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1. 发明申请

US20190260138A1 SCALABLE PHASED ARRAY PACKAGE 审中-公开
公开(公告)号：US20190260138A1
公开(公告)日：2019-08-22
申请号：US15901400
申请日：2018-02-21
申请人： International Business Machines Corporation
发明人： Xiaoxiong Gu , Wooram Lee , Duixian Liu , Christian Wilhelmus Baks , Alberto Valdes-Garcia
IPC分类号： H01Q21/06 , H01L23/367 , H01L23/66 , H01L23/00 , H05K1/18 , H01L21/56 , H01Q1/22 , H01Q23/00
摘要： Techniques regarding a scalable phased array are provided. For example, various embodiments described herein can comprise a plurality of integrated circuits having respective flip chip pads, and an antenna-in-package substrate having a ball grid array terminal and a plurality of transmission lines. The plurality of transmission lines can be embedded within the antenna-in-package substrate and can operatively couple the respective flip chip pads to the ball grid array terminal. In one or more embodiments, a die can comprise the plurality of integrated circuits. Further, in one or more embodiments a combiner can also be embedded in the antenna-in-package substrate. The combiner can join the plurality of transmission lines.

2. 发明授权

US09985346B2 Wireless communications package with integrated antennas and air cavity 有权
公开(公告)号：US09985346B2
公开(公告)日：2018-05-29
申请号：US15404182
申请日：2017-01-11
申请人： International Business Machines Corporation
发明人： Christian Wilhelmus Baks , Xiaoxiong Gu , Duixian Liu , Alberto Valdes-Garcia
IPC分类号： H01Q1/22 , H01Q1/42 , H01Q1/48 , H01Q9/04 , H01Q13/10
CPC分类号： H01Q1/42 , H01L23/367 , H01L23/49827 , H01L23/66 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L2223/6627 , H01L2223/6677 , H01L2224/131 , H01L2224/16227 , H01L2224/16235 , H01L2224/32225 , H01L2224/73253 , H01L2924/1421 , H01L2924/15321 , H01L2924/3025 , H01Q1/22 , H01Q1/2291 , H01Q1/48 , H01Q9/0457 , H01Q13/10 , H01Q19/10 , H01Q21/065 , H01Q23/00 , H01L2924/014
摘要： Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes a package carrier and a package cover. The package carrier includes an antenna ground plane and an antenna feed line. The package cover includes a planar lid having a planar antenna element formed on a first surface of the planar lid. The package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element aligned to the antenna ground plane and the antenna feed line of the package carrier, wherein the first surface of the planar lid is disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the package carrier.

3. 发明申请

US20230074376A1 PHASED ARRAY SYSTEM-IN PACKAGE SUPPORTING SPATIO-SPECTRAL DIVISION MULTIPLEXING 有权
公开(公告)号：US20230074376A1
公开(公告)日：2023-03-09
申请号：US17468586
申请日：2021-09-07
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , FUJIKURA LTD
发明人： Alberto Valdes Garcia , Arun Paidimarri , Bodhisatwa Sadhu , Jean-Olivier Plouchart , Xiaoxiong Gu , Christian Wilhelmus Baks , Yo Yamaguchi , Kiyoshi Kobayashi , Yoshiharu Fujisaku , Ning Guan
IPC分类号： H01Q3/26 , H04B7/06 , H01Q1/24
摘要： A phased array antenna includes an antenna array substrate having a plurality of antenna elements. At least two beamformers are coupled to the plurality of antenna elements. At least two filters support different frequency bands and are respectively coupled to the at least two beamformers. A frequency converter is coupled to the at least two filters, the frequency converter including one intermediate frequency (IF) port and at least two radio frequency (RF) ports. The one IF port of the frequency converter is configured to support the at least two beamformers via the at least two RF ports. A first beamformer of the at least two beamformers is coupled to a first filter of the at least two filters to form a first beam in a direction different than a second beamformer of the first two beamformers coupled to a second filter of the at least two filters.

4. 发明授权

US10784563B2 Scalable phased array package 有权
公开(公告)号：US10784563B2
公开(公告)日：2020-09-22
申请号：US15901371
申请日：2018-02-21
申请人： International Business Machines Corporation
发明人： Xiaoxiong Gu , Wooram Lee , Duixian Liu , Christian Wilhelmus Baks , Alberto Valdes-Garcia
IPC分类号： H01L21/00 , H01Q1/22 , H01L23/66 , H01L23/00 , H05K1/18 , H01Q23/00 , H01Q21/00 , H01Q21/06 , H01L23/367
摘要： Techniques regarding a scalable phased array are provided. For example, various embodiments described herein can comprise a plurality of integrated circuits having respective flip chip pads, and an antenna-in-package substrate having a ball grid array terminal and a plurality of transmission lines. The plurality of transmission lines can be embedded within the antenna-in-package substrate and can operatively couple the respective flip chip pads to the ball grid array terminal. In one or more embodiments, a die can comprise the plurality of integrated circuits. Further, in one or more embodiments a combiner can also be embedded in the antenna-in-package substrate. The combiner can join the plurality of transmission lines.

