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1. 发明授权

US11189905B2 Integrated antenna array packaging structures and methods 有权
公开(公告)号：US11189905B2
公开(公告)日：2021-11-30
申请号：US15953075
申请日：2018-04-13
申请人： International Business Machines Corporation
发明人： Xiaoxiong Gu , Duixian Liu , Christian W. Baks , Alberto Valdes Garcia
IPC分类号： H01Q1/22 , H01L23/66 , H01Q21/06 , H01L21/66 , H01L23/367 , H01L23/538 , H01L23/00 , H01L21/48 , H01Q21/00
摘要： An apparatus includes an antenna array package cover comprising a radiating surface, a mating surface disposed opposite the radiating surface, and an array of antenna array sub-patterns wherein each antenna array sub-pattern comprises at least one antenna element. The antenna array package also includes an array of sub-pattern interface packages mated to the mating surface of the antenna array package cover. Each sub-pattern interface package of the array of sub-pattern interface packages comprises a package carrier, a sub-pattern integrated circuit electrically and mechanically coupled to the package carrier, and a set of interface lines corresponding to the antenna elements of the antenna array sub-pattern that corresponds to the sub-pattern interface package. Methods for mounting the above apparatus into a host circuit are also disclosed herein.

2. 发明授权

US11177843B2 Efficiency antenna impedance matching 有权
公开(公告)号：US11177843B2
公开(公告)日：2021-11-16
申请号：US16362639
申请日：2019-03-23
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Bodhisatwa Sadhu , Duixian Liu , Arun Paidimarri
IPC分类号： H04B1/04 , H04B1/44 , H01Q9/16 , H01Q7/00
摘要： A device includes a transmitter. A main antenna is coupled to the transmitter. A matching network coupled to the transmitter and configured to match an impedance of the main antenna, wherein one or more components of the matching network provide a desired radiation.

3. 发明授权

US10784563B2 Scalable phased array package 有权
公开(公告)号：US10784563B2
公开(公告)日：2020-09-22
申请号：US15901371
申请日：2018-02-21
申请人： International Business Machines Corporation
发明人： Xiaoxiong Gu , Wooram Lee , Duixian Liu , Christian Wilhelmus Baks , Alberto Valdes-Garcia
IPC分类号： H01L21/00 , H01Q1/22 , H01L23/66 , H01L23/00 , H05K1/18 , H01Q23/00 , H01Q21/00 , H01Q21/06 , H01L23/367
摘要： Techniques regarding a scalable phased array are provided. For example, various embodiments described herein can comprise a plurality of integrated circuits having respective flip chip pads, and an antenna-in-package substrate having a ball grid array terminal and a plurality of transmission lines. The plurality of transmission lines can be embedded within the antenna-in-package substrate and can operatively couple the respective flip chip pads to the ball grid array terminal. In one or more embodiments, a die can comprise the plurality of integrated circuits. Further, in one or more embodiments a combiner can also be embedded in the antenna-in-package substrate. The combiner can join the plurality of transmission lines.

4. 发明申请

US20200161744A1 WIRELESS COMMUNICATIONS PACKAGE WITH INTEGRATED ANTENNA ARRAY 审中-公开
公开(公告)号：US20200161744A1
公开(公告)日：2020-05-21
申请号：US16750861
申请日：2020-01-23
申请人： International Business Machines Corporation , Ericsson AB
发明人： Christian W. Baks , Daniel J. Friedman , Xiaoxiong Gu , Duixian Liu , Alberto Valdes Garcia , Joakim Hallin , Ola Ragnar Tageman
IPC分类号： H01Q1/22 , H01Q21/24 , H01Q9/04 , H01Q1/52 , H01Q1/48 , H01Q1/38 , H01Q21/06
摘要： Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes multilayer package substrate, a planar antenna array, antenna feed lines, and resistive transmission lines. The planar antenna array includes an array of active antenna elements and dummy antenna elements surrounding the array of active antenna elements. Each active antenna element is coupled to a corresponding one of the antenna feed lines, and each dummy antenna element is coupled to a corresponding one of the resistive transmission lines. Each resistive transmission line extends through the multilayer package substrate and is terminated in a same metallization layer of the multilayer package substrate.

