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1. 发明申请

US20100029348A1 SLIDING OPENING AND CLOSING DEVICE AND A PORTABLE TERMINAL HAVING THE SAME 有权
标题翻译：滑动开启和关闭装置以及具有该滑动装置的便携式终端
公开(公告)号：US20100029348A1
公开(公告)日：2010-02-04
申请号：US12573774
申请日：2009-10-05
申请人： Jun-Hong Lee , Jae-Young Park , Chun-Soo Park
发明人： Jun-Hong Lee , Jae-Young Park , Chun-Soo Park
IPC分类号： H04M1/00
CPC分类号： H04M1/0237 , H04M1/0227 , H04M1/0233 , H04M1/0247
摘要： Disclosed are a sliding opening and closing device and a portable terminal having the same. According to the first embodiment of the present invention, a slide plate is linked to a main plate to be slidable in one direction. Also, the main plate supports an elastic part so as to generate an elasticity power in one direction. A power transformation member receives the elasticity power of the elastic member, and transmits the elasticity power to the slide plate in the direction of the opening or the closing according to the position of the slide plate.
摘要翻译：公开了一种滑动开闭装置和具有该滑动开闭装置的便携式终端。根据本发明的第一实施例，滑动板连接到主板以沿一个方向滑动。此外，主板支撑弹性部分，以在一个方向上产生弹性力。功率变换构件接收弹性构件的弹性力，并且根据滑板的位置将弹性力沿打开或关闭的方向传递到滑板。

2. 发明授权

US06773961B1 Singulation method used in leadless packaging process 有权
标题翻译：无引线封装工艺中使用的切割方法
公开(公告)号：US06773961B1
公开(公告)日：2004-08-10
申请号：US10641094
申请日：2003-08-15
申请人： Jun Hong Lee , Hyung Jun Park , Hyeong No Kim , Kun A Kang
发明人： Jun Hong Lee , Hyung Jun Park , Hyeong No Kim , Kun A Kang
IPC分类号： H01L2144
CPC分类号： H01L21/561 , H01L21/4828 , H01L21/566 , H01L21/568 , H01L23/3107 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/05599 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/3011 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A singulation method used in leadless packaging process is disclosed. An array of molded products on an upper surface of a lead frame is utilized in the singulation method. The lead frame has a plurality of dambars between the molded products. The lower surface of the lead frame is attached with a tape. Each of the molded products includes a semiconductor chip encapsulated in a package body and electrically coupled to the upper surface of the lead frame. The singulation method is accomplished by etching the upper surface of the lead frame with the package bodies as mask until each dambar is etched away.
摘要翻译：公开了一种在无引线封装工艺中使用的切割方法。在切割方法中使用在引线框架的上表面上的成型产品的阵列。引线框架在模制产品之间具有多个堤坝。引线框架的下表面附有带子。每个模制产品包括封装在封装主体中并电耦合到引线框架的上表面的半导体芯片。通过用封装体作为掩模蚀刻引线框架的上表面，直到每个阻挡层被蚀刻掉为止，完成了分割方法。

3. 发明申请

US20080161075A1 Slide-Up Opening and Closing Mechanism For Portable Terminal 审中-公开
标题翻译：便携式终端的上拉开启和关闭机制
公开(公告)号：US20080161075A1
公开(公告)日：2008-07-03
申请号：US12065279
申请日：2007-03-29
申请人： Si-Wan Kim , Woong-Youl Kim , Jun-Hong Lee
发明人： Si-Wan Kim , Woong-Youl Kim , Jun-Hong Lee
IPC分类号： H04B1/38
CPC分类号： H04M1/0237 , H04M1/0216
摘要： Disclosed herein is a slide-up opening and closing apparatus for a communications terminal. The apparatus includes a slider unit, a slider assembly and an angular positioning member in order to open a slider body with respect to a main body. With the apparatus, the slider body can be opened with a desired inclination against the main body and after a certain degree of opening, automatically complete its opening operation without any further force or action, thereby providing a convenient use. In addition, the slider body can be opened with freedom without interference by the main body. Further, when the slider body is opened, most of the top face of the main body can be exposed, thereby providing a convenience of use.
摘要翻译：这里公开了一种用于通信终端的滑盖式开闭装置。该装置包括滑块单元，滑块组件和角定位构件，以便相对于主体打开滑块体。利用该装置，可以以相对于主体的所需倾斜打开滑块体，并且在一定程度的打开之后，自动完成其打开操作而没有任何进一步的力或动作，从而提供方便的使用。此外，滑块体可以自由地打开而不受主体的干扰。此外，当滑动体打开时，主体的顶面的大部分可以被暴露，从而提供使用的便利。