5. 发明申请

US20130247362A1 INTEGRATED ELECTROMECHANICAL RELAYS 有权
标题翻译：集成电力继电器
公开(公告)号：US20130247362A1
公开(公告)日：2013-09-26
申请号：US13898576
申请日：2013-05-21
申请人： International Business Machines Corporation
发明人： Christian Wilhelmus Baks , Richard A. John , Young Hoon Kwark
IPC分类号： H01H49/00
CPC分类号： H01H49/00 , H01F2007/068 , H01H50/005 , H01H50/16 , Y10T29/49075
摘要： Electromechanical relays and semiconductor structures and microelectromechanical systems including at least part of an electromechanical relay are presented. For example, an electromechanical relay includes an electrically conductive terminal within a printed circuit board, one or more electrically conductive contacts, and one or more magnetic actuators. The one or more magnetic actuators are respectively associated with the one or more electrically conductive contacts and each magnetic actuator includes (i) a magnetic core within at least one via extending through one or more layers of the printed circuit board, and (ii) an electrical coil around at least a portion of the magnetic core and within one or more layers of the printed circuit board. Activation of the one or more actuators causes electrical contact between the terminal and an associated one of the one or more electrically conductive contacts.
摘要翻译：提出了机电继电器和半导体结构以及包括机电继电器的至少一部分的微机电系统。例如，机电继电器包括印刷电路板内的导电端子，一个或多个导电触点和一个或多个磁性致动器。一个或多个磁性致动器分别与一个或多个导电触点相关联，并且每个磁性致动器包括（i）延伸穿过印刷电路板的一个或多个层的至少一个通孔内的磁芯，以及（ii）围绕磁芯的至少一部分并且在印刷电路板的一个或多个层内的电线圈。一个或多个致动器的激活导致端子与一个或多个导电触点中相关联的一个之间的电接触。

6. 发明授权

US10826194B2 Scalable phased array package 有权
公开(公告)号：US10826194B2
公开(公告)日：2020-11-03
申请号：US15901400
申请日：2018-02-21
申请人： International Business Machines Corporation
发明人： Xiaoxiong Gu , Wooram Lee , Duixian Liu , Christian Wilhelmus Baks , Alberto Valdes-Garcia
IPC分类号： H01Q23/00 , H01Q21/06 , H01L23/66 , H01L23/00 , H05K1/18 , H01L21/56 , H01Q1/22 , H01L23/367 , H01L23/13
摘要： Techniques regarding a scalable phased array are provided. For example, various embodiments described herein can comprise a plurality of integrated circuits having respective flip chip pads, and an antenna-in-package substrate having a ball grid array terminal and a plurality of transmission lines. The plurality of transmission lines can be embedded within the antenna-in-package substrate and can operatively couple the respective flip chip pads to the ball grid array terminal. In one or more embodiments, a die can comprise the plurality of integrated circuits. Further, in one or more embodiments a combiner can also be embedded in the antenna-in-package substrate. The combiner can join the plurality of transmission lines.

7. 发明申请

US20190260109A1 SCALABLE PHASED ARRAY PACKAGE 审中-公开
公开(公告)号：US20190260109A1
公开(公告)日：2019-08-22
申请号：US15901371
申请日：2018-02-21
申请人： International Business Machines Corporation
发明人： Xiaoxiong Gu , Wooram Lee , Duixian Liu , Christian Wilhelmus Baks , Alberto Valdes-Garcia
IPC分类号： H01Q1/22 , H01L23/367 , H01L23/66 , H01L23/00 , H05K1/18 , H01Q23/00 , H01Q21/00 , H01Q21/06
摘要： Techniques regarding a scalable phased array are provided. For example, various embodiments described herein can comprise a plurality of integrated circuits having respective flip chip pads, and an antenna-in-package substrate having a ball grid array terminal and a plurality of transmission lines. The plurality of transmission lines can be embedded within the antenna-in-package substrate and can operatively couple the respective flip chip pads to the ball grid array terminal. In one or more embodiments, a die can comprise the plurality of integrated circuits. Further, in one or more embodiments a combiner can also be embedded in the antenna-in-package substrate. The combiner can join the plurality of transmission lines.

