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1. 发明授权

US10464291B2 Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board 有权
公开(公告)号：US10464291B2
公开(公告)日：2019-11-05
申请号：US15634853
申请日：2017-06-27
申请人： JX NIPPON MINING & METALS CORPORATION
发明人： Hajime Momoi , Satoru Morioka , Toshiyuki Ono , Hideta Arai , Ryo Fukuchi , Atsushi Miki
IPC分类号： H01L23/373 , B32B15/20 , B32B27/20 , B32B15/01 , B32B37/02 , C25D7/06 , H05K1/09 , H05K3/02 , B32B7/12 , B32B15/08 , B32B15/18 , B32B27/18 , B32B27/28 , B32B27/30 , B32B27/32 , B32B27/34 , B32B27/36 , B32B27/38 , B32B3/26 , B32B38/10 , H01M4/66 , H01R13/03 , H05K1/02 , H05K3/10 , B32B15/04 , C22C9/06 , C25D3/12 , C25D3/38 , C25D9/08
摘要： A copper heat dissipation material having a satisfactory heat dissipation performance is provided. The copper heat dissipation material has an alloy layer containing at least one metal selected from Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn and Mo on one or both surfaces, in which surface roughness Sz of the one or both surfaces, measured by a laser microscope using laser light of 405 nm in wavelength, is 5 μm or more.

2. 发明授权

US10194534B2 Printed wiring board, electronic device, catheter, and metallic material 有权
公开(公告)号：US10194534B2
公开(公告)日：2019-01-29
申请号：US15654801
申请日：2017-07-20
申请人： JX NIPPON MINING & METALS CORPORATION
发明人： Hideta Arai , Atsushi Miki , Satoru Morioka
IPC分类号： H01R13/00 , H05K3/00 , H05K1/02 , H05K1/09 , H05K3/02 , H05K3/34 , H05K3/46 , H05K1/18
摘要： Provided herein is a printed wiring board that can desirably dissipate the heat of a heat-generating component. The printed wiring board includes one or more wires, and one or more heat-generating components. The one or more wires include a rolled copper foil, either partly or as a whole. The one or more heat-generating components and the one or more wires are directly or indirectly connected to each other.

3. 发明申请

US20150237737A1 SURFACE TREATED COPPER FOIL AND LAMINATE USING THE SAME, PRINTED WIRING BOARD, AND COPPER CLAD LAMINATE 有权
标题翻译：表面处理铜箔和使用它的层压板，印刷线路板和铜箔层压板
公开(公告)号：US20150237737A1
公开(公告)日：2015-08-20
申请号：US14342288
申请日：2013-11-11
申请人： JX Nippon Mining & Metals Corporation
发明人： Hideta Arai , Atsushi Miki , Kohsuke Arai , Kaichiro Nakamuro
IPC分类号： H05K3/02 , H05K1/02 , H05K3/36 , H05K1/14 , H05K1/03 , H05K1/09
CPC分类号： H05K3/022 , C25D1/04 , C25D7/0614 , H05K1/028 , H05K1/0346 , H05K1/09 , H05K1/14 , H05K3/361 , H05K3/384 , H05K2201/0154 , H05K2201/0317 , H05K2201/0355 , H05K2201/05 , H05K2201/058 , Y10T29/49126 , Y10T428/12431 , Y10T428/24917 , Y10T428/31681
摘要： A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided. The surface treated copper foil to be laminated on a polyimide having the following ΔB (PI) of 50 or more and 65 or less before being laminated to the copper foil so as to form a copper clad laminate comprising a surface having a color difference ΔE*ab of 50 or more based on JIS Z 8730 through the polyimide and a difference between the top average Bt and the bottom average Bb in a brightness curve extending from an edge of the copper foil to a portion without the copper foil ΔB (ΔB=Bt−Bb) of 40 or more, wherein the brightness curve is obtained from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the copper foil through the polyimide laminated from the surface treated surface side with a CCD camera for the respective observation spots along the perpendicular direction of the extending direction of the observed copper foil.
摘要翻译：一种表面处理的铜箔，其良好地结合到树脂上，并且当通过树脂观察时可以获得良好的可见性，并且提供使用其的层压体。在层压到铜箔上之前，将层压在具有50以上且65以下的Dgr。B（PI）的聚酰亚胺的表面处理铜箔上形成覆铜层压板，其包含具有色差的表面＆Dgr; E * ab为50以上，基于JIS Z 8730通过聚酰亚胺，并且从铜箔边缘延伸到不具有铜箔的部分的亮度曲线中的顶部平均Bt和底部平均Bb之间的差异Dgr ; B（＆Dgr; B = Bt-Bb）为40以上，其中，从通过从表面层压的聚酰亚胺的铜箔的拍摄图像的亮度的测量结果的观察点与亮度曲线获得亮度曲线用CCD照相机，沿着观察到的铜箔的延伸方向的垂直方向对各观察点进行处理。