4. 发明申请

US20080058039A1 Sliding Mechanism for Opening and Closing of Cellular Phone 有权
标题翻译：手机打开和关闭的滑动机制
公开(公告)号：US20080058039A1
公开(公告)日：2008-03-06
申请号：US11596215
申请日：2005-09-15
申请人： Jun-Hong Lee , Chun-Soo Park
发明人： Jun-Hong Lee , Chun-Soo Park
IPC分类号： H04M1/00
CPC分类号： H04M1/0237 , H04B1/088 , H04B1/3833
摘要： Disclosed is a sliding mechanism for opening and closing a cellular phone. The mechanism includes a main plate, a slider plate slidably connected to the main plate, a first block shaft-rotatably fixed to the main plate, one or more first rod member fixed to the first block, a first resilient member connected to the first block and generating expansion force, a second block shaft-rotatably fixed to the slider plate, one or more second rod member fixed to the second block, a second resilient member connected to the second rod member and generating expansion force, and a connection block placed in the central area of the first and second blocks and supporting the end portions of the first and second resilient members. The connection block slidably connects the first and second rod members with the first and second blocks in such a way that the end portion of the first rod member is directed towards the second block and the end portion of the second rod member is directed towards the first block. The first and second resilient members are formed of a compression spring having a good resiliency and service life, thereby improving reliability of cellular phones.
摘要翻译：公开了一种用于打开和关闭蜂窝电话的滑动机构。该机构包括主板，可滑动地连接到主板的滑动板，可旋转地固定到主板的第一块轴，固定到第一块的一个或多个第一杆构件，连接到第一块的第一弹性构件并且产生膨胀力，第二块轴可旋转地固定到滑块板，固定到第二块的一个或多个第二杆构件，连接到第二杆构件并产生膨胀力的第二弹性构件，以及连接块第一和第二块的中心区域并且支撑第一和第二弹性构件的端部。连接块可滑动地将第一和第二杆构件与第一和第二块滑动连接，使得第一杆构件的端部指向第二块，并且第二杆构件的端部朝向第一杆构件块。第一和第二弹性构件由具有良好弹性和使用寿命的压缩弹簧形成，从而提高蜂窝电话的可靠性。

5. 发明授权

US07205658B2 Singulation method used in leadless packaging process 有权
标题翻译：无引线封装工艺中使用的切割方法
公开(公告)号：US07205658B2
公开(公告)日：2007-04-17
申请号：US10878521
申请日：2004-06-29
申请人： Jun Hong Lee , Hyung Jun Park , Hyeong No Kim , Kun A Kang
发明人： Jun Hong Lee , Hyung Jun Park , Hyeong No Kim , Kun A Kang
IPC分类号： H01L23/04
CPC分类号： H01L21/561 , H01L21/4828 , H01L21/566 , H01L21/568 , H01L23/3107 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/05599 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/3011 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A singulation method used in leadless packaging process is disclosed. An array of molded products on an upper surface of a lead frame is utilized in the singulation method. The lead frame has a plurality of dambars between the molded products. The lower surface of the lead frame is attached with a tape. Each of the molded products includes a semiconductor chip encapsulated in a package body and electrically coupled to the upper surface of the lead frame. The singulation method is accomplished by etching the upper surface of the lead frame with the package bodies as mask until each dambar is etched away.
摘要翻译：公开了一种在无引线封装工艺中使用的切割方法。在切割方法中使用在引线框架的上表面上的成型产品的阵列。引线框架在模制产品之间具有多个堤坝。引线框架的下表面附有带子。每个模制产品包括封装在封装主体中并电耦合到引线框架的上表面的半导体芯片。通过用封装体作为掩模蚀刻引线框架的上表面，直到每个阻挡层被蚀刻掉为止，完成了分割方法。

