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1. 发明授权

US09673089B2 Interconnect structure with enhanced reliability 有权
公开(公告)号：US09673089B2
公开(公告)日：2017-06-06
申请号：US14529431
申请日：2014-10-31
申请人： International Business Machines Corporation
发明人： Griselda Bonilla , Kaushik Chanda , Robert D. Edwards , Ronald G. Filippi , Andrew H. Simon , Ping-Chuan Wang
IPC分类号： H01L23/48 , H01L21/768 , H01L23/532
CPC分类号： H01L21/76834 , H01L21/76819 , H01L21/76829 , H01L21/76849 , H01L23/53223 , H01L23/53238 , H01L23/53266 , H01L2924/0002 , H01L2924/00
摘要： An improved interconnect structure including a dielectric layer having a conductive feature embedded therein, the conductive feature having a first top surface that is substantially coplanar with a second top surface of the dielectric layer; a metal cap layer located directly on the first top surface, wherein the metal cap layer does not substantially extend onto the second top surface; a first dielectric cap layer located directly on the second top surface, wherein the first dielectric cap layer does not substantially extend onto the first top surface and the first dielectric cap layer is thicker than the metal cap layer; and a second dielectric cap layer on the metal cap layer and the first dielectric cap layer. A method of forming the interconnect structure is also provided.

2. 发明授权

US09360525B2 Stacked via structure for metal fuse applications 有权
标题翻译：金属保险丝应用的堆叠通孔结构
公开(公告)号：US09360525B2
公开(公告)日：2016-06-07
申请号：US14188728
申请日：2014-02-25
申请人： International Business Machines Corporation
发明人： Griselda Bonilla , Kaushik Chanda , Ronald G. Filippi , Stephan Grunow , Naftali E. Lustig , Andrew H. Simon , Ping-Chuan Wang
IPC分类号： G01R31/327 , H01L23/58 , G01R31/02 , G01R31/04 , G01R31/07
CPC分类号： H01L23/5226 , G01R31/025 , G01R31/04 , G01R31/07 , G01R31/327 , H01L23/5256 , H01L23/53223 , H01L23/53238 , H01L23/53252 , H01L23/53295 , H01L23/58 , H01L2924/0002 , H01L2924/00
摘要： A back end of the line (BEOL) fuse structure having a stack of vias. The stacking of vias leads to high aspect ratios making liner and seed coverage inside the vias poorer. The weakness of the liner and seed layers leads to a higher probability of electromigration (EM) failure. The fuse structure addresses failures due to poor liner and seed coverage. Design features permit determining where failures occur, determining the extent of the damaged region after fuse programming and preventing further propagation of the damaged dielectric region.
摘要翻译：线路的后端（BEOL）保险丝结构具有一叠通孔。通孔的堆叠导致高的纵横比，使得通孔内的衬里和种子覆盖较差。衬里和种子层的弱点导致电迁移（EM）故障的较高概率。保险丝结构由于衬垫和种子覆盖不良而解决故障。设计特征允许确定故障发生的位置，确定熔丝编程之后受损区域的程度，并防止损坏的介质区域的进一步传播。

3. 发明申请

US20150056806A1 INTERCONNECT STRUCTURE WITH ENHANCED RELIABILITY 有权
标题翻译：具有增强可靠性的互连结构
公开(公告)号：US20150056806A1
公开(公告)日：2015-02-26
申请号：US14529431
申请日：2014-10-31
申请人： International Business Machines Corporation
发明人： Griselda Bonilla , Kaushik Chanda , Robert D. Edwards , Ronald G. Filippi , Andrew H. Simon , Ping-Chuan Wang
IPC分类号： H01L21/768
CPC分类号： H01L21/76834 , H01L21/76819 , H01L21/76829 , H01L21/76849 , H01L23/53223 , H01L23/53238 , H01L23/53266 , H01L2924/0002 , H01L2924/00
摘要： An improved interconnect structure including a dielectric layer having a conductive feature embedded therein, the conductive feature having a first top surface that is substantially coplanar with a second top surface of the dielectric layer; a metal cap layer located directly on the first top surface, wherein the metal cap layer does not substantially extend onto the second top surface; a first dielectric cap layer located directly on the second top surface, wherein the first dielectric cap layer does not substantially extend onto the first top surface and the first dielectric cap layer is thicker than the metal cap layer; and a second dielectric cap layer on the metal cap layer and the first dielectric cap layer. A method of forming the interconnect structure is also provided.
摘要翻译：一种改进的互连结构，其包括具有嵌入其中的导电特征的介电层，所述导电特征具有与介电层的第二顶表面基本共面的第一顶表面; 金属盖层直接位于第一顶表面上，其中金属盖层基本上不延伸到第二顶表面上; 位于所述第二顶表面上的第一电介质盖层，其中所述第一电介质盖层基本上不延伸到所述第一顶表面上，并且所述第一电介质盖层比所述金属盖层厚; 以及金属盖层和第一电介质盖层上的第二电介质盖层。还提供了形成互连结构的方法。

