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1. 发明申请

US20060016973A1 Multi-chip image sensor package module 审中-公开
标题翻译：多芯片图像传感器封装模块
公开(公告)号：US20060016973A1
公开(公告)日：2006-01-26
申请号：US10895037
申请日：2004-07-21
申请人： Jun-Young Yang , Jong-Ho Han , Jun-Hong Lee
发明人： Jun-Young Yang , Jong-Ho Han , Jun-Hong Lee
IPC分类号： H01J40/14
CPC分类号： H01L31/0203 , H01L31/02325 , H01L2224/48091 , H01L2924/00014
摘要： A multi-chip image sensor package module includes a substrate having an opening, an IC chip, an image sensor chip and a glass cover. The IC chip includes a plurality of bumps on its mounting surface to mount on the lower surface of the substrate. The glass cover is disposed above the upper surface of the substrate. The image sensor chip is disposed between the mounting surface of the IC chip and the upper surface of the substrate by chip-to-chip attachment or flip-chip connection in a manner that the sensing region of the image sensor chip is aligned with the glass cover or a lens through the opening. Thus the multi-chip image sensor package module can have a thinner profile with lower assemble cost.
摘要翻译：多片图像传感器封装模块包括具有开口的基板，IC芯片，图像传感器芯片和玻璃盖。 IC芯片在其安装表面上包括多个凸块以安装在基板的下表面上。玻璃盖设置在基板的上表面上方。图像传感器芯片以图像传感器芯片的感测区域与玻璃对准的方式设置在IC芯片的安装表面和基板的上表面之间，通过芯片到芯片附接或倒装芯片连接盖或透镜通过开口。因此，多芯片图像传感器封装模块可以具有更薄的轮廓，具有更低的组装成本。

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