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1. 发明申请

US20140078696A1 ELECTRONIC DEVICE 审中-公开
标题翻译：电子设备
公开(公告)号：US20140078696A1
公开(公告)日：2014-03-20
申请号：US13833075
申请日：2013-03-15
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Takuya Matsuda , Jun Morimoto , Yuji Sasaki
IPC分类号： H05K5/00
CPC分类号： H05K5/0017 , G06F3/041 , G06F2203/04103
摘要： According to one embodiment, an electronic device includes a display panel, an optical layer, an operation panel, a bonding layer, a first housing, and a second housing. The optical layer is provided on a display surface side of the display panel. The operation panel is adhered to the display panel. A peripheral portion of the operation panel protrudes sideward from the display panel. The bonding layer is provided on a side of the display panel opposite to the optical layer. The first housing includes containing and protruding portions. The protruding portion protrudes sideward from the containing portion to be adhered to the peripheral portion of the operation panel. The containing portion is adhered to the display panel. The second housing includes a bonding portion adhered to the peripheral portion of the operation panel. The second housing defines a containment space between the first and second housings.
摘要翻译：根据一个实施例，电子设备包括显示面板，光学层，操作面板，结合层，第一壳体和第二壳体。光学层设置在显示面板的显示面侧。操作面板粘贴在显示面板上。操作面板的周边部分从显示面板向侧面突出。接合层设置在与光学层相对的显示面板的一侧。第一壳体包括容纳和突出部分。突出部从容纳部分侧向突出以粘附到操作面板的周边部分。容纳部分粘附到显示面板。第二壳体包括粘合到操作面板的周边部分的粘合部分。第二壳体限定第一和第二壳体之间的容纳空间。

2. 发明授权

US10774420B2 Flow passage structure and processing apparatus 有权
公开(公告)号：US10774420B2
公开(公告)日：2020-09-15
申请号：US15757382
申请日：2017-06-26
申请人： Kabushiki Kaisha Toshiba
发明人： Takahiro Terada , Shiguma Kato , Shinya Higashi , Masayuki Tanaka , Takuya Matsuda
IPC分类号： C23C16/455 , H01L21/67
摘要： According to an embodiment, a flow passage structure includes a member. The member has a surface and is provided with a first passage, a plurality of first openings, a second passage, and a plurality of second openings. The first passage includes a plurality of first closed path portions connected to each other. The first openings is connected to the first passage and is opened in the surface. The second passage includes a plurality of second closed path portions connected to each other. The second openings is connected to the second passage and is opened in the surface. The first closed path portions pass through the second closed path portions while being isolated from the second closed path portions. The second closed path portions pass through the first closed path portions while being isolated from the first closed path portions.

3. 发明授权

US10364498B2 Gas supply pipe, and gas treatment equipment 有权
公开(公告)号：US10364498B2
公开(公告)日：2019-07-30
申请号：US14643165
申请日：2015-03-10
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Takahiro Terada , Takuya Matsuda , Kaori Deura , Masayuki Tanaka , Aya Watase
IPC分类号： C23C16/455 , C23C16/458 , C30B25/14 , C30B31/16 , H01J37/32
摘要： According to one embodiment, a gas supply pipe has a first gas pipe configured to blow a gas which has flowed from an inflow opening via first gas blow holes arranged along a longitudinal direction, and a second gas pipe provided in parallel with the first gas pipe. The second gas pipe has second gas blow holes arranged along the longitudinal direction, and allows the gas to flow in a direction opposite to the first gas pipe.

4. 发明申请

US20170067162A1 WAFER HOLDER AND SEMICONDUCTOR MANUFACTURING APPARATUS 审中-公开
标题翻译：过滤器和半导体制造设备
公开(公告)号：US20170067162A1
公开(公告)日：2017-03-09
申请号：US15017880
申请日：2016-02-08
申请人： Kabushiki Kaisha Toshiba
发明人： Takuya Matsuda , Kazunari Yabe , Takahiro Terada , Noriyuki Moriya , Hidenori Hanyu
IPC分类号： C23C16/46 , C23C16/458 , C23C16/455 , H01L21/687 , H01L21/67
CPC分类号： C23C16/46 , C23C16/4584 , H01L21/67109 , H01L21/67248 , H01L21/68735 , H01L21/68764 , H01L21/68771
摘要： A wafer holder according to an embodiment includes a wafer holder. A wafer support-portion is provided at an end portion of a mount region for a wafer. A first portion is located nearer a central portion of the mount region than the wafer support-portion. A first depth of the first portion with reference to an upper surface of the wafer holder outside the mount region is larger than a second depth of the wafer support-portion and a third depth of a third portion located nearer the central portion of the mount region than the first portion. A second portion is located nearer the central portion of the mount region than the wafer support-portion. A fourth depth of the second portion with reference to the upper surface of the wafer holder outside the mount region is larger than the second and third depths and smaller than the first depth.
摘要翻译：根据实施例的晶片保持器包括晶片保持器。在晶片的安装区域的端部设置有晶片支撑部。第一部分位于比晶片支撑部分更靠近安装区域的中心部分。相对于安装区域外的晶片保持器的上表面，第一部分的第一深度大于晶片支撑部分的第二深度，并且位于更靠近安装区域的中心部分的第三部分的第三深度比第一部分。第二部分位于比晶片支撑部分更靠近安装区域的中心部分。相对于安装区域外的晶片保持器的上表面的第二部分的第四深度大于第二和第三深度并且小于第一深度。

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