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1. 发明授权

US10911850B2 Integrated temperature sensor in microphone package 有权
公开(公告)号：US10911850B2
公开(公告)日：2021-02-02
申请号：US16164922
申请日：2018-10-19
申请人： INVENSENSE, INC.
发明人： Anthony D. Minervini , Kieran Harney , Aleksey S. Khenkin , Baris Cagdaser
IPC分类号： G01K13/00 , H04R1/02 , B81B7/00 , H04R19/00 , H04R19/04
摘要： Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.

2. 发明授权

US09414165B2 Acoustic sensor resonant peak reduction 有权
标题翻译：声传感器谐振峰值降低
公开(公告)号：US09414165B2
公开(公告)日：2016-08-09
申请号：US14165430
申请日：2014-01-27
申请人： Invensense, Inc.
发明人： Aleksey S. Khenkin , Baris Cagdaser , James Christian Salvia , Fariborz Assaderaghi
IPC分类号： H04R3/00 , H04R3/06 , H04R19/00 , H04R19/04
CPC分类号： H04R3/06 , H04R19/005 , H04R19/04
摘要： A MEMS acoustic sensor includes a transducer with a frequency response with a gain peak, and a peak reduction circuit with a frequency response and coupled to the transducer. The frequency response of the peak reduction circuit causes attenuation of the gain peak.
摘要翻译： MEMS声学传感器包括具有增益峰值的频率响应的换能器和具有频率响应并耦合到换能器的峰值降低电路。峰值降低电路的频率响应导致增益峰值的衰减。

3. 发明申请

US20160091378A1 MICROELECTROMECHANICAL SYSTEMS (MEMS) PRESSURE SENSOR HAVING A LEAKAGE PATH TO A CAVITY 有权
标题翻译：微电子系统（MEMS）压力传感器有一个泄漏路径到CAVITY
公开(公告)号：US20160091378A1
公开(公告)日：2016-03-31
申请号：US14500854
申请日：2014-09-29
申请人： INVENSENSE, INC.
发明人： Julius Ming-Lin Tsai , Aleksey S. Khenkin , Baris Cagdaser , James Christian Salvia , Fariborz Assaderaghi
IPC分类号： G01L9/00 , G01L19/00 , G01L9/12
CPC分类号： G01L9/0073 , B81B3/0021 , B81B2201/0264 , G01L9/125 , G01L19/0092 , G01L27/002 , H04R19/005 , H04R19/04
摘要： Microelectromechanical systems (MEMS) pressure sensors having a leakage path are described. Provided implementations can comprise a MEMS pressure sensor system associated with a back cavity and a membrane that separates the back cavity and an ambient atmosphere. A pressure of the ambient atmosphere is determined based on a parameter associated with movement of the membrane.
摘要翻译：描述了具有泄漏路径的微机电系统（MEMS）压力传感器。所提供的实施方案可以包括与背腔相关联的MEMS压力传感器系统和分离后腔和环境气氛的膜。基于与膜的移动相关的参数来确定环境大气的压力。

4. 发明授权

US09285207B2 Linear capacitive displacement sensor 有权
标题翻译：线性电容位移传感器
公开(公告)号：US09285207B2
公开(公告)日：2016-03-15
申请号：US13952281
申请日：2013-07-26
申请人： InvenSense, Inc.
发明人： Baris Cagdaser , Du Chen , Hasan Akyol , Derek Shaeffer
IPC分类号： G01B7/14 , G01D5/241 , G01D5/24
CPC分类号： G01B7/14 , G01D5/24 , G01D5/2412 , G01L1/144
摘要： A method and system for measuring displacement of a structure is disclosed. The method and system comprise providing a first capacitance and providing a second capacitance. The first and second capacitances share a common terminal. The method and system further include determining a difference of the inverses of the value of the first and second capacitances when the structure is displaced. The first capacitance varies in inverse relation to the displacement of the structure.
摘要翻译：公开了一种用于测量结构位移的方法和系统。该方法和系统包括提供第一电容并提供第二电容。第一和第二电容共享公共端子。所述方法和系统还包括当所述结构被移位时确定所述第一和第二电容的值的反转的差异。第一电容与结构的位移成反比关系。

