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    • 3. 发明授权
    • Semiconductor device having raised cell landing pad and method of fabricating the same
    • 具有升高电池着陆垫的半导体器件及其制造方法
    • US07511328B2
    • 2009-03-31
    • US11268551
    • 2005-11-08
    • Jung-Woo SeoTae-Hyuk AhnJong-Seo Hong
    • Jung-Woo SeoTae-Hyuk AhnJong-Seo Hong
    • H01L27/108
    • H01L27/10855H01L21/76895
    • A semiconductor device and method of manufacturing the same having pad extending parts, the semiconductor device includes an isolation layer that defines an active region and a gate electrode which traverses the active region. A source region is provided in the active region at one side of the gate electrode, and a drain region is provided in the active region at a second side of the gate electrode. A first interlayer insulating layer covers the semiconductor substrate. A source landing pad is electrically connected to the source region, and a drain landing pad is electrically connected to the drain region. A pad extending part is laminated on one or more of the source landing pad and the drain landing pad. The pad extending part has an upper surface located in a plane above a plane corresponding to the upper surfaces of the source landing pad and the drain landing pad.
    • 半导体器件及其制造方法具有焊盘延伸部分,该半导体器件包括限定有源区的隔离层和穿过有源区的栅电极。 源极区域设置在栅电极的一侧的有源区中,并且在栅电极的第二侧的有源区中设置有漏极区。 第一层间绝缘层覆盖半导体衬底。 源着陆焊盘电连接到源极区域,并且漏极接地焊盘电连接到漏极区域。 垫片延伸部分层压在源着陆垫和排水着陆垫的一个或多个上。 焊盘延伸部分具有位于与源着陆焊盘和排水接地焊盘的上表面对应的平面上方的平面中的上表面。
    • 7. 发明申请
    • Mask layout and method of forming contact pad using the same
    • 使用其形成接触垫的掩模布局和方法
    • US20060222966A1
    • 2006-10-05
    • US11342560
    • 2006-01-31
    • Jung-Woo SeoTae-Hyuk AhnJong-Seo Hong
    • Jung-Woo SeoTae-Hyuk AhnJong-Seo Hong
    • G03C5/00G03F1/00
    • H01L21/31144G03F1/00H01L21/76897
    • Provided are contact photomasks and methods using such photomasks for fabricating semiconductor devices and forming contact plugs on portions of active regions exposed between gate lines. The elongated active regions are arrayed in a series of parallel groups with each group being, in turn, aligned along their longitudinal axes to form an acute angle with the gate lines. The contact photomask includes a plurality of openings arranged in parallel lines that are aligned at an angle offset from previously formed gate lines and which may be parallel to the active regions or may be aligned at an angle offset from the axes of both the groups of active regions and the gate lines. Processes for forming contact plugs using such photomasks may provide increased processing margin and extend the utility of conventional exposure equipment for semiconductor devices exhibiting increased integration density and/or built to more demanding design rules.
    • 提供了使用这种光掩模的接触光掩模和方法来制造半导体器件,并在暴露在栅极线之间的有源区域的部分上形成接触插塞。 细长的有源区域被排列成一系列平行的组,每个组又沿它们的纵向轴线对准,以与栅极线形成锐角。 接触光掩模包括以平行线布置的多个开口,其以与先前形成的栅极线偏移的角度排列,并且可以平行于有源区域,或者可以与两个活动组的轴线偏移的角度对准 区域和栅极线。 使用这种光掩模形成接触塞的方法可以提供增加的加工余量,并且扩展了展示增加的集成密度和/或构建到更苛刻的设计规则的半导体器件的常规曝光设备的效用。
    • 10. 发明申请
    • Method of forming storage node of capacitor
    • 形成电容器存储节点的方法
    • US20060134875A1
    • 2006-06-22
    • US11284389
    • 2005-11-21
    • Tae-Hyuk AhnJung-Woo Seo
    • Tae-Hyuk AhnJung-Woo Seo
    • H01L21/20
    • H01L28/91H01L27/10894H01L28/65
    • A method of forming a storage node of a capacitor includes defining a cell region and a peripheral circuit region in a semiconductor substrate. An interlayer insulating layer is formed on the semiconductor substrate of the cell region and the peripheral circuit region. Buried contact plugs are formed to penetrate the interlayer insulating layer of the cell region. A molding layer is formed on the semiconductor substrate of the cell region and the peripheral circuit region. The molding layer of the cell region is patterned, thereby forming storage node holes exposing the buried contact plugs. A conformal storage node layer is formed on the semiconductor substrate having the storage node holes. A photosensitive layer is formed on the semiconductor substrate having the storage node layer. At this time, the photosensitive layer in the cell region is lower in height than the photosensitive layer in the peripheral circuit region. The semiconductor substrate is exposed using a reticle having a scattering bar. The scattering bar of the reticle is positioned to correspond with the cell region. An exposed portion of the photosensitive layer is removed by developing the semiconductor substrate, thereby partially exposing the storage node layer. The photosensitive layer in the storage node holes is therefore maintained. An etch-back is performed on the semiconductor substrate having the exposed storage node layer, thereby separating storage nodes.
    • 形成电容器的存储节点的方法包括限定半导体衬底中的单元区域和外围电路区域。 在单元区域和外围电路区域的半导体衬底上形成层间绝缘层。 形成埋入式接触插塞以穿透电池区域的层间绝缘层。 在单元区域和外围电路区域的半导体基板上形成成型层。 对单元区域的成型层进行图案化,从而形成露出埋入式接触插塞的存储节点孔。 在具有存储节点孔的半导体衬底上形成保形存储节点层。 在具有存储节点层的半导体衬底上形成感光层。 此时,单元区域中的感光层的高度比外围电路区域中的感光层低。 使用具有散射棒的掩模版来曝光半导体衬底。 掩模版的散射棒被定位成与单元区域对应。 通过显影半导体衬底去除感光层的曝光部分,从而部分地曝光存储节点层。 因此,保持存储节点孔中的感光层。 在具有暴露的存储节点层的半导体衬底上进行回蚀,由此分离存储节点。