4. 发明授权

US08716071B2 Methods and systems involving electrically reprogrammable fuses 有权
标题翻译：涉及电可重新编程保险丝的方法和系统
公开(公告)号：US08716071B2
公开(公告)日：2014-05-06
申请号：US13775570
申请日：2013-02-25
申请人： International Business Machines Corporation
发明人： Kaushik Chanda , Lynne M. Gignac , Wai-Kin Li , Ping-Chuan Wang
IPC分类号： H01L21/82
CPC分类号： G11C17/16 , H01L21/7682 , H01L23/5256 , H01L2924/0002 , H01L2924/00
摘要： An electrically reprogrammable fuse comprising an interconnect disposed in a dielectric material, a sensing wire disposed at a first end of the interconnect, a first programming wire disposed at a second end of the interconnect, and a second programming wire disposed at a second end of the interconnect, wherein the fuse is operative to form a surface void at the interface between the interconnect and the sensing wire when a first directional electron current is applied from the first programming wire through the interconnect to the second programming wire, and wherein, the fuse is further operative to heal the surface void between the interconnect and the sensing wire when a second directional electron current is applied from the second programming wire through the interconnect to the first programming wire.
摘要翻译：一种电可重新编程的保险丝，其包括设置在电介质材料中的互连，布置在所述互连的第一端的感测线，布置在所述互连的第二端的第一编程线，以及设置在所述互连的第二端的第二编程线其中当从所述第一编程线通过所述互连件施加第一定向电子线到所述第二编程线时，所述保险丝可操作以在所述互连和感测线之间的界面处形成表面空隙，并且其中，所述保险丝是当从所述第二编程线通过所述互连件施加第二编程线到所述第一编程线时，还可操作以治愈所述互连和所述感测线之间的表面空隙。

5. 发明申请

US20130176805A1 METHODS AND SYSTEMS INVOLVING ELECTRICALLY REPROGRAMMABLE FUSES 有权
公开(公告)号：US20130176805A1
公开(公告)日：2013-07-11
申请号：US13775570
申请日：2013-02-25
申请人： International Business Machines Corporation
发明人： Kaushik Chanda , Lynne M. Gignac , Wai-Kin LI , Ping-Chuan Wang
IPC分类号： G11C17/16
CPC分类号： G11C17/16 , H01L21/7682 , H01L23/5256 , H01L2924/0002 , H01L2924/00
摘要： An electrically reprogrammable fuse comprising an interconnect disposed in a dielectric material, a sensing wire disposed at a first end of the interconnect, a first programming wire disposed at a second end of the interconnect, and a second programming wire disposed at a second end of the interconnect, wherein the fuse is operative to form a surface void at the interface between the interconnect and the sensing wire when a first directional electron current is applied from the first programming wire through the interconnect to the second programming wire, and wherein, the fuse is further operative to heal the surface void between the interconnect and the sensing wire when a second directional electron current is applied from the second programming wire through the interconnect to the first programming wire.

6. 发明授权

US10229875B2 Stacked via structure for metal fuse applications 有权
公开(公告)号：US10229875B2
公开(公告)日：2019-03-12
申请号：US15072400
申请日：2016-03-17
申请人： International Business Machines Corporation
发明人： Griselda Bonilla , Kaushik Chanda , Ronald G. Filippi , Stephan Grunow , Naftali E. Lustig , Andrew H. Simon , Ping-Chuan Wang
IPC分类号： H01L23/52 , H01L23/522 , H01L23/58 , G01R31/02 , G01R31/04 , G01R31/07 , G01R31/327 , H01L23/525 , H01L23/532
摘要： A back end of the line (BEOL) fuse structure having a stack of vias. The stacking of vias leads to high aspect ratios making liner and seed coverage inside the vias poorer. The weakness of the liner and seed layers leads to a higher probability of electromigration (EM) failure. The fuse structure addresses failures due to poor liner and seed coverage. Design features permit determining where failures occur, determining the extent of the damaged region after fuse programming and preventing further propagation of the damaged dielectric region.

7. 发明授权

US08866257B2 System involving electrically reprogrammable fuses 有权
标题翻译：涉及电可重新编程保险丝的系统
公开(公告)号：US08866257B2
公开(公告)日：2014-10-21
申请号：US14190514
申请日：2014-02-26
申请人： International Business Machines Corporation
发明人： Kaushik Chanda , Lynne M. Gignac , Wai-Kin Ll , Ping-Chaun Wang
IPC分类号： H01L29/00 , G11C17/16
CPC分类号： G11C17/16 , H01L21/7682 , H01L23/5256 , H01L2924/0002 , H01L2924/00
摘要： An electrically reprogrammable fuse comprising an interconnect disposed in a dielectric material, a sensing wire disposed at a first end of the interconnect, a first programming wire disposed at a second end of the interconnect, and a second programming wire disposed at a second end of the interconnect, wherein the fuse is operative to form a surface void at the interface between the interconnect and the sensing wire when a first directional electron current is applied from the first programming wire through the interconnect to the second programming wire, and wherein, the fuse is further operative to heal the surface void between the interconnect and the sensing wire when a second directional electron current is applied from the second programming wire through the interconnect to the first programming wire.
摘要翻译：一种电可重新编程的保险丝，其包括设置在电介质材料中的互连，布置在所述互连的第一端的感测线，布置在所述互连的第二端的第一编程线，以及设置在所述互连的第二端的第二编程线其中当从所述第一编程线通过所述互连件施加第一定向电子线到所述第二编程线时，所述保险丝可操作以在所述互连和感测线之间的界面处形成表面空隙，并且其中，所述保险丝是当从所述第二编程线通过所述互连件施加第二编程线到所述第一编程线时，还可操作以治愈所述互连和所述感测线之间的表面空隙。

