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1. 发明申请

US20120087062A1 SURFACE MOUNT ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：表面安装电子元件及其制造方法
公开(公告)号：US20120087062A1
公开(公告)日：2012-04-12
申请号：US13058065
申请日：2010-06-17
申请人： Junichi Kurita , Kenji Kuranuki , Yuji Konda , Yukihiro Shimasaki
发明人： Junichi Kurita , Kenji Kuranuki , Yuji Konda , Yukihiro Shimasaki
IPC分类号： H01G9/004 , H01G9/00
CPC分类号： H01G9/012 , H01G9/10 , H01G9/14 , H01G9/15 , Y10T29/417 , Y10T29/43
摘要： A surface mount electronic component includes an element, an anode terminal, a cathode terminal, and an outer package body. The element has a configuration including an anode, and a cathode formed on a part of the surface of the anode via a dielectric substance. An anode terminal is electrically connected to the anode, and a cathode terminal is electrically connected to the cathode. The outer package body covers an element laminated body such that a part of the anode terminal and a part of the cathode terminal are exposed. The outer package body is made of a norbornene resin. Thus, an electronic component having high reliability can be achieved.
摘要翻译：表面安装电子部件包括元件，阳极端子，阴极端子和外包装体。元件具有通过电介质形成在阳极的一部分表面上形成的阳极和阴极的结构。阳极端子电连接到阳极，阴极端子电连接到阴极。外包装体覆盖元件层叠体，阳极端子的一部分和阴极端子的一部分露出。外包装体由降冰片烯树脂制成。因此，可以实现具有高可靠性的电子部件。

2. 发明授权

US08411416B2 Surface mount electronic component and method for manufacturing the same 有权
标题翻译：表面贴装电子部件及其制造方法
公开(公告)号：US08411416B2
公开(公告)日：2013-04-02
申请号：US13058065
申请日：2010-06-17
申请人： Junichi Kurita , Kenji Kuranuki , Yuji Konda , Yukihiro Shimasaki
发明人： Junichi Kurita , Kenji Kuranuki , Yuji Konda , Yukihiro Shimasaki
IPC分类号： H01G2/10 , H01G9/08
CPC分类号： H01G9/012 , H01G9/10 , H01G9/14 , H01G9/15 , Y10T29/417 , Y10T29/43
摘要： A surface mount electronic component includes an element, an anode terminal, a cathode terminal, and an outer package body. The element has a configuration including an anode, and a cathode formed on a part of the surface of the anode via a dielectric substance. An anode terminal is electrically connected to the anode, and a cathode terminal is electrically connected to the cathode. The outer package body covers an element laminated body such that a part of the anode terminal and a part of the cathode terminal are exposed. The outer package body is made of a norbornene resin. Thus, an electronic component having high reliability can be achieved.
摘要翻译：表面安装电子部件包括元件，阳极端子，阴极端子和外包装体。元件具有通过电介质形成在阳极的一部分表面上形成的阳极和阴极的结构。阳极端子电连接到阳极，阴极端子电连接到阴极。外包装体覆盖元件层叠体，阳极端子的一部分和阴极端子的一部分露出。外包装体由降冰片烯树脂制成。因此，可以实现具有高可靠性的电子部件。

3. 发明申请

US20110127694A1 METHOD OF MANUFACTURING RESIN MOLDED ELECTRONIC COMPONENT (AS AMENDED) 有权
标题翻译：制造树脂模制电子元件的方法（如修订版）
公开(公告)号：US20110127694A1
公开(公告)日：2011-06-02
申请号：US13056702
申请日：2010-06-17
申请人： Junichi Kurita , Hiroshi Takahashi , Kenji Kuranuki , Motoaki Morioka , Keizo Nakagawa , Masashi Minakuchi , Yukihiro Shimasaki
发明人： Junichi Kurita , Hiroshi Takahashi , Kenji Kuranuki , Motoaki Morioka , Keizo Nakagawa , Masashi Minakuchi , Yukihiro Shimasaki
IPC分类号： H01G4/224
CPC分类号： B29C43/18 , B29C39/006 , B29C39/10 , B29C39/38 , B29C39/405 , B29C70/70 , B29C70/72 , B29C2043/181 , B29C2043/182 , B29K2023/38 , B29K2105/0002 , H01G9/012 , H01G9/10 , H01G9/15 , H01G13/003
摘要： A method of manufacturing a resin molded electronic component using a first mold having a cavity with an open top surface and a second mold combined with the first mold on top includes the following steps: (A) inserting a element of the electronic component and a liquid resin precursor into the cavity of the first mold, the liquid resin precursor having viscosity of 10 Pa·s or lower at 40° C.; (B) arranging the second mold such that the element and the resin precursor are sandwiched after the step (A); and (C) pressing the element and the resin precursor between the first mold and the second mold, and curing the resin precursor by heat from the second mold after the step (B). A temperature of the second mold is set to be higher than that of the first mold.
摘要翻译：使用具有开口顶面的空腔的第一模具和与顶部的第一模具结合的第二模具的树脂模制电子部件的制造方法包括以下步骤：（A）将电子部件的元件和液体树脂前体进入第一模具的空腔，液体树脂前体在40℃下的粘度为10Pa·s以下。（B）在所述工序（A）之后，将所述第二模具配置成使得所述元件和所述树脂前体被夹持; 和（C）在第一模具和第二模具之间挤压元件和树脂前体，并且在步骤（B）之后，通过来自第二模具的热量使树脂前体固化。将第二模具的温度设定为高于第一模具的温度。

