a light pervious encapsulation member mounted on the substrate surface. The light pervious encapsulation member covers the LED chip and the first reflective layer and a portion of the second reflective layer. The LED chip is mounted on the substrate surface and electrically connected with the electrodes. The first reflective layer and the second reflective layer are configured for reflecting the light emitted from the LED chip.
摘要翻译： LED包括具有基本上平坦的基板表面的基板，延伸穿过基板的多个电极，被配置为发光的LED芯片，形成在表面上的第一和第二共面反射层以及安装在基材表面。透光封装构件覆盖LED芯片和第一反射层以及第二反射层的一部分。 LED芯片安装在基板表面上并与电极电连接。第一反射层和第二反射层被配置为反射从LED芯片发射的光。

4. 发明授权

US07763896B2 Light emitting diode with auxiliary electric component 失效
标题翻译：具有辅助电气元件的发光二极管
公开(公告)号：US07763896B2
公开(公告)日：2010-07-27
申请号：US12168783
申请日：2008-07-07
申请人： Chun-Wei Wang , Hung-Kuang Hsu , Wen-Jang Jiang
发明人： Chun-Wei Wang , Hung-Kuang Hsu , Wen-Jang Jiang
IPC分类号： H01L25/16
CPC分类号： H01L25/167 , H01L33/486 , H01L33/64 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： An exemplary LED includes a substrate, an LED chip, a light pervious encapsulation, and an auxiliary electric component. The substrate includes a first surface, an opposite second surface, and an accommodating space defined therein between the first surface and the second surface. The LED chip is mounted on the first surface of the substrate. The light pervious encapsulation is formed on the substrate and covers the LED chip. The auxiliary electric component is received in the accommodating space between the first and second surfaces of the substrate.
摘要翻译：示例性的LED包括基板，LED芯片，透光性封装和辅助电气部件。衬底包括第一表面，相对的第二表面和在第一表面和第二表面之间限定的容纳空间。 LED芯片安装在基板的第一表面上。透光封装形成在基板上并覆盖LED芯片。辅助电气部件容纳在基板的第一和第二表面之间的容纳空间中。

5. 发明授权

US07745840B2 Solide-state light source 失效
标题翻译：固态光源
公开(公告)号：US07745840B2
公开(公告)日：2010-06-29
申请号：US12192336
申请日：2008-08-15
申请人： Chun-Wei Wang , Hung-Kuang Hsu , Wen-Jang Jiang
发明人： Chun-Wei Wang , Hung-Kuang Hsu , Wen-Jang Jiang
IPC分类号： H01L21/02
CPC分类号： H01L33/60 , H01L33/58 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： A solid-state light source includes a substrate, a solid-state light-emitting chip, a plurality of micro-members and a light-permeable encapsulation. The substrate has a substantially flat surface. The solid-state light-emitting chip is arranged on the substantially flat surface of the substrate and electrically connected to the substrate. The micro-members are arranged on the surface of the substrate and parallel with the solid-state light emitting chip. The light-permeable encapsulation is arranged on the surface of the substrate and covers the solid-state light-emitting chip and the micro-members.
摘要翻译：固态光源包括基板，固态发光芯片，多个微型部件和透光性封装。基板具有基本平坦的表面。固态发光芯片布置在基板的基本上平坦的表面上并电连接到基板。微型部件布置在基板的表面上并与固态发光芯片平行。透光性封装体配置在基板的表面，覆盖固态发光芯片和微型部件。