5. 发明授权

US08841958B1 High-voltage charge pump 有权
标题翻译：高压电荷泵
公开(公告)号：US08841958B1
公开(公告)日：2014-09-23
申请号：US13793899
申请日：2013-03-11
申请人： InvenSense, Inc.
发明人： Derek Shaeffer , Baris Cagdaser
IPC分类号： G05F1/10 , G05F3/02
CPC分类号： G05F3/02 , H02M3/073
摘要： A charge pump circuit is disclosed. The charge pump circuit comprises a transfer capacitor receiving a first clock phase and a driving capacitor receiving a second clock phase, the second clock phase opposite to the first clock phase. The circuit includes a first switch coupling an input node to the transfer capacitor. The first switch being controlled by the driving capacitor. The circuit further includes a second switch coupling the input node to the driving capacitor. The second switch being controlled by the transfer capacitor. The circuit also includes a third switch coupling the transfer capacitor to an output node. The third switch being controlled by the driving capacitor. The third switch operating in phase opposition to the first switch. The circuit finally includes a charge storage capacitor coupled to the output node.
摘要翻译：公开了电荷泵电路。电荷泵电路包括接收第一时钟相位的转移电容器和接收第二时钟相位的驱动电容器，第二时钟相位与第一时钟相位相反。电路包括将输入节点耦合到转移电容器的第一开关。第一开关由驱动电容器控制。电路还包括将输入节点耦合到驱动电容器的第二开关。第二开关由转移电容器控制。电路还包括将传输电容器耦合到输出节点的第三开关。第三开关由驱动电容器控制。第三开关与第一开关相反地工作。电路最后包括耦合到输出节点的电荷存储电容器。

6. 发明申请

US20140118073A1 CANCELLATION OF DYNAMIC OFFSET IN MOS RESISTORS 有权
标题翻译：消除MOS电阻中的动态偏移
公开(公告)号：US20140118073A1
公开(公告)日：2014-05-01
申请号：US13775057
申请日：2013-02-22
申请人： INVENSENSE, INC.
发明人： Baris Cagdaser , Du Chen
IPC分类号： G05F3/24 , H03F3/16
CPC分类号： G05F3/242 , H03F3/16 , H03F3/193
摘要： A circuit utilizes a MOS device in a triode mode of operation and includes a biasing circuit and a MOS device. The MOS device has a drain, a source, and a gate terminal, and is coupled to the biasing circuit. The source terminal, drain terminal, and gate terminal each has a potential and the drain and the source terminals have a resistance. The biasing circuit couples the drain and source terminals of the MOS device to the gate terminal of the MOS device. The biasing circuit couples a DC potential to the gate terminal to adjust the resistance between the source and drain terminals of the MOS device. The resistance between the source and drain terminals is a non-linear function of voltage potentials at the source and drain terminals. The biasing circuit reduces the non-linearity of the resistance between the drain and source terminals by modulating the potential at the gate terminal by a combination of source and drain terminal potentials.
摘要翻译：电路采用三极管工作模式的MOS器件，并包括偏置电路和MOS器件。 MOS器件具有漏极，源极和栅极端子，并且耦合到偏置电路。源极端子，漏极端子和栅极端子各自具有电势，漏极和源极端子具有电阻。偏置电路将MOS器件的漏极和源极端子耦合到MOS器件的栅极端子。偏置电路将DC电位耦合到栅极端子以调节MOS器件的源极和漏极端子之间的电阻。源极和漏极端子之间的电阻是源极和漏极端子处的电压电位的非线性函数。偏置电路通过源极和漏极端子电位的组合调制栅极端子处的电位来降低漏极和源极端之间的电阻的非线性。

7. 发明申请

US20190052944A1 INTEGRATED TEMPERATURE SENSOR IN MICROPHONE PACKAGE 审中-公开
公开(公告)号：US20190052944A1
公开(公告)日：2019-02-14
申请号：US16164922
申请日：2018-10-19
申请人： INVENSENSE, INC.
发明人： Anthony D. Minervini , Kieran Harney , Aleksey S. Khenkin , Baris Cagdaser
IPC分类号： H04R1/02 , H04R19/04 , H04R19/00 , B81B7/00 , G01K13/00
摘要： Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.