4. 发明授权

US09005504B2 Method of manufacturing resin molded electronic component 有权
标题翻译：制造树脂模制电子部件的方法
公开(公告)号：US09005504B2
公开(公告)日：2015-04-14
申请号：US13056702
申请日：2010-06-17
申请人： Junichi Kurita , Hiroshi Takahashi , Kenji Kuranuki , Motoaki Morioka , Keizo Nakagawa , Masashi Minakuchi , Yukihiro Shimasaki
发明人： Junichi Kurita , Hiroshi Takahashi , Kenji Kuranuki , Motoaki Morioka , Keizo Nakagawa , Masashi Minakuchi , Yukihiro Shimasaki
IPC分类号： B29C43/18 , B29C39/00 , B29C39/10 , B29C39/38 , B29C39/40 , H01G9/012 , H01G9/10 , H01G9/15 , H01G13/00 , H01G4/224 , B29C70/70 , B29C70/72 , B29K23/00 , B29K105/00
CPC分类号： B29C43/18 , B29C39/006 , B29C39/10 , B29C39/38 , B29C39/405 , B29C70/70 , B29C70/72 , B29C2043/181 , B29C2043/182 , B29K2023/38 , B29K2105/0002 , H01G9/012 , H01G9/10 , H01G9/15 , H01G13/003
摘要： A method of manufacturing a resin molded electronic component using a first mold having a cavity with an open top surface and a second mold combined with the first mold on top includes the following steps: (A) inserting a element of the electronic component and a liquid resin precursor into the cavity of the first mold, the liquid resin precursor having viscosity of 10 Pa·s or lower at 40° C.; (B) arranging the second mold such that the element and the resin precursor are sandwiched after the step (A); and (C) pressing the element and the resin precursor between the first mold and the second mold, and curing the resin precursor by heat from the second mold after the step (B). A temperature of the second mold is set to be higher than that of the first mold.
摘要翻译：使用具有开口顶面的空腔的第一模具和与顶部的第一模具结合的第二模具的树脂模制电子部件的制造方法包括以下步骤：（A）将电子部件的元件和液体树脂前体进入第一模具的空腔，液体树脂前体在40℃下的粘度为10Pa·s以下。（B）在所述工序（A）之后，将所述第二模具配置成使得所述元件和所述树脂前体被夹持; 和（C）在第一模具和第二模具之间挤压元件和树脂前体，并且在步骤（B）之后，通过来自第二模具的热量使树脂前体固化。将第二模具的温度设定为高于第一模具的温度。

5. 发明授权

US07800462B2 Printed board and filter using the same 有权
标题翻译：印刷板和过滤器使用相同
公开(公告)号：US07800462B2
公开(公告)日：2010-09-21
申请号：US12404999
申请日：2009-03-16
申请人： Junichi Kurita , Kenji Kuranuki , Youichi Aoshima , Hiroshi Higashitani , Tsuyoshi Yoshino
发明人： Junichi Kurita , Kenji Kuranuki , Youichi Aoshima , Hiroshi Higashitani , Tsuyoshi Yoshino
IPC分类号： H03H7/00 , H01G9/04
CPC分类号： H05K1/0231 , H01G9/012 , H01G9/28 , H05K1/165 , H05K2201/09772 , H05K2201/10015
摘要： A printed board is mounted with a chip-type solid electrolytic capacitor of a four-terminal structure where a pair of positive electrode terminals are disposed at opposite positions and a pair of negative electrode terminals are disposed at opposite positions on a mounting surface. The printed board has a pair of positive electrode patterns and a pair of negative electrode patterns to which the positive electrode terminals and negative electrode terminals of the chip-type solid electrolytic capacitor are connected, respectively. The printed board further has an inductor section that is insulated from the negative electrode patterns, and electrically connects the positive electrode patterns.
摘要翻译：印刷电路板安装有四端结构的芯片式固体电解电容器，其中一对正电极端子设置在相对位置，一对负电极端子设置在安装表面上的相对位置。印刷电路板分别具有一对正电极图案和一对负电极图案，芯片型固体电解电容器的正极端子和负极端子分别连接到负极图案。印刷电路板还具有与负电极图案绝缘的电感器部分，并且电连接正电极图案。