6. 发明授权

US07682048B2 Lighting emitting diode lamp 失效
标题翻译：照明发光二极管灯
公开(公告)号：US07682048B2
公开(公告)日：2010-03-23
申请号：US12040828
申请日：2008-02-29
申请人： Hung-Kuang Hsu , Chun-Wei Wang , Wen-Jang Jiang
发明人： Hung-Kuang Hsu , Chun-Wei Wang , Wen-Jang Jiang
IPC分类号： F21V29/00
CPC分类号： H01L33/64 , F21K9/00 , F21V29/71 , F21V29/75 , F21V29/763 , F21V29/89 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , H01L25/0753 , H01L2924/0002 , H01L2924/00
摘要： A lighting emitting diode (LED) lamp (100) includes a first LED array (60) and a second LED array (50). A rate of change of a relatively luminous intensity relative to the temperature of the first LED array is lower than that of the second LED array. A first heat sink (10) thermally attaches to the first LED array. A second heat sink (20) thermally attaches to the second LED array. A heat dissipation efficiency of the second heat sink is higher than that of the first heat sink. The heat dissipation of the second LED array is much quicker than that of the first LED array. The second LED array thus can be kept working at a much lower temperature.
摘要翻译：发光二极管（LED）灯（100）包括第一LED阵列（60）和第二LED阵列（50）。相对于第一LED阵列的温度的相对发光强度的变化率低于第二LED阵列的变化率。第一散热器（10）热连接到第一LED阵列。第二散热器（20）热附接到第二LED阵列。第二散热器的散热效率高于第一散热器的散热效率。第二个LED阵列的散热比第一个LED阵列的散热快得多。因此，第二LED阵列可以在低得多的温度下保持工作。

7. 发明申请

US20090160344A1 LIGHTING EMITTING DIODE LAMP 审中-公开
标题翻译：发光二极管灯
公开(公告)号：US20090160344A1
公开(公告)日：2009-06-25
申请号：US12040830
申请日：2008-02-29
申请人： Hung-Kuang Hsu , Chun-Wei Wang , Wen-Jang Jiang
发明人： Hung-Kuang Hsu , Chun-Wei Wang , Wen-Jang Jiang
IPC分类号： H01J61/52 , H01J13/32
CPC分类号： F21V29/503 , F21K9/00 , F21V29/677 , F21V29/763 , F21Y2113/13 , F21Y2115/10 , H01L2924/0002 , H01L2924/00
摘要： A lighting emitting diode (LED) lamp (100) includes a first LED array (60) and a second LED array (50). A ratio of change of relatively luminous intensity relative to change of temperature of the first LED array is less than that of the second LED array. A first heat sink (10) thermally attaches to the first LED array. A second heat sink (20) thermally attaches to the second LED array. An active heat dissipating device (80) is in combination with the second heat sink for enhancing a heat dissipation efficiency of the second heat sink, and thus the heat dissipation efficiency of the second heat sink is greater than that of the first heat sink. The heat dissipation of the second LED array is much quicker than that of the first LED array. The second LED array thus can be kept working at a much less temperature.
摘要翻译：发光二极管（LED）灯（100）包括第一LED阵列（60）和第二LED阵列（50）。相对于第一LED阵列的温度变化的相对发光强度的变化率小于第二LED阵列的变化率。第一散热器（10）热连接到第一LED阵列。第二散热器（20）热附接到第二LED阵列。主动散热装置（80）与第二散热器组合，用于提高第二散热器的散热效率，因此第二散热器的散热效率大于第一散热器的散热效率。第二个LED阵列的散热比第一个LED阵列的散热快得多。因此，第二LED阵列可以在更低的温度下保持工作。

8. 发明授权

US07744264B2 Semiconductor solid-state light-source module and assembly having the same 失效
标题翻译：半导体固态光源模块及其组件
公开(公告)号：US07744264B2
公开(公告)日：2010-06-29
申请号：US12202557
申请日：2008-09-02
申请人： Chih-Chung Tsao , Chih-Peng Hsu , Wen-Jang Jiang , Chun-Wei Wang , Chih-Ming Lai , Hung-Kuang Hsu
发明人： Chih-Chung Tsao , Chih-Peng Hsu , Wen-Jang Jiang , Chun-Wei Wang , Chih-Ming Lai , Hung-Kuang Hsu
IPC分类号： F21V7/04
CPC分类号： F21S2/005 , F21V19/001 , F21V19/045 , F21V23/06 , F21Y2115/10 , G02B6/0068 , G02B6/0073 , H05K1/14 , H05K2201/048 , H05K2201/09963 , H05K2201/10106
摘要： An exemplary semiconductor solid-state light-source module includes a printed circuit board, at least one semiconductor solid state light source mounted on the printed circuit board and a light guide plate optically coupled to the semiconductor solid state light source. The printed circuit board includes a protrusion and a recess. The protrusion is configured for engaging with a recess of the printed circuit board of another similar semiconductor solid-state light-source module.
摘要翻译：示例性的半导体固态光源模块包括印刷电路板，安装在印刷电路板上的至少一个半导体固态光源和与半导体固态光源光学耦合的导光板。印刷电路板包括突起和凹部。该突出部构造成用于与另一个类似的半导体固态光源模块的印刷电路板的凹部接合。

