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    • 2. 发明申请
    • Techniques for Computing Capacitances in a Medium With Three-Dimensional Conformal Dielectrics
    • 用三维适形电介质计算电容的技术
    • US20100122223A1
    • 2010-05-13
    • US12267599
    • 2008-11-09
    • Ibrahim M. ElfadelTarek A. El-Moselhy
    • Ibrahim M. ElfadelTarek A. El-Moselhy
    • G06F17/50
    • G06F17/5036
    • Techniques for capacitance extraction from an integrated circuit design are provided. In one aspect, a method for determining coupling capacitance between conductors within an integrated circuit design is provided comprising the following steps. A three-dimensional representation of the integrated circuit design is generated based on three-dimensional technology and three-dimensional geometric input about the integrated circuit. Conductors of interest are selected from the design. Three-dimensional coupling capacitance between the selected conductors is determined. Further, a first and a second conductor can be selected from the conductors of interest. A Gaussian surface can be created around the first conductor. A random walk path can be created starting at a randomly selected point on the Gaussian surface and terminating on the second conductor. The random walk path can be used to compute the three-dimensional coupling capacitance between the first and second conductors, which can be separated from one another by multilayered dielectric media.
    • 提供了从集成电路设计中提取电容的技术。 一方面,提供一种用于确定集成电路设计内的导体之间的耦合电容的方法,包括以下步骤。 基于集成电路的三维技术和三维几何输入生成集成电路设计的三维表示。 感兴趣的导体从设计中选出。 确定所选导体之间的三维耦合电容。 此外,可以从感兴趣的导体中选择第一和第二导体。 可以围绕第一导体创建高斯表面。 可以从高斯表面上随机选择的点开始并终止于第二导体上创建随机游走路径。 随机游走路径可用于计算第一和第二导体之间的三维耦合电容,其可以通过多层电介质彼此分离。