6. 外观设计

USD569799S1 Solid electrolytic capacitor 有权
标题翻译：固体电解电容器
公开(公告)号：USD569799S1
公开(公告)日：2008-05-27
申请号：US29252035
申请日：2006-01-17
申请人： Kazuo Kawahito , Kenji Kuranuki , Junichi Kurita , Takashi Iwakiri
设计人： Kazuo Kawahito , Kenji Kuranuki , Junichi Kurita , Takashi Iwakiri

7. 发明授权

US07787234B2 Digital signal processor 有权
标题翻译：数字信号处理器
公开(公告)号：US07787234B2
公开(公告)日：2010-08-31
申请号：US11885458
申请日：2006-05-15
申请人： Hiroshi Serikawa , Kenji Kuranuki , Junichi Kurita , Tsuyoshi Yoshino , Katsuyuki Nakamura , Hiroshi Fujii
发明人： Hiroshi Serikawa , Kenji Kuranuki , Junichi Kurita , Tsuyoshi Yoshino , Katsuyuki Nakamura , Hiroshi Fujii
IPC分类号： H01G9/02
CPC分类号： H05K1/0231 , H01G4/35 , H01G9/012 , H01G9/10 , H01G9/15 , H01G9/28 , H05K2201/10689
摘要： A digital signal processor includes a component for processing a digital signal, a power line for supplying a power to the component, and a decoupling capacitor connected between the power line and a ground. The decoupling capacitor has an equivalent series resistance larger than zero and not larger than 25 mΩ at 100 kHz and an equivalent series inductance larger than zero and not larger than 800 pH at 500 MHz. This digital signal processor does not generate a lot of digital noise, and has a small, thin size.
摘要翻译：数字信号处理器包括用于处理数字信号的部件，用于向部件供电的电力线以及连接在电源线和地之间的去耦电容器。去耦电容器具有大于零且不大于25mΩ的等效串联电阻; 在100 kHz时，等效串联电感大于零，并且在500 MHz时不大于800 pH。该数字信号处理器不会产生大量的数字噪声，并且具有小而薄的尺寸。

8. 发明申请

US20080002335A1 Solid-Electrolyte Capacitor, Manufacturing Method Thereof, and Digital Signal Processing Substrate Using the Solid Electrolyte Capacitor 有权
标题翻译：固体电解质电容器，其制造方法和使用固体电解质电容器的数字信号处理基板
公开(公告)号：US20080002335A1
公开(公告)日：2008-01-03
申请号：US11662368
申请日：2005-10-11
申请人： Junichi Kurita , Tsuyoshi Yoshino , Hirotoshi Toji , Kazuo Kawahito , Takashi Iwakiri , Hiroshi Serikawa , Kenji Kuranuki
发明人： Junichi Kurita , Tsuyoshi Yoshino , Hirotoshi Toji , Kazuo Kawahito , Takashi Iwakiri , Hiroshi Serikawa , Kenji Kuranuki
IPC分类号： H01G9/04 , H01G9/15
CPC分类号： H01G9/012 , H01G9/15 , Y10T29/41 , Y10T29/417
摘要： A solid electrolytic capacitor includes a planar solid electrolytic capacitor element having anode and cathode portions; anode and cathode terminals; and insulating coating resin. The anode terminal is electrically connected at the top surface thereof to the anode portion. The cathode terminal is electrically connected at the top surface side thereof to the cathode portion. The coating resin integrally coats the capacitor element so as to expose the bottom surfaces of the anode and cathode terminals. The anode and cathode terminals are disposed as close to each other as not more than 3 mm. The anode and cathode terminals have stair steps on both sides thereof and are connected to the anode and cathode portions at joint faces, respectively. The anode joint faces and the cathode joint faces are coated with coating resin. The solid electrolytic capacitor is provided with the anode joint faces and/or the cathode joint faces.
摘要翻译：固体电解电容器包括具有阳极和阴极部分的平面固体电解电容器元件; 阳极和阴极端子; 和绝缘涂料树脂。阳极端子在其顶表面处电连接到阳极部分。阴极端子在其顶表面侧电连接到阴极部分。涂覆树脂整体地涂覆电容器元件以暴露阳极和阴极端子的底表面。阳极和阴极端子彼此靠近设置为不大于3mm。阳极和阴极端子在其两侧具有阶梯台阶，并且分别在接合面处连接到阳极和阴极部分。阳极接合面和阴极接合面用涂布树脂涂覆。固体电解电容器设置有阳极接合面和/或阴极接合面。