5. 发明申请

US20180076526A1 ANTENNA-IN-PACKAGE STRUCTURES WITH BROADSIDE AND END-FIRE RADIATIONS 审中-公开
公开(公告)号：US20180076526A1
公开(公告)日：2018-03-15
申请号：US14796062
申请日：2015-07-10
申请人： International Business Machines Corporation
发明人： Alberto V. Garcia , Xiaoxiong Gu , Duixian Liu
IPC分类号： H01Q9/04 , H01Q19/30 , H01Q23/00
CPC分类号： H01Q9/0407 , G06K19/077 , G06K19/07749 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/33 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/17517 , H01L2224/32013 , H01L2224/32014 , H01L2224/32225 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2924/15192 , H01L2924/15321 , H01L2924/15322 , H01Q1/38 , H01Q19/30 , H01Q21/28 , H01Q23/00 , H01L2924/014 , H01L2924/00012 , H01L2924/00
摘要： Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.

6. 发明授权

US09660345B1 Millimeter-wave communications on a multifunction platform 有权
公开(公告)号：US09660345B1
公开(公告)日：2017-05-23
申请号：US15157841
申请日：2016-05-18
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Xiaoxiong Gu , Duixian Liu , Bodhisatwa Sadhu , Alberto Valdes Garcia
IPC分类号： H04B7/00 , H01Q9/04 , H04W16/28 , H01Q7/00 , H01Q1/24 , H01Q1/50 , H04B1/04
CPC分类号： H01Q7/00 , H01Q21/06 , H01Q21/061 , H01Q25/00 , H03F3/24 , H04B1/40 , H04W16/28
摘要： A millimeter-wave (MMW) communication system may include an antenna array structure operating within a MMW band, having both a first antenna coupling point and a second antenna coupling point, whereby the first and the second location of the antenna coupling points are within a coplanar surface on which the antenna array structure is formed. The system may further include a single MMW transmitter device having a power splitter that splits a data modulated MMW signal into a first MMW data modulated signal and a second MMW data modulated signal identical to the first MMW data modulated signal, such that the first data modulated MMW signal is coupled to the first antenna coupling point for radio propagation at a first direction, and the second data modulated MMW signal is coupled to the second antenna coupling point for radio propagation at a second direction.

7. 发明授权

US09577314B2 Hybrid on-chip and package antenna 有权
标题翻译：混合片上和封装天线
公开(公告)号：US09577314B2
公开(公告)日：2017-02-21
申请号：US13796404
申请日：2013-03-12
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Duixian Liu , Arun S. Natarajan , Jean-Olivier Plouchart , Scott K. Reynolds
IPC分类号： H01Q1/22 , H01Q1/36 , H01L21/50 , H01L23/522 , H01L21/302 , H01L21/48 , H01L23/66
CPC分类号： H01Q15/142 , H01L21/302 , H01L21/486 , H01L21/50 , H01L23/5227 , H01L23/66 , H01L25/50 , H01L2223/6677 , H01L2224/0401 , H01L2224/04042 , H01L2224/0557 , H01L2224/16225 , H01Q1/2283 , H01Q1/36 , H01Q1/38 , H01Q9/0407
摘要： Antenna devices, antenna systems and methods of their fabrication are disclosed. One such antenna device includes a semiconductor chip and a chip package. The semiconductor chip includes at least one antenna that is integrated into a dielectric layer of the semiconductor chip and is configured to transmit electromagnetic waves. In addition, the chip package includes at least one ground plane, where the semiconductor chip is mounted on the chip package such that the ground plane(s) is disposed at a predetermined distance from the antenna to implement a reflection of at least a portion of the electromagnetic waves.
摘要翻译：公开了天线装置，天线系统及其制造方法。一种这样的天线装置包括半导体芯片和芯片封装。半导体芯片包括集成到半导体芯片的电介质层中的至少一个天线，并被配置为传输电磁波。此外，芯片封装包括至少一个接地平面，其中半导体芯片安装在芯片封装上，使得接地平面设置在离天线预定距离处，以实现至少一部分电磁波。

