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    • 9. 发明授权
    • Flip chip type nitride semiconductor light emitting device and manufacturing method thereof
    • 倒装芯片型氮化物半导体发光器件及其制造方法
    • US07235818B2
    • 2007-06-26
    • US10861511
    • 2004-06-07
    • Hyun Kyung KimYong Chun KimHyoun Soo Shin
    • Hyun Kyung KimYong Chun KimHyoun Soo Shin
    • H01L33/00
    • H01L33/405H01L33/32
    • Disclosed herein are a flip chip type nitride semiconductor light emitting device, which comprises a substrate for growing a nitride semiconductor material, an n-type nitride semiconductor layer formed on the substrate, an active layer formed on at least a part of the n-type nitride semiconductor layer, a p-type nitride semiconductor layer formed on the active layer, a bonding force providing layer formed on the p-type nitride semiconductor layer and adapted to provide a bonding force relative to the p-type nitride semiconductor layer, a reflective electrode layer formed on the bonding force providing layer, and adapted to reflect light produced in the active layer toward the substrate and to diffuse electric current, and a cap layer formed on the reflective electrode layer, and adapted to provide a bonding force between the reflective electrode layer and a bonding metal and to reduce contact resistance.
    • 本文公开了一种倒装芯片型氮化物半导体发光器件,其包括用于生长氮化物半导体材料的衬底,形成在衬底上的n型氮化物半导体层,形成在n型氮化物半导体的至少一部分上的有源层 氮化物半导体层,形成在有源层上的p型氮化物半导体层,形成在p型氮化物半导体层上并适于提供相对于p型氮化物半导体层的结合力的接合力提供层,反射 电极层,形成在所述接合力提供层上,并且适于将在所述有源层中产生的光朝向所述衬底反射并扩散电流;以及覆盖层,形成在所述反射电极层上,并且适于在所述反射层之间提供接合力 电极层和接合金属,并降低接触电阻。
    • 10. 发明授权
    • Nitride semiconductor light emitting device and method of manufacturing the same
    • 氮化物半导体发光器件及其制造方法
    • US08124997B2
    • 2012-02-28
    • US12756528
    • 2010-04-08
    • Tae Jun KimSu Yeol LeeDong Woo KimHyun Ju ParkHyoun Soo ShinIn Joon Pyeon
    • Tae Jun KimSu Yeol LeeDong Woo KimHyun Ju ParkHyoun Soo ShinIn Joon Pyeon
    • H01L31/0232
    • H01L33/0079H01L33/22H01L33/32
    • There are provided a method of manufacturing a nitride semiconductor light emitting device and the nitride semiconductor light emitting device manufactured by the method, the method including: forming a light emitting structure by sequentially growing a first conductivity nitride layer, an active layer and a second conductivity type nitride layer on a preliminary substrate for nitride single crystal growth; separating the light emitting structure in accordance with a size of final light emitting device; forming a conductive substrate on the light emitting structure; polishing a bottom surface of the preliminary substrate to reduce a thickness of the preliminary substrate; forming uneven surface structures by machining the preliminary substrate; selectively removing the preliminary substrate to expose portions of the first conductivity type nitride layer; and forming electrodes on the portions of the first conductivity type nitride layer exposed by selectively removing the preliminary substrate.
    • 提供了一种制造氮化物半导体发光器件的方法和通过该方法制造的氮化物半导体发光器件,该方法包括:通过依次生长第一导电氮化物层,有源层和第二导电性来形成发光结构 在氮化物单晶生长的预备衬底上形成氮化物层; 根据最终发光器件的尺寸分离发光结构; 在所述发光结构上形成导电基板; 抛光初步衬底的底面以减小初步衬底的厚度; 通过机加工初步底材形成不均匀的表面结构; 选择性地去除所述初步衬底以暴露所述第一导电型氮化物层的部分; 以及通过选择性地去除所述预备衬底而在所述第一导电型氮化物层的部分上形成电极。