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    • 7. 发明申请
    • Gap-Fill Keyhole Repair Using Printable Dielectric Material
    • 使用可印刷介质材料进行缺陷孔眼修复
    • US20130062709A1
    • 2013-03-14
    • US13232293
    • 2011-09-14
    • Paul ChangJosephine B. ChangMichael A. GuillornJeffrey W. Sleight
    • Paul ChangJosephine B. ChangMichael A. GuillornJeffrey W. Sleight
    • H01L29/51H01L21/28
    • H01L29/51H01L21/311H01L21/76825H01L21/76837H01L29/66545
    • Disposable gate structures are formed on a semiconductor substrate. A planarization dielectric layer is deposited over the disposable gate structures and planarized to provide a top surface that is coplanar with top surface of the disposable gate structures. The planarization dielectric layer at this point includes gap-fill keyholes between narrowly spaced disposable gate structures. A printable dielectric layer is deposited over the planarization dielectric layer to fill the gap-fill keyholes. Areas of the printable dielectric layer over the gap-fill keyholes are illuminated with radiation that cross-links cross-linkable bonds in the material of the printable dielectric layer. Non-crosslinked portions of the printable dielectric layer are subsequently removed selective to crosslinked portions of the printable dielectric layer, which fills at least the upper portion of each gate-fill keyhole. The disposable gate structures are removed to form gate cavities. The gate cavities are filled with a gate dielectric and a gate electrode.
    • 在半导体衬底上形成一次性栅极结构。 平坦化电介质层沉积在一次性栅极结构上并且被平坦化以提供与一次性栅极结构的顶表面共面的顶表面。 此时的平坦化电介质层包括狭缝间隔一次性栅极结构之间的间隙填充键孔。 在平坦化介电层上沉积可印刷介电层以填充间隙填充键孔。 在间隙填充键孔上的可印刷电介质层的区域被可印刷介电层的材料中交叉连接的辐射辐射照射。 可打印介电层的非交联部分随后被选择性地移除到可印刷介电层的交联部分,该可印刷电介质层至少填充每个栅极填充孔眼的上部。 去除一次性门结构以形成门腔。 栅极腔填充有栅极电介质和栅电极。
    • 8. 发明授权
    • Embedded planar source/drain stressors for a finFET including a plurality of fins
    • 用于包括多个翅片的finFET的嵌入式平面源极/漏极应力源
    • US09024355B2
    • 2015-05-05
    • US13483200
    • 2012-05-30
    • Josephine B. ChangPaul ChangMichael A. GuillornJeffrey W. Sleight
    • Josephine B. ChangPaul ChangMichael A. GuillornJeffrey W. Sleight
    • H01L21/02H01L29/66H01L29/78
    • H01L29/66484H01L21/845H01L27/1211H01L29/66795H01L29/7831H01L29/7848H01L29/785
    • Fin-defining mask structures are formed over a semiconductor material layer having a first semiconductor material and a disposable gate structure is formed thereupon. A gate spacer is formed around the disposable gate structure and physically exposed portions of the fin-defining mask structures are subsequently removed. The semiconductor material layer is recessed employing the disposable gate structure and the gate spacer as an etch mask to form recessed semiconductor material portions. Embedded planar source/drain stressors are formed on the recessed semiconductor material portions by selective deposition of a second semiconductor material having a different lattice constant than the first semiconductor material. After formation of a planarization dielectric layer, the disposable gate structure is removed. A plurality of semiconductor fins are formed employing the fin-defining mask structures as an etch mask. A replacement gate structure is formed on the plurality of semiconductor fins.
    • 翅片限定掩模结构形成在具有第一半导体材料的半导体材料层上,并且在其上形成一次性栅极结构。 在一次性栅极结构周围形成栅极间隔物,随后去除鳍状物限定掩模结构的物理暴露部分。 使用一次性栅极结构和栅极间隔物作为蚀刻掩模来凹入半导体材料层以形成凹入的半导体材料部分。 通过选择性沉积具有与第一半导体材料不同的晶格常数的第二半导体材料,在凹入的半导体材料部分上形成嵌入式平面源极/漏极应力。 在形成平坦化介电层之后,去除一次性栅极结构。 使用鳍状限定掩模结构作为蚀刻掩模形成多个半导体鳍。 在多个半导体鳍片上形成替换栅极结构。
    • 10. 发明申请
    • EMBEDDED PLANAR SOURCE/DRAIN STRESSORS FOR A FINFET INCLUDING A PLURALITY OF FINS
    • 嵌入式平面电源/漏极应力器,包括多个FINS
    • US20130320399A1
    • 2013-12-05
    • US13483200
    • 2012-05-30
    • Josephine B. ChangPaul ChangMichael A. GuillornJeffrey W. Sleight
    • Josephine B. ChangPaul ChangMichael A. GuillornJeffrey W. Sleight
    • H01L29/78H01L21/336
    • H01L29/66484H01L21/845H01L27/1211H01L29/66795H01L29/7831H01L29/7848H01L29/785
    • Fin-defining mask structures are formed over a semiconductor material layer having a first semiconductor material and a disposable gate structure is formed thereupon. A gate spacer is formed around the disposable gate structure and physically exposed portions of the fin-defining mask structures are subsequently removed. The semiconductor material layer is recessed employing the disposable gate structure and the gate spacer as an etch mask to form recessed semiconductor material portions. Embedded planar source/drain stressors are formed on the recessed semiconductor material portions by selective deposition of a second semiconductor material having a different lattice constant than the first semiconductor material. After formation of a planarization dielectric layer, the disposable gate structure is removed. A plurality of semiconductor fins are formed employing the fin-defining mask structures as an etch mask. A replacement gate structure is formed on the plurality of semiconductor fins.
    • 翅片限定掩模结构形成在具有第一半导体材料的半导体材料层上,并且在其上形成一次性栅极结构。 在一次性栅极结构周围形成栅极间隔物,随后去除鳍状物限定掩模结构的物理暴露部分。 使用一次性栅极结构和栅极间隔物作为蚀刻掩模来凹入半导体材料层以形成凹入的半导体材料部分。 通过选择性沉积具有与第一半导体材料不同的晶格常数的第二半导体材料,在凹入的半导体材料部分上形成嵌入式平面源极/漏极应力。 在形成平坦化介电层之后,去除一次性栅极结构。 使用鳍状限定掩模结构作为蚀刻掩模形成多个半导体鳍。 在多个半导体鳍片上形成替换栅极结构。