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1. 发明授权

US07728969B2 Methods and systems for identifying defect types on a wafer 有权
标题翻译：用于识别晶片上的缺陷类型的方法和系统
公开(公告)号：US07728969B2
公开(公告)日：2010-06-01
申请号：US11949473
申请日：2007-12-03
申请人： Jason Saito , Wei-Ning Shen
发明人： Jason Saito , Wei-Ning Shen
IPC分类号： G01N21/00
CPC分类号： G01N21/9501
摘要： Various methods and systems for identifying defect types on a wafer are provided. One computer-implemented method for identifying defect types on a wafer includes acquiring output of an inspection system for defects detected on a wafer. The output is acquired by different combinations of illumination and collection channels of the inspection system. The method also includes identifying defect types of the defects based on the output acquired by a set of the different combinations. The set of the different combinations is selected based on the defect types to be identified on the wafer and a wafer type of the wafer such that a different set of the different combinations of the illumination and collection channels is used for identifying different defect types on different wafer types.
摘要翻译：提供了用于识别晶片上的缺陷类型的各种方法和系统。用于识别晶片上的缺陷类型的一种计算机实现的方法包括获取检查系统在晶片上检测到的缺陷的输出。输出通过检查系统的照明和收集通道的不同组合来获取。该方法还包括基于由一组不同组合获取的输出来识别缺陷的缺陷类型。基于要在晶片上识别的缺陷类型和晶片类型来选择不同组合的集合，使得使用不同组合的照明和采集通道的不同组合来识别不同的不同缺陷类型晶圆类型。

2. 发明申请

US20080129988A1 METHODS AND SYSTEMS FOR IDENTIFYING DEFECT TYPES ON A WAFER 有权
标题翻译：在WAFER中识别缺陷类型的方法和系统
公开(公告)号：US20080129988A1
公开(公告)日：2008-06-05
申请号：US11949473
申请日：2007-12-03
申请人： Jason Saito , Wei-Ning Shen
发明人： Jason Saito , Wei-Ning Shen
IPC分类号： G01N21/88
CPC分类号： G01N21/9501
摘要： Various methods and systems for identifying defect types on a wafer are provided. One computer-implemented method for identifying defect types on a wafer includes acquiring output of an inspection system for defects detected on a wafer. The output is acquired by different combinations of illumination and collection channels of the inspection system. The method also includes identifying defect types of the defects based on the output acquired by a set of the different combinations. The set of the different combinations is selected based on the defect types to be identified on the wafer and a wafer type of the wafer such that a different set of the different combinations of the illumination and collection channels is used for identifying different defect types on different wafer types.
摘要翻译：提供了用于识别晶片上的缺陷类型的各种方法和系统。用于识别晶片上的缺陷类型的一种计算机实现的方法包括获取检查系统在晶片上检测到的缺陷的输出。输出通过检查系统的照明和收集通道的不同组合来获取。该方法还包括基于由一组不同组合获取的输出来识别缺陷的缺陷类型。基于要在晶片上识别的缺陷类型和晶片类型来选择不同组合的集合，使得使用不同组合的照明和采集通道的不同组合来识别不同的不同缺陷类型晶圆类型。

3. 发明申请

US20070139645A1 Pattern recognition matching for bright field imaging of low contrast semiconductor devices 失效
标题翻译：低对比度半导体器件的亮场成像模式识别匹配
公开(公告)号：US20070139645A1
公开(公告)日：2007-06-21
申请号：US11311058
申请日：2005-12-19
申请人： Wei-Ning Shen , Xinkang Tian , Byeong Hwang , Tuan Tran
发明人： Wei-Ning Shen , Xinkang Tian , Byeong Hwang , Tuan Tran
IPC分类号： G01J1/10
CPC分类号： G03F9/7011 , G03F9/7019 , G03F9/7069 , G03F9/7088
摘要： Calibration of pattern recognition in bright field imaging systems is disclosed. A target pattern on a substrate on the stage is brought into focus of a bright field system. The image is scanned in a first direction while measuring an edge scattering pattern from a feature of the target pattern. The edge scattering pattern is characterized by first and second peaks. A position of the bright field system's illuminator or beam shaping and relay optics is adjusted perpendicular to an optical path until the first and second peaks are approximately equal in height.
摘要翻译：公开了明场成像系统中模式识别的校准。在舞台上的基板上的目标图案被引入明场系统的焦点。在从目标图案的特征测量边缘散射图案的同时沿第一方向扫描图像。边缘散射图案的特征在于第一和第二峰。亮场系统的照明器或光束成形和中继光学器件的位置垂直于光路被调节，直到第一和第二峰值高度近似相等。

4. 发明授权

US07538868B2 Pattern recognition matching for bright field imaging of low contrast semiconductor devices 失效
标题翻译：低对比度半导体器件的亮场成像模式识别匹配
公开(公告)号：US07538868B2
公开(公告)日：2009-05-26
申请号：US11311058
申请日：2005-12-19
申请人： Wei-Ning Shen , Xinkang Tian , Byeong Su Hwang , Tuan Van Tran
发明人： Wei-Ning Shen , Xinkang Tian , Byeong Su Hwang , Tuan Van Tran
IPC分类号： G01J1/10
CPC分类号： G03F9/7011 , G03F9/7019 , G03F9/7069 , G03F9/7088
摘要： Calibration of pattern recognition in bright field imaging systems is disclosed. A target pattern on a substrate on the stage is brought into focus of a bright field system. The image is scanned in a first direction while measuring an edge scattering pattern from a feature of the target pattern. The edge scattering pattern is characterized by first and second peaks. A position of the bright field system's illuminator or beam shaping and relay optics is adjusted perpendicular to an optical path until the first and second peaks are approximately equal in height.
摘要翻译：公开了明场成像系统中模式识别的校准。在舞台上的基板上的目标图案被引入明场系统的焦点。在从目标图案的特征测量边缘散射图案的同时沿第一方向扫描图像。边缘散射图案的特征在于第一和第二峰。亮场系统的照明器或光束成形和中继光学器件的位置垂直于光路被调节，直到第一和第二峰值高度近似相等。

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