4. 发明申请

US20210331449A1 Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circuit Board 有权
公开(公告)号：US20210331449A1
公开(公告)日：2021-10-28
申请号：US16498003
申请日：2019-04-22
申请人： JX Nippon Mining & Metals Corporation
发明人： Nobuaki Miyamoto , Atsushi Miki
IPC分类号： B32B15/20 , H05K3/02 , H05K1/09 , H05K3/06 , B32B15/04 , C25D5/14
摘要： A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has a Ni deposited amount of 20 to 200 μg/dm2 and a Zn deposited amount of 20 to 1,000 μg/dm2. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to the first surface treatment layer 3 of the surface treated copper foil 1.

5. 发明授权

US10602620B2 Laminate for printed wiring board, method of manufacturing printed wiring board, and method of manufacturing electronic device 有权
公开(公告)号：US10602620B2
公开(公告)日：2020-03-24
申请号：US15426435
申请日：2017-02-07
申请人： JX Nippon Mining & Metals Corporation
发明人： Atsushi Miki , Kazuki Kanmuri
IPC分类号： H01L29/12 , H05K3/46 , H05K1/09 , H05K1/02 , H05K3/06 , H05K3/10 , H05K1/03 , H05K3/02
摘要： A laminate for printed wiring board is used in a method of manufacturing printed wiring boards that includes a process of forming a circuit by any one of a semi-additive method, a partly additive method, a modified semi-additive method, and an embedding method. The laminate includes an insulating resin substrate, a metal layer 1 and a metal layer 2 in this order. When a cross section that is parallel to the thickness direction of the laminate is processed by means of ion milling and the cross sections of the metal layer 1 and the metal layer 2 were observed with EBSD, each of the metal layer 1 and the metal layer 2 has one or plural crystal grain(s) at the processed cross section, and an area ratio of the total area of crystal grains of which a difference in angle of the crystal direction from a perpendicular of the processed cross section is 15° or less from among the one or plural crystal grains to the total area of the plural crystal grains was 15% or higher but less than 97% in the metal layer 1 and the metal layer 2.

6. 发明授权

US09730332B2 Surface treated copper foil and laminate using the same, printed wiring board, and copper clad laminate 有权
公开(公告)号：US09730332B2
公开(公告)日：2017-08-08
申请号：US14342288
申请日：2013-11-11
申请人： JX Nippon Mining & Metals Corporation
发明人： Hideta Arai , Atsushi Miki , Kohsuke Arai , Kaichiro Nakamuro
IPC分类号： B32B15/01 , H05K1/05 , C25D1/04 , H05K3/02 , H05K1/03 , H05K1/09 , H05K3/36 , H05K1/14 , H05K1/02
CPC分类号： H05K3/022 , C25D1/04 , C25D7/0614 , H05K1/028 , H05K1/0346 , H05K1/09 , H05K1/14 , H05K3/361 , H05K3/384 , H05K2201/0154 , H05K2201/0317 , H05K2201/0355 , H05K2201/05 , H05K2201/058 , Y10T29/49126 , Y10T428/12431 , Y10T428/24917 , Y10T428/31681
摘要： A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided. The surface treated copper foil to be laminated on a polyimide having the following ΔB (PI) of 50 or more and 65 or less before being laminated to the copper foil so as to form a copper clad laminate comprising a surface having a color difference ΔE*ab of 50 or more based on JIS Z 8730 through the polyimide and a difference between the top average Bt and the bottom average Bb in a brightness curve extending from an edge of the copper foil to a portion without the copper foil ΔB (ΔB=Bt−Bb) of 40 or more, wherein the brightness curve is obtained from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the copper foil through the polyimide laminated from the surface treated surface side with a CCD camera for the respective observation spots along the perpendicular direction of the extending direction of the observed copper foil.