8. 发明申请

US20170190571A1 INTEGRATED PACKAGE CONTAINING MEMS ACOUSTIC SENSOR AND ENVIRONMENTAL SENSOR AND METHODOLOGY FOR FABRICATING SAME 审中-公开
公开(公告)号：US20170190571A1
公开(公告)日：2017-07-06
申请号：US15468066
申请日：2017-03-23
申请人： INVENSENSE, Inc.
发明人： Julius Ming-Lin Tsai , Baris Cagdaser , Martin Lim , Aleksey S. Khenkin
IPC分类号： B81B7/02 , H04R1/04 , H04R29/00 , B81C1/00
CPC分类号： B81B7/02 , B81B2201/0214 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2201/0292 , B81B2207/012 , B81B2207/07 , B81C1/0023 , B81C2203/0792 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/16152 , H04R1/04 , H04R19/04 , H04R29/004 , H04R2201/003 , H01L2924/00014 , H01L2924/00
摘要： An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.

9. 发明申请

US20160165330A1 INTEGRATED TEMPERATURE SENSOR IN MICROPHONE PACKAGE 审中-公开
标题翻译：集成温度传感器在麦克风包装
公开(公告)号：US20160165330A1
公开(公告)日：2016-06-09
申请号：US14856262
申请日：2015-09-16
申请人： INVENSENSE, INC.
发明人： Anthony D. Minervini , Kieran Harney , Aleksey S. Khenkin , Baris Cagdaser
IPC分类号： H04R1/02 , H04R19/04 , G01K13/00 , H04R19/00
CPC分类号： H04R1/028 , B81B7/0087 , B81B2201/0257 , B81B2201/0278 , B81B2207/012 , G01K13/00 , H04R19/005 , H04R19/04 , H04R2231/00
摘要： Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.
摘要翻译：各种实施例提供了一种集成温度传感器和麦克风封装，其中温度传感器位于与麦克风相关联的声学端口中，上方或附近。温度传感器靠近声学端口的放置使得温度传感器能够更准确地确定环境空气温度并减少与集成电路相关联的热引起的热岛干扰。在一个实施例中，温度传感器可以是形成在衬底上的热电偶，热电偶的温度感测部分形成在声学端口上。在另一个实施例中，温度传感器可以形成在延伸到声学端口中或上方的专用集成电路上。在另一个实施例中，衬底中的导热通道可以放置在声学端口附近，以使得温度传感器能够经由通道确定环境温度。

10. 发明申请

US20160149542A1 PREAMPLIFIER FOR A MICROPHONE 有权
标题翻译：麦克风的前置放大器
公开(公告)号：US20160149542A1
公开(公告)日：2016-05-26
申请号：US14553973
申请日：2014-11-25
申请人： INVENSENSE, INC.
发明人： Igor Mucha , Tomás Piták , James Salvia , Baris Cagdaser
IPC分类号： H03F1/08 , H04R3/00 , H03F3/181
CPC分类号： H04R3/00 , H03F3/183 , H03F2200/03 , H03F2200/372 , H03F2200/375 , H03F2200/444 , H04R1/08 , H04R3/04 , H04R19/005 , H04R2201/003
摘要： Systems and techniques for processing a signal associated with a microphone are presented. The system includes a microphone component and a preamplifier. The microphone component is contained in a housing. The preamplifier includes an input buffer that receives a signal generated by the microphone component. The input buffer also generates an output signal that comprises a direct current (DC) voltage offset in comparison to the signal, where the preamplifier controls a degree of the DC voltage offset based on a control signal.
摘要翻译：提出了用于处理与麦克风相关联的信号的系统和技术。该系统包括麦克风组件和前置放大器。麦克风组件包含在外壳中。前置放大器包括接收由麦克风组件产生的信号的输入缓冲器。输入缓冲器还产生与信号相比包括直流（DC）电压偏移的输出信号，其中前置放大器基于控制信号控制DC电压偏移的程度。

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