8. 发明授权

US09620464B2 Wireless communications package with integrated antennas and air cavity 有权
公开(公告)号：US09620464B2
公开(公告)日：2017-04-11
申请号：US14663702
申请日：2015-03-20
申请人： International Business Machines Corporation
发明人： Christian Wilhelmus Baks , Xiaoxiong Gu , Duixian Liu , Alberto Valdes-Garcia
IPC分类号： H01Q1/22 , H01L23/66 , H01Q13/10 , H01Q1/42 , H01Q19/10 , H01Q1/48 , H01Q9/04 , H01Q21/06 , H01Q23/00 , H01L23/498 , H01L23/367 , H01L23/00
CPC分类号： H01Q1/42 , H01L23/367 , H01L23/49827 , H01L23/66 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L2223/6627 , H01L2223/6677 , H01L2224/131 , H01L2224/16227 , H01L2224/16235 , H01L2224/32225 , H01L2224/73253 , H01L2924/1421 , H01L2924/15321 , H01L2924/3025 , H01Q1/22 , H01Q1/2291 , H01Q1/48 , H01Q9/0457 , H01Q13/10 , H01Q19/10 , H01Q21/065 , H01Q23/00 , H01L2924/014
摘要： Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes a package carrier and a package cover. The package carrier includes an antenna ground plane and an antenna feed line. The package cover includes a planar lid having a planar antenna element formed on a first surface of the planar lid. The package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element aligned to the antenna ground plane and the antenna feed line of the package carrier, wherein the first surface of the planar lid is disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the package carrier.

9. 发明申请

US20160049723A1 WIRELESS COMMUNICATIONS PACKAGE WITH INTEGRATED ANTENNAS AND AIR CAVITY 有权
标题翻译：具有集成天线和空气密度的无线通信包
公开(公告)号：US20160049723A1
公开(公告)日：2016-02-18
申请号：US14663702
申请日：2015-03-20
申请人： International Business Machines Corporation
发明人： Christian Wilhelmus Baks , Xiaoxiong Gu , Duixian Liu , Alberto Valdes-Garcia
IPC分类号： H01Q1/42 , H01Q1/48
CPC分类号： H01Q1/42 , H01L23/367 , H01L23/49827 , H01L23/66 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L2223/6627 , H01L2223/6677 , H01L2224/131 , H01L2224/16227 , H01L2224/16235 , H01L2224/32225 , H01L2224/73253 , H01L2924/1421 , H01L2924/15321 , H01L2924/3025 , H01Q1/22 , H01Q1/2291 , H01Q1/48 , H01Q9/0457 , H01Q13/10 , H01Q19/10 , H01Q21/065 , H01Q23/00 , H01L2924/014
摘要： Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes a package carrier and a package cover. The package carrier includes an antenna ground plane and an antenna feed line. The package cover includes a planar lid having a planar antenna element formed on a first surface of the planar lid. The package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element aligned to the antenna ground plane and the antenna feed line of the package carrier, wherein the first surface of the planar lid is disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the package carrier.
摘要翻译：提供天线封装结构以实现无线通信封装。例如，天线组件包括封装载体和封装盖。封装载体包括天线接地平面和天线馈线。封装盖包括平面盖，其具有形成在平面盖的第一表面上的平面天线元件。封装盖结合到封装载体的第一表面，其中平面盖的第一表面面向封装载体的第一表面，并且平面天线元件与天线接地平面和封装的天线馈线相对准载体，其中平面盖的第一表面设置在距离封装载体的第一表面一定距离处，以在平面天线元件和封装载体之间提供空气空间。

10. 发明申请

US20220328375A1 CO-PACKAGED OPTICAL MODULE 有权
公开(公告)号：US20220328375A1
公开(公告)日：2022-10-13
申请号：US17225075
申请日：2021-04-07
申请人： International Business Machines Corporation
发明人： Mark D. Schultz , Fuad Elias Doany , Benjamin Giles Lee , Daniel M. Kuchta , Christian Wilhelmus Baks
IPC分类号： H01L23/367 , H01L25/16 , G02B6/42
摘要： An optical module includes an optoelectronic assembly and a heat spreader. The optoelectronic assembly includes a flat, rigid substrate, an array of electrical contacts positioned on a first portion of the substrate, and an optoelectronics assemblage that is electrically connected to the array of contacts and is positioned apart from the array of electrical contacts. The heat spreader is comprised of a thermally conductive material and comprises a second portion that is structurally connected to the first portion and a third portion that is thermally connected to the optoelectronics assemblage.

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