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    • 2. 发明授权
    • Current-reuse bleeding mixer
    • 电流再利用出血混合器
    • US06892062B2
    • 2005-05-10
    • US09828182
    • 2001-04-09
    • Sang Gug LeeJung-Ki ChoiNam-Soo Kim
    • Sang Gug LeeJung-Ki ChoiNam-Soo Kim
    • H03D1/00H03D7/14H04B1/26
    • H03D7/1441H03D7/1458H03D7/1491H03D2200/0043
    • A current-reusing bleeding mixer capable of providing a higher conversion gain, linearity and lower noise figure employing a field-effect transistor includes a first to a fourth transistor and a first and a second load element. The first transistor amplifies a radio frequency (RF) signal. The second and the third transistor, each connected to the first transistor, receive a balanced local oscillator (LO) signal to mix it with the RF signal. The first and the second load element are connected between a supply voltage source and the second transistor and between the supply voltage source and the third transistor, respectively. The fourth transistor, connected between the supply voltage source and the first transistor, amplifies the RF signal and bleeds a current from the supply voltage source.
    • 能够使用场效应晶体管提供更高转换增益,线性度和较低噪声系数的电流再利用排出混合器包括第一至第四晶体管和第一和第二负载元件。 第一晶体管放大射频(RF)信号。 每个连接到第一晶体管的第二和第三晶体管接收平衡本地振荡器(LO)信号以将其与RF信号混合。 第一和第二负载元件分别连接在电源电压源和第二晶体管之间,以及电源电压源和第三晶体管之间。 连接在电源电压源和第一晶体管之间的第四晶体管放大RF信号并从电源电压源中流出电流。
    • 8. 发明授权
    • Conditioner device for conditioning polishing pad and chemical mechanical polishing apparatus including the same
    • 用于调理抛光垫的调节装置和包括其的化学机械抛光装置
    • US07578727B2
    • 2009-08-25
    • US11466425
    • 2006-08-22
    • Sung-Tae MoonDong-Jun LeeKyoung-Moon KangNam-Soo KimBong-Su Ahn
    • Sung-Tae MoonDong-Jun LeeKyoung-Moon KangNam-Soo KimBong-Su Ahn
    • B24B53/00
    • B24B53/017B24B53/14
    • The present invention relates to a conditioner device for polishing pad and a chemical mechanical polishing (CMP) apparatus having the same. The conditioner device of the present invention comprises a rotable support plate including a support plate surface comprising a center area located about the rotational axis of the support plate, a mid area surrounding the center area, and a peripheral area surrounding the mid area, a plurality of conditioning zones located within a portion of the mid area of the support plate surface. A plurality of hard particles which are densely arranged within the conditioning zones and are attached to the support plate surface. A plurality of passages defined by the conditioning zones within which a slurry flows, the passages occupying a portion of the mid area which is not occupied by the conditioning zones, the center area and the peripheral area.
    • 本发明涉及一种用于抛光垫的调节装置和具有该抛光垫的化学机械抛光(CMP)装置。 本发明的调节装置包括可旋转的支撑板,其包括支撑板表面,该支撑板表面包括围绕支撑板的旋转轴线的中心区域,围绕中心区域的中间区域和围绕中间区域的周边区域,多个 位于支撑板表面的中部区域的一部分内的调理区。 多个坚硬颗粒密集地布置在调理区内并附着在支撑板表面上。 由浆料流过的调节区限定的多个通道,通道占据中部区域的未被调节区域,中心区域和周边区域占据的部分。