7. 发明申请

US20170196083A1 Surface-Treated Copper Foil 审中-公开
公开(公告)号：US20170196083A1
公开(公告)日：2017-07-06
申请号：US15398126
申请日：2017-01-04
申请人： JX Nippon Mining & Metals Corporation
发明人： Atsushi Miki , Ryo Fukuchi , Hideta Arai
IPC分类号： H05K1/09 , C22C30/02 , C25F1/00 , C25D3/38 , C25D3/12 , C23C14/16 , C25D7/06 , C22F1/08 , C23C14/06 , C23C14/34 , C23C14/02 , C22C9/00 , C25D11/38
CPC分类号： H05K1/09 , C22C9/00 , C22C30/02 , C22F1/08 , C25D3/12 , C25D3/38 , C25D3/562 , C25D3/565 , C25D3/58 , C25D5/12 , C25D7/0614 , C25D11/38 , C25F1/00 , H05K3/382 , H05K3/389 , H05K2201/0355
摘要： To provide a surface-treated copper foil that is excellent in adhesiveness to an insulating substrate at ordinary temperature, and is capable of suppressing the formation of blister on application of a thermal load of reflow soldering to a copper-clad laminate board constituted by the copper foil. A surface-treated copper foil having a surface-treated surface, the surface-treated copper foil satisfying one or more of the following conditions (1) to (3): by an XPS measurement at a depth after sputtering from the surface-treated surface for 0.5 min at a rate of 1.1 nm/min (SiO2 conversion), (1) the N concentration is from 1.5 to 7.5 atomic %; (2) the C concentration is from 12 to 30 atomic %; and (3) the Si concentration is 3.1 atomic % or more and the O concentration is from 40 to 48 atomic %.

8. 发明授权

US09232650B2 Surface treated copper foil and laminate using the same 有权
标题翻译：表面处理铜箔和使用其的层压板
公开(公告)号：US09232650B2
公开(公告)日：2016-01-05
申请号：US14342313
申请日：2013-11-11
申请人： JX Nippon Mining & Metals Corporation
发明人： Hideta Arai , Atsushi Miki , Kohsuke Arai , Kaichiro Nakamuro
IPC分类号： H05K1/09 , B32B15/08 , B32B3/00 , H05K1/05 , C25D1/04 , H05K3/38 , C25D5/16 , C25D7/06 , H05K1/14 , H05K3/36 , H05K3/02 , C25D3/38 , C25D3/58
CPC分类号： H05K1/056 , C25D1/04 , C25D3/38 , C25D3/58 , C25D5/16 , C25D7/0692 , H05K1/09 , H05K1/14 , H05K3/022 , H05K3/36 , H05K3/384 , Y10T29/49126 , Y10T428/12431 , Y10T428/24917 , Y10T428/31678
摘要： A surface treated copper foil which is well bonded to a resin and allows the resin to have excellent transparency after removal of the copper foil by etching, and a laminate using the same are provided. A surface treated copper foil having at least one surface with a skewness Rsk of −0.35 to 0.53, comprising an Sv defined by the following expression (1) of 3.5 or more based on a brightness curve: Sv=(ΔB×0.1)/(t1−t2) (1); wherein the brightness curve is obtained from an observation spot versus brightness graph, and the difference between the top average Bt and the bottom average Bb in the brightness curve extending from an edge of the mark to a portion without the mark is represented by ΔB (ΔB=Bt−Bb); and wherein t1 represents a value pointing the position of the intersection closest to the linear mark among the intersections of the brightness curve and Bt in the observation spot versus brightness graph, and t2 represents a value pointing the position of the intersection closest to the linear mark among the intersections of the brightness curve and 0.1ΔB in the range from the intersections of the brightness curve and Bt to a depth of 0.1ΔB with Bt as reference.
摘要翻译：一种表面处理的铜箔，其良好地结合到树脂上，并且通过蚀刻除去铜箔后，树脂具有优异的透明性，并且提供了使用该铜箔的层压体。表面处理铜箔，其具有基于亮度曲线，Sv =（＆Dgr; B×0.1）），具有-0.35〜0.53的偏斜度Rsk的至少一个表面，其包含以下表达式（1）定义为3.5以上的Sv： /（t1-t2）（1）; 其中从观察点与亮度图获得亮度曲线，并且从标记的边缘延伸到没有标记的部分的亮度曲线中的顶部平均Bt和底部平均Bb之间的差由＆Dgr; B （＆Dgr; B = Bt-Bb）; 并且其中t1表示在观察点与亮度曲线图中亮度曲线和Bt的交点中最接近线性标记的交点的位置的值，t2表示指向最接近线性标记的交点的位置的值亮度曲线和0.1＆Dgr; B之间的交点在亮度曲线和Bt的交点到0.1＆Dgr; B的交点的范围内，以Bt为参考。