8. 发明授权

US09537224B2 Phased-array transceiver 有权
标题翻译：相控阵收发器
公开(公告)号：US09537224B2
公开(公告)日：2017-01-03
申请号：US14725161
申请日：2015-05-29
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Daniel J. Friedman , Xiaoxiong Gu , Duixian Liu , Arun S. Natarajan , Scott K. Reynolds , Alberto Valdes Garcia
IPC分类号： H01Q21/06 , H01Q23/00 , H04B7/04
CPC分类号： H01Q21/061 , H01L2224/16225 , H01Q21/065 , H01Q23/00 , H04B7/04 , Y10T29/49016
摘要： Systems, methods, devices and apparatuses directed to transceiver devices are disclosed. In accordance with one method, a first set of antenna positions in a first section of a set of sections of a circuit layout for the circuit package is selected. The method further includes selecting another set of antenna positions in another section of the circuit layout such that an arrangement of selected antenna positions of the other set is different from an arrangement of selected antenna positions of a previously selected set of antenna positions. The selecting another set of positions in another section is iterated until selections have been made for a total number of antennas. The selecting the other set is performed such that consecutive unselected positions in the other section do not exceed a predetermined number of positions. In addition, antenna elements are formed at the selected positions to fabricate the circuit package.
摘要翻译：公开了针对收发器设备的系统，方法，设备和设备。根据一种方法，选择电路封装的电路布局的一组部分的第一部分中的第一组天线位置。该方法还包括在电路布局的另一部分中选择另一组天线位置，使得另一组的所选择的天线位置的布置与先前选择的一组天线位置的选定天线位置的布置不同。迭代在另一部分中选择另一组位置，直到对天线总数进行选择。执行另一组的选择，使得另一部分中的连续未选定位置不超过预定数量的位置。此外，天线元件形成在所选择的位置以制造电路封装。

9. 发明授权

US09472859B2 Integration of area efficient antennas for phased array or wafer scale array antenna applications 有权
标题翻译：集成面积有效的天线，用于相控阵或晶圆尺寸阵列天线应用
公开(公告)号：US09472859B2
公开(公告)日：2016-10-18
申请号：US14281951
申请日：2014-05-20
申请人： International Business Machines Corporation
发明人： Bing Dang , Duixian Liu , Jean-Olivier Plouchart , Peter Jerome Sorce , Cornelia Kang-I Tsang
IPC分类号： H01Q21/00 , H01Q1/22 , H01Q21/06
CPC分类号： H01Q21/065 , H01L2223/6677 , H01L2224/0401 , H01L2224/0557 , H01L2224/16225 , H01L2224/16227 , H01L2224/48227 , H01L2924/15192 , H01Q1/2208 , H01Q1/2283 , H01Q1/48 , H01Q21/0075
摘要： Package structures are provided for integrally packaging antennas with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter-wave and terahertz frequency ranges. For example, a package structure includes an RFIC chip, and an antenna package bonded to the RFIC chip. The antenna package includes a glass substrate, at least one planar antenna element formed on a first surface of the glass substrate, a ground plane formed on a second surface of the glass substrate, opposite the first surface, and an antenna feed line formed through the glass substrate and connected to the at least one planar antenna element. The antenna package is bonded to a surface of the RFIC chip using a layer of adhesive material.
摘要翻译：提供封装结构，用于将天线与半导体RFIC（射频集成电路）芯片整体封装，以形成在毫米波和太赫兹频率范围内工作的紧凑型集成无线电/无线通信系统。例如，封装结构包括RFIC芯片和结合到RFIC芯片的天线封装。天线封装包括玻璃基板，形成在玻璃基板的第一表面上的至少一个平面天线元件，形成在玻璃基板的与第一表面相对的第二表面上的接地平面，以及通过玻璃基板并连接到所述至少一个平面天线元件。使用一层粘合剂材料将天线封装结合到RFIC芯片的表面。

10. 发明申请

US20160056544A1 ANTENNA-IN-PACKAGE STRUCTURES WITH BROADSIDE AND END-FIRE RADIATIONS 有权
公开(公告)号：US20160056544A1
公开(公告)日：2016-02-25
申请号：US14796100
申请日：2015-07-10
申请人： International Business Machines Corporation
发明人： Alberto V. Garcia , Xiaoxiong Gu , Duixian Liu
IPC分类号： H01Q21/28 , H01Q9/04 , H01Q1/38
CPC分类号： H01Q9/0407 , G06K19/077 , G06K19/07749 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/33 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/17517 , H01L2224/32013 , H01L2224/32014 , H01L2224/32225 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2924/15192 , H01L2924/15321 , H01L2924/15322 , H01Q1/38 , H01Q19/30 , H01Q21/28 , H01Q23/00 , H01L2924/014 , H01L2924/00012 , H01L2924/00
摘要： Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.

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