9. 发明授权

US07682054B2 Illuminating apparatus with efficient heat dissipation capability 失效
标题翻译：具有高效散热能力的照明装置
公开(公告)号：US07682054B2
公开(公告)日：2010-03-23
申请号：US12045156
申请日：2008-03-10
申请人： Hung-Kuang Hsu , Wen-Jang Jiang
发明人： Hung-Kuang Hsu , Wen-Jang Jiang
IPC分类号： F21V29/00
CPC分类号： F21V29/004 , F21S6/003 , F21V29/505 , F21V29/60 , F21V29/83 , F21Y2115/10
摘要： An illuminating apparatus (20) includes a lamp cover (200), a solid-state light emitting component (23) and an air tank (24). The lamp cover has a first end and an opposite second end. The lamp cover tapers from the first end to the second end. The lamp cover defines therein an air channel (25) running from the first end to the second end of the lamp cover. The solid-state light emitting component is disposed in the lamp cover at the second end thereof. The air tank has a chamber (240) therein in thermally contact with the solid-state light emitting component. The air tank has a plurality of first and second air vents (244, 245). The chamber is communicated with the air channel via the first air vents, and is communicated with an ambient environment via the second air vents. The first and second air vents are disposed at different altitudes.
摘要翻译：照明装置（20）包括灯罩（200），固态发光部件（23）和空气罐（24）。灯罩具有第一端和相对的第二端。灯罩从第一端至第二端逐渐变细。灯罩在其中限定有从灯罩的第一端延伸到第二端的空气通道（25）。固态发光元件在其第二端设置在灯罩中。空气罐具有与固态发光部件热接触的室（240）。空气罐具有多个第一和第二通气孔（244,245）。该室通过第一通风口与空气通道连通，并通过第二通风口与周围环境连通。第一和第二通风口处于不同的高度。

10. 发明申请

US20090161354A1 LIGHTING EMITTING DIODE LAMP 失效
标题翻译：发光二极管灯
公开(公告)号：US20090161354A1
公开(公告)日：2009-06-25
申请号：US12040828
申请日：2008-02-29
申请人： Hung-Kuang Hsu , Chun-Wei Wang , Wen-Jang Jiang
发明人： Hung-Kuang Hsu , Chun-Wei Wang , Wen-Jang Jiang
IPC分类号： B60Q1/26
CPC分类号： H01L33/64 , F21K9/00 , F21V29/71 , F21V29/75 , F21V29/763 , F21V29/89 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , H01L25/0753 , H01L2924/0002 , H01L2924/00
摘要： A lighting emitting diode (LED) lamp (100) includes a first LED array (60) and a second LED array (50). A rate of change of a relatively luminous intensity relative to the temperature of the first LED array is lower than that of the second LED array. A first heat sink (10) thermally attaches to the first LED array. A second heat sink (20) thermally attaches to the second LED array. A heat dissipation efficiency of the second heat sink is higher than that of the first heat sink. The heat dissipation of the second LED array is much quicker than that of the first LED array. The second LED array thus can be kept working at a much lower temperature.
摘要翻译：发光二极管（LED）灯（100）包括第一LED阵列（60）和第二LED阵列（50）。相对于第一LED阵列的温度的相对发光强度的变化率低于第二LED阵列的变化率。第一散热器（10）热连接到第一LED阵列。第二散热器（20）热附接到第二LED阵列。第二散热器的散热效率高于第一散热器的散热效率。第二个LED阵列的散热比第一个LED阵列的散热快得多。因此，第二LED阵列可以在低得多的温度下保持工作。

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