8. 发明申请

US20160027733A1 BACK-END ELECTRICALLY PROGRAMMABLE FUSE 有权
公开(公告)号：US20160027733A1
公开(公告)日：2016-01-28
申请号：US14872627
申请日：2015-10-01
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Junjing Bao , Griselda Bonilla , Kaushik Chanda , Samuel S. Choi , Ronald G. Filippi , Stephan Grunow , Naftali E. Lustig , Dan Moy , Andrew H. Simon
IPC分类号： H01L23/525 , H01L23/522
CPC分类号： H01L23/5256 , H01H2085/0275 , H01L21/76805 , H01L21/76807 , H01L21/76811 , H01L21/76816 , H01L23/5226 , H01L2924/0002 , H01L2924/00
摘要： A BEOL e-fuse is disclosed which reliably blows in the via and can be formed even in the tightest pitch BEOL layers. The BEOL e-fuse can be formed utilizing a line first dual damascene process to create a sub-lithographic via to be the programmable link of the e-fuse. The sub-lithographic via can be patterned using standard lithography and the cross section of the via can be tuned to match the target programming current.

9. 发明申请

US20150235946A1 REDUNDANT VIA STRUCTURE FOR METAL FUSE APPLICATIONS 审中-公开
标题翻译：冗余通过金属熔断器应用的结构
公开(公告)号：US20150235946A1
公开(公告)日：2015-08-20
申请号：US14702794
申请日：2015-05-04
申请人： International Business Machines Corporation
发明人： Griselda Bonilla , Kaushik Chanda , Samuel S. Choi , Ronald G. Filippi , Stephan Grunow , Naftali E. Lustig , Andrew H. Simon
IPC分类号： H01L23/525 , H01L23/522
CPC分类号： H01L23/5256 , G11C17/16 , G11C29/702 , H01H2085/466 , H01L23/5226 , H01L23/53223 , H01L23/53238 , H01L23/53252 , H01L23/5329 , H01L23/53295 , H01L2924/0002 , H01L2924/00
摘要： A metal fuse structure using redundant vias. The redundant vias are formed on one metal level in a stacked via metal fuse structure to force failures to occur in the metal level that does not have the redundant vias. The metal fuse structure includes: a first dielectric layer having a metal feature; a second dielectric layer having a first metal connector embedded therein; and a third dielectric layer having a second metal connector embedded therein. The metal connectors include at least one via and one line, and at least one metal connector has at least two vias.
摘要翻译：使用冗余通孔的金属保险丝结构。冗余通孔在堆叠的通孔金属熔断器结构中的一个金属层上形成，以迫使在不具有冗余通孔的金属层中发生故障。金属熔丝结构包括：具有金属特征的第一介电层; 第二电介质层，其中嵌有第一金属连接器; 以及具有嵌入其中的第二金属连接器的第三电介质层。金属连接器包括至少一个通孔和一条线，并且至少一个金属连接器具有至少两个通孔。

10. 发明申请

US20140167772A1 STACKED VIA STRUCTURE FOR METAL FUSE APPLICATIONS 有权
公开(公告)号：US20140167772A1
公开(公告)日：2014-06-19
申请号：US14188728
申请日：2014-02-25
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Griselda Bonilla , Kaushik Chanda , Ronald G. Filippi , Stephan Grunow , Naftali E. Lustig , Andrew H. Simon , Ping-Chuan Wang
IPC分类号： G01R31/327
CPC分类号： H01L23/5226 , G01R31/025 , G01R31/04 , G01R31/07 , G01R31/327 , H01L23/5256 , H01L23/53223 , H01L23/53238 , H01L23/53252 , H01L23/53295 , H01L23/58 , H01L2924/0002 , H01L2924/00
摘要： A back end of the line (BEOL) fuse structure having a stack of vias. The stacking of vias leads to high aspect ratios making liner and seed coverage inside the vias poorer. The weakness of the liner and seed layers leads to a higher probability of electromigration (EM) failure. The fuse structure addresses failures due to poor liner and seed coverage. Design features permit determining where failures occur, determining the extent of the damaged region after fuse programming and preventing further propagation of the damaged dielectric region.

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