6. 发明授权

US06242284B1 Method for packaging a semiconductor chip 有权
标题翻译：包装半导体芯片的方法
公开(公告)号：US06242284B1
公开(公告)日：2001-06-05
申请号：US09565452
申请日：2000-05-05
申请人： Kun-A Kang , Kyujin Jung , Hyung Jun Park , Jun Hong Lee
发明人： Kun-A Kang , Kyujin Jung , Hyung Jun Park , Jun Hong Lee
IPC分类号： H01L2144
CPC分类号： H01L21/6835 , H01L21/486 , H01L23/3107 , H01L23/3128 , H01L23/49827 , H01L24/48 , H01L2221/68377 , H01L2224/05599 , H01L2224/48091 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/10253 , H01L2924/181 , H01L2924/18165 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2924/00012
摘要： A method for packaging a semiconductor chip, generally comprising the following steps of: (a) forming a plurality of openings on the top surface of the conducting substrate, wherein the upper portions of the openings are formed larger than the lower portions of the openings; (b) forming insulating sections in the conducting substrate by filling an insulating material in the openings; (c) forming a plurality of leads insulated by the insulating sections by planarizing the bottom surface of the conducting substrate to expose and form planarized bottom surfaces of the insulating sections; (d) mounting a semiconductor chip on the bottom surface of the conducting substrate; (e) providing a plurality of conducting wires to electrically connect the semiconductor chip to the leads; and (f) encapsulating the semiconductor chip and the conducting wires. The package according to the present invention is characterized by upper portions of the leads that are purposedly formed larger than lower portions of the leads which prevents the leads from being easily detachable and the package from being destructed by water, the reliability of the package is thus increased.
摘要翻译：一种用于封装半导体芯片的方法，通常包括以下步骤：（a）在导电基板的顶表面上形成多个开口，其中开口的上部形成为大于开口的下部; （b）通过在开口中填充绝缘材料在导电衬底中形成绝缘部分; （c）通过平面化导电基板的底面形成绝缘部分绝缘的多个引线，露出和形成绝缘部分的平坦化底面; （d）将半导体芯片安装在导电基板的底表面上; （e）提供多个导线以将半导体芯片电连接到引线; 和（f）封装半导体芯片和导线。根据本发明的封装的特征在于，引线的上部设计成大于引线的下部，防止引线容易拆卸，并且封装不被水破坏，因此封装的可靠性因此增加。

7. 发明授权

US08369909B2 Sliding opening and closing device and a portable terminal having the same 有权
公开(公告)号：US08369909B2
公开(公告)日：2013-02-05
申请号：US12573774
申请日：2009-10-05
申请人： Jae-Young Park , Jun-Hong Lee , Chun-Soo Park
发明人： Jae-Young Park , Jun-Hong Lee , Chun-Soo Park
IPC分类号： H04M1/00
CPC分类号： H04M1/0237 , H04M1/0227 , H04M1/0233 , H04M1/0247
摘要： Disclosed are a sliding opening and closing device and a portable terminal having the same. According to the first embodiment of the present invention, a slide plate is linked to a main plate to be slidable in one direction. Also, the main plate supports an elastic part so as to generate an elasticity power in one direction. A power transformation member receives the elasticity power of the elastic member, and transmits the elasticity power to the slide plate in the direction of the opening or the closing according to the position of the slide plate.

8. 发明申请

US20120051495A1 APPARATUS FOR GENERATING CONTROL DATA 审中-公开
标题翻译：用于生成控制数据的装置
公开(公告)号：US20120051495A1
公开(公告)日：2012-03-01
申请号：US13110638
申请日：2011-05-18
申请人： Jong-Tae HWANG , Min-Ho JUNG , Jun-Hong LEE , Seong-Joon PARK
发明人： Jong-Tae HWANG , Min-Ho JUNG , Jun-Hong LEE , Seong-Joon PARK
IPC分类号： H03K23/00
CPC分类号： H03K5/131 , H03K21/38
摘要： An apparatus configured to generate control data. The apparatus includes a counter unit configured to receive an input signal having a first state and a second state and counts the first state in the input signal, a delay unit configured to delay the count value for a predetermined time, and a data output unit configured to receive the delayed count value from the counter unit and then generate the control data based on the delayed count value.
摘要翻译：一种被配置为产生控制数据的装置。该装置包括：计数器单元，被配置为接收具有第一状态和第二状态的输入信号，并对输入信号中的第一状态进行计数;延迟单元，被配置为将计数值延迟预定时间;以及数据输出单元配置从计数器单元接收延迟的计数值，然后基于延迟的计数值生成控制数据。

