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1. 发明申请

US20210001605A1 HEAT INSULATING SHEET, HEAT INSULATING MATERIAL, AND MANUFACTURING METHOD OF HEAT INSULATING SHEET 有权
公开(公告)号：US20210001605A1
公开(公告)日：2021-01-07
申请号：US17029460
申请日：2020-09-23
申请人： KANEKA CORPORATION , TOCHIGI KANEKA CORPORATION
发明人： Kazuaki Matsumoto , Hiroyuki Kikuchi , Shuzo Imai
IPC分类号： B32B15/08 , B32B5/02 , B32B27/12 , B32B7/08 , B32B15/09 , B32B27/36 , B32B15/20 , F16L59/02 , F16L59/07
摘要： Provided are heat insulating sheets that may include a resin film having a metal layer and a nonwoven fabric including resin fiber, wherein the resin film and the nonwoven fabric are joined by through holes penetrating the resin film and the nonwoven fabric, and wherein a ratio (La/Lb) of an average distance (La) between the through holes in the resin film to an average distance (Lb) between the through holes in the nonwoven fabric is 1.001 or more and 1.10 or less. Further provided are manufacturing methods of a heat insulating sheet that may include a resin film having a metal layer and a nonwoven fabric including a resin fiber.

2. 发明授权

US11230087B2 Heat insulating sheet, heat insulating material, and manufacturing method of heat insulating sheet 有权
公开(公告)号：US11230087B2
公开(公告)日：2022-01-25
申请号：US17029460
申请日：2020-09-23
申请人： KANEKA CORPORATION , TOCHIGI KANEKA CORPORATION
发明人： Kazuaki Matsumoto , Hiroyuki Kikuchi , Shuzo Imai
IPC分类号： B32B7/08 , B32B15/08 , B32B5/02 , B32B15/09 , B32B15/20 , B32B27/12 , B32B27/36 , F16L59/02 , F16L59/07
摘要： Provided are heat insulating sheets that may include a resin film having a metal layer and a nonwoven fabric including resin fiber, wherein the resin film and the nonwoven fabric are joined by through holes penetrating the resin film and the nonwoven fabric, and wherein a ratio (La/Lb) of an average distance (La) between the through holes in the resin film to an average distance (Lb) between the through holes in the nonwoven fabric is 1.001 or more and 1.10 or less. Further provided are manufacturing methods of a heat insulating sheet that may include a resin film having a metal layer and a nonwoven fabric including a resin fiber.

3. 发明申请

US20170167716A1 AUTOMOTIVE LED LAMP HEAT SINK 审中-公开
公开(公告)号：US20170167716A1
公开(公告)日：2017-06-15
申请号：US15446457
申请日：2017-03-01
申请人： Kaneka Corporation
发明人： Toshiaki Ezaki , Soichi Uchida , Kazuaki Matsumoto
IPC分类号： F21V29/87 , F21S8/10 , F21V29/76 , C08L67/02
CPC分类号： F21V29/87 , C08K3/04 , C08K7/00 , C08K2201/016 , C08L67/02 , C08L67/025 , C08L2203/20 , C09K5/14 , F21S45/47 , F21V29/763 , F21Y2115/10 , H01L23/367 , H01L23/3737 , H01L33/641 , C08L67/00
摘要： An LED heat sink for vehicles includes an injection molded product of a thermally conductive resin composition. The thermally conductive resin composition includes 50 to 90 weight % of a thermoplastic polyester resin having a number average molecular weight of 12,000 to 70,000, and 10 to 50 weight % of a flaked graphite having a fixed carbon content of at least 98 mass %, and an aspect ratio of at least 21, and the thermally conductive resin composition has a specific gravity of 1.4 to 1.7, and an in-plane thermal conductivity of at least 1 W/(m·K).

4. 发明申请

US20140314652A1 PROCESS FOR CONTINUOUS PRODUCTION OF BORON NITRIDE POWDER 审中-公开
标题翻译：连续生产硝酸铁粉的方法
公开(公告)号：US20140314652A1
公开(公告)日：2014-10-23
申请号：US14355020
申请日：2012-10-24
申请人： KANEKA CORPORATION
发明人： Kazuaki Matsumoto , Toshiyuki Kawaguchi , Masashi Sakaguchi
IPC分类号： C01B21/064
CPC分类号： C01B21/0648 , C01B21/0645 , C01P2002/76 , C01P2004/61 , C01P2004/90 , C04B35/583 , C04B2235/5436 , C04B2235/767
摘要： The present invention provides a process for continuously producing crystalline hexagonal boron nitride powder having a large particle size and high crystalline. The present invention relates to a process comprising: the first step of heating a boron-containing material and a nitrogen-containing material to obtain crude boron nitride powder having boron nitride content of 80% by weight or higher, and the second step of feeding the crude boron nitride powder and a boron-containing flux component in the content satisfying the following formula (1) with a heat-resistant container, and heating the container including the crude boron nitride powder and the boron-containing flux component at 1550 to 2400° C. in a continuous furnace under the atmosphere of nitrogen gas, to grow hexagonal boron nitride in the form of crystal: formula (1): boron content contained in boron-containing flux component/crude boron nitride content ≦1.4 % by weight.
摘要翻译：本发明提供一种连续生产具有大粒径和高结晶度的结晶六方氮化硼粉末的方法。本发明涉及一种方法，其包括：加热含硼材料和含氮材料的第一步骤，以获得氮化硼含量为80重量％以上的粗氮化硼粉末，第二步是将粗制氮化硼粉末和含有助熔剂成分的含有满足下式（1）的含有助熔剂的容器，并将含有粗氮化硼粉末和含硼助焊剂成分的容器加热到1550〜2400℃ C.在氮气气氛的连续炉中，以晶体形式生长六方氮化硼：式（1）：含硼助焊剂成分中含有的硼含量/粗氮化硼含量＆nlE; 1.4重量％。

5. 发明授权

US10253178B2 Flowability improver for polycarbonate and polyarylate, polycarbonate resin composition, polyarylate resin composition, and molded article thereof 有权
公开(公告)号：US10253178B2
公开(公告)日：2019-04-09
申请号：US15477483
申请日：2017-04-03
申请人： KANEKA CORPORATION
发明人： Shusuke Yoshihara , Hidekazu Kawakubo , Keika Hattori , Kazuaki Matsumoto , Kazunori Saegusa
IPC分类号： C08L67/03 , C08G63/193 , C08K5/13 , C08K5/524 , C08L69/00 , C08L67/02
摘要： A method of improving flowability of polycarbonate or polyarylate includes mixing the polycarbonate or the polyarylate with a flowability improver including a polyester. The polyester is a polycondensate of monomers including a bisphenol component (B) and a dicarboxylic acid component (C) at a molar ratio satisfying (B):(C)=45:55-55:45. The polyester includes a portion derived from the bisphenol component (B) and the dicarboxylic acid component (C) in an amount of 50 mol % or more.

6. 发明授权

US09809735B2 Highly-thermally-conductive resin composition, and resin material for heat dissipation/heat transfer and thermally conductive film comprising same 有权
公开(公告)号：US09809735B2
公开(公告)日：2017-11-07
申请号：US15101270
申请日：2014-11-13
申请人： Kaneka Corporation
发明人： Shusuke Yoshihara , Syoji Ubukata , Kazuaki Matsumoto
IPC分类号： C08G64/00 , C09K5/14 , C08K3/04 , C08K3/22 , C08K3/28 , C08K3/38 , C08G63/185 , C08G63/193 , C08G63/78 , C08J5/18 , C08K7/18 , C08G63/02
CPC分类号： C09K5/14 , C08G63/185 , C08G63/193 , C08G63/78 , C08J5/18 , C08J2367/02 , C08K3/04 , C08K3/041 , C08K3/22 , C08K3/28 , C08K3/38 , C08K7/18 , C08K2003/222 , C08K2003/2227 , C08K2003/282 , C08K2003/385 , C08K2201/001 , C08K2201/005 , C08L67/02
摘要： The present invention relates to: (i) a resin composition having excellent thermal conductivity and capable of being processed into a thin-walled and flexible molded article, the resin composition containing: (a) a resin consisting of 40 to 60 mol % of a unit (A) having a biphenyl group, and 5 to 40 mol % of a linear unit (B), and 5 to 40 mol % of a linear unit (C), where a thermal conductivity of the resin itself is not less than 0.4 W/(m·K); and (b) an inorganic filler having thermal conductivity of not less than 1 W/(m·K), (ii) a heat-dissipating or heat-transferring resin material containing the resin composition