9. 发明授权

US07365961B2 Solid-electrolyte capacitor, manufacturing method thereof, and digital signal processing substrate using the solid-electrolyte capacitor 有权
标题翻译：固体电解质电容器及其制造方法以及使用固体电解质电容器的数字信号处理基板
公开(公告)号：US07365961B2
公开(公告)日：2008-04-29
申请号：US11662368
申请日：2005-10-11
申请人： Junichi Kurita , Tsuyoshi Yoshino , Hirotoshi Toji , Kazuo Kawahito , Takashi Iwakiri , Hiroshi Serikawa , Kenji Kuranuki
发明人： Junichi Kurita , Tsuyoshi Yoshino , Hirotoshi Toji , Kazuo Kawahito , Takashi Iwakiri , Hiroshi Serikawa , Kenji Kuranuki
IPC分类号： H01G9/00
CPC分类号： H01G9/012 , H01G9/15 , Y10T29/41 , Y10T29/417
摘要： A solid electrolytic capacitor includes a planar solid electrolytic capacitor element having anode and cathode portions; anode and cathode terminals; and insulating coating resin. The anode terminal is electrically connected at the top surface thereof to the anode portion. The cathode terminal is electrically connected at the top surface side thereof to the cathode portion. The coating resin integrally coats the capacitor element so as to expose the bottom surfaces of the anode and cathode terminals. The anode and cathode terminals are disposed as close to each other as not more than 3 mm. The anode and cathode terminals have stair steps on both sides thereof and are connected to the anode and cathode portions at joint faces, respectively. The anode joint faces and the cathode joint faces are coated with coating resin. The solid electrolytic capacitor is provided with the anode joint faces and/or the cathode joint faces.
摘要翻译：固体电解电容器包括具有阳极和阴极部分的平面固体电解电容器元件; 阳极和阴极端子; 和绝缘涂料树脂。阳极端子在其顶表面处电连接到阳极部分。阴极端子在其顶表面侧电连接到阴极部分。涂覆树脂整体地涂覆电容器元件以暴露阳极和阴极端子的底表面。阳极和阴极端子彼此靠近设置为不大于3mm。阳极和阴极端子在其两侧具有阶梯台阶，并且分别在接合面处连接到阳极和阴极部分。阳极接合面和阴极接合面用涂布树脂涂覆。固体电解电容器设置有阳极接合面和/或阴极接合面。

10. 发明授权

US07612987B2 Chip-type filter 有权
标题翻译：片式过滤器
公开(公告)号：US07612987B2
公开(公告)日：2009-11-03
申请号：US12368569
申请日：2009-02-10
申请人： Junichi Kurita , Kenji Kuranuki , Youichi Aoshima , Hiroshi Higashitani , Tsuyoshi Yoshino
发明人： Junichi Kurita , Kenji Kuranuki , Youichi Aoshima , Hiroshi Higashitani , Tsuyoshi Yoshino
IPC分类号： H01G9/00
CPC分类号： H01G9/012 , H01F17/0006 , H01F27/40 , H01G9/14 , H01G9/28 , H03H1/0007 , H03H2001/0085
摘要： A chip-type filter has a laminated body formed by stacking a plurality of capacitor elements, a pair of positive electrode terminals, a pair of negative electrode terminals, insulating outer resin, and an inductor section. The laminated body includes capacitor elements in a first group and capacitor elements in a second group, the positive electrode sections in both groups are disposed on the opposite sides with respect to the negative electrode sections. Positive electrode terminals are electrically connected to the positive electrode sections of capacitor elements in the first group and those of capacitor elements in the second group, respectively. Negative electrode terminals are electrically connected to the negative electrode sections in the laminated body, and are disposed at both ends of the direction crossing the connecting direction between the positive electrode terminals. The inductor section is insulated from the negative electrode sections and couples the positive electrode terminals.
摘要翻译：芯片型滤波器具有通过堆叠多个电容器元件，一对正极端子，一对负极端子，绝缘外部树脂和电感器部分而形成的层叠体。层叠体包括第一组中的电容器元件和第二组中的电容器元件，两组中的正极部分相对于负极部分设置在相对侧上。正极端子分别电连接到第一组中的电容器元件的正极部分和第二组中的电容器元件的正极部分。负极端子与层叠体中的负极部电连接，并且配置在与正极端子之间的连接方向交叉的方向的两端。电感器部分与负极部分绝缘并连接正极端子。

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