9. 发明申请

US20070128904A1 Sliding mechanism or portable communication terminals 有权
标题翻译：滑动机构或便携式通讯终端
公开(公告)号：US20070128904A1
公开(公告)日：2007-06-07
申请号：US11605408
申请日：2006-11-29
申请人： Kyung-Seok Kang , Jun-Hong Lee , Soon-Wook Kwon , Si-Wan Kim , Ho-Seong Ko
发明人： Kyung-Seok Kang , Jun-Hong Lee , Soon-Wook Kwon , Si-Wan Kim , Ho-Seong Ko
IPC分类号： H01R13/62
CPC分类号： H04M1/0237 , Y10T74/20636
摘要： Disclosed is a slider mechanism for slidably opening and closing a portable communication terminal. The slider mechanism includes a first plate and a second plate slidably combined with the first plate. The second plate has a cam profile formed along siding direction. A resilience unit is mounted on the first plate to exert resilient force perpendicularly to moving direction of the second plate. A roller is rotatably attached to an end of the resilience unit. The roller runs along the cam profile while the portable terminal opens or closes. Formed at a desired position of the cam profile is a depression on which the roller rests to hold the terminal in place at closed or opened state, or at any other desired position.
摘要翻译：公开了一种用于可滑动地打开和关闭便携式通信终端的滑块机构。滑块机构包括第一板和与第一板可滑动地组合的第二板。第二板具有沿着侧面方向形成的凸轮轮廓。弹性单元安装在第一板上以与第二板的移动方向垂直地施加弹性力。辊可旋转地附接到弹性单元的端部。当便携式终端打开或关闭时，滚轮沿着凸轮轮廓运行。在凸轮轮廓的期望位置处形成有凹部，在该凹部处，滚子搁置以将端子保持在关闭或打开状态或任何其它期望位置的适当位置。

10. 发明申请

US20060016973A1 Multi-chip image sensor package module 审中-公开
标题翻译：多芯片图像传感器封装模块
公开(公告)号：US20060016973A1
公开(公告)日：2006-01-26
申请号：US10895037
申请日：2004-07-21
申请人： Jun-Young Yang , Jong-Ho Han , Jun-Hong Lee
发明人： Jun-Young Yang , Jong-Ho Han , Jun-Hong Lee
IPC分类号： H01J40/14
CPC分类号： H01L31/0203 , H01L31/02325 , H01L2224/48091 , H01L2924/00014
摘要： A multi-chip image sensor package module includes a substrate having an opening, an IC chip, an image sensor chip and a glass cover. The IC chip includes a plurality of bumps on its mounting surface to mount on the lower surface of the substrate. The glass cover is disposed above the upper surface of the substrate. The image sensor chip is disposed between the mounting surface of the IC chip and the upper surface of the substrate by chip-to-chip attachment or flip-chip connection in a manner that the sensing region of the image sensor chip is aligned with the glass cover or a lens through the opening. Thus the multi-chip image sensor package module can have a thinner profile with lower assemble cost.
摘要翻译：多片图像传感器封装模块包括具有开口的基板，IC芯片，图像传感器芯片和玻璃盖。 IC芯片在其安装表面上包括多个凸块以安装在基板的下表面上。玻璃盖设置在基板的上表面上方。图像传感器芯片以图像传感器芯片的感测区域与玻璃对准的方式设置在IC芯片的安装表面和基板的上表面之间，通过芯片到芯片附接或倒装芯片连接盖或透镜通过开口。因此，多芯片图像传感器封装模块可以具有更薄的轮廓，具有更低的组装成本。

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