9. 发明申请

US20150245477A1 Surface Treated Copper Foil and Laminate Using the Same 有权
标题翻译：表面处理铜箔和使用它的层压板
公开(公告)号：US20150245477A1
公开(公告)日：2015-08-27
申请号：US14342313
申请日：2013-11-11
申请人： JX Nippon Mining & Metals Corporation
发明人： Hideta Arai , Atsushi Miki , Kohsuke Arai , Kaichiro Nakamuro
IPC分类号： H05K1/05 , H05K1/09 , H05K1/14 , H05K3/36
CPC分类号： H05K1/056 , C25D1/04 , C25D3/38 , C25D3/58 , C25D5/16 , C25D7/0692 , H05K1/09 , H05K1/14 , H05K3/022 , H05K3/36 , H05K3/384 , Y10T29/49126 , Y10T428/12431 , Y10T428/24917 , Y10T428/31678
摘要： A surface treated copper foil which is well bonded to a resin and allows the resin to have excellent transparency after removal of the copper foil by etching, and a laminate using the same are provided. A surface treated copper foil having at least one surface with a skewness Rsk of −0.35 to 0.53, comprising an Sv defined by the following expression (1) of 3.5 or more based on a brightness curve: Sv=(ΔB×0.1)/(t1−t2) (1); wherein the brightness curve is obtained from an observation spot versus brightness graph, and the difference between the top average Bt and the bottom average Bb in the brightness curve extending from an edge of the mark to a portion without the mark is represented by ΔB (ΔB=Bt−Bb); and wherein t1 represents a value pointing the position of the intersection closest to the linear mark among the intersections of the brightness curve and Bt in the observation spot versus brightness graph, and t2 represents a value pointing the position of the intersection closest to the linear mark among the intersections of the brightness curve and 0.1ΔB in the range from the intersections of the brightness curve and Bt to a depth of 0.1ΔB with Bt as reference.
摘要翻译：一种表面处理的铜箔，其良好地结合到树脂上，并且通过蚀刻除去铜箔后，树脂具有优异的透明性，并且提供了使用该铜箔的层压体。表面处理铜箔，其具有基于亮度曲线，Sv =（＆Dgr; B×0.1）），具有-0.35〜0.53的偏斜度Rsk的至少一个表面，其包含以下表达式（1）定义为3.5以上的Sv： /（t1-t2）（1）; 其中从观察点与亮度图获得亮度曲线，并且从标记的边缘延伸到没有标记的部分的亮度曲线中的顶部平均Bt和底部平均Bb之间的差由＆Dgr; B （＆Dgr; B = Bt-Bb）; 并且其中t1表示在观察点与亮度曲线图中亮度曲线和Bt的交点中最接近线性标记的交点的位置的值，t2表示指向最接近线性标记的交点的位置的值亮度曲线和0.1＆Dgr; B之间的交点在亮度曲线和Bt的交点到0.1＆Dgr; B的交点的范围内，以Bt为参考。

10. 发明申请

US20140355229A1 Surface Treated Copper Foil and Laminate Using the Same 有权
标题翻译：表面处理铜箔和使用它的层压板
公开(公告)号：US20140355229A1
公开(公告)日：2014-12-04
申请号：US14241296
申请日：2013-11-11
申请人： JX NIPPON MINING & METALS CORPORATION
发明人： Hideta Arai , Atsushi Miki , Kohsuke Arai , Kaichiro Nakamuro
IPC分类号： H05K1/09 , H05K1/05 , H05K3/30 , B32B15/08 , H05K3/36 , H05K1/03 , B32B33/00
CPC分类号： H05K1/09 , B32B15/08 , B32B33/00 , B32B2250/02 , B32B2255/06 , B32B2311/12 , B32B2379/08 , B32B2457/08 , C25D1/04 , C25D7/0614 , H05K1/0393 , H05K1/056 , H05K3/022 , H05K3/30 , H05K3/36 , H05K3/382 , H05K2201/0154 , H05K2201/0317 , Y10T29/49126 , Y10T29/4913 , Y10T428/12431 , Y10T428/31681
摘要： A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided. A surface treated copper foil comprising at least one surface treated surface with a color difference ΔE*ab of 40 or more based on JIS Z 8730, and a difference between the top average Bt and the bottom average Bb in a brightness curve extending from an end of the copper foil to a portion without the copper foil ΔB (ΔB=Bt−Bb) of 40 or more, after lamination of the surface treated surface to a polyimide having a ΔB (Pl) defined as above of 50 or more and 65 or less before being laminated to the copper foil, wherein the brightness curve is obtained from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the copper foil through the polyimide with a CCD camera for the respective observation spots along the direction perpendicular to the extending direction of the observed copper foil.
摘要翻译：一种表面处理的铜箔，其良好地结合到树脂上，并且当通过树脂观察时可以获得良好的可见性，并且提供使用其的层压体。表面处理铜箔包括至少一个表面处理表面，其色差＆Dgr; E * ab为基于JIS Z 8730为40以上的表面处理表面，以及从顶部平均Bt和底部平均Bb之间的差 B（＆Dgr; B = Bt-Bb）为40以上的部分，在将表面处理后的表面层合成具有Dgr; B（P1）的聚酰亚胺之后，将铜箔的一端连接到不含铜箔的部分在层压到铜箔之前为50以上且65以下，其中，通过具有CCD的聚酰亚胺的铜箔的拍摄图像的亮度的测量结果的观察点与亮度曲线获得亮度曲线相机沿着与观察到的铜箔的延伸方向垂直的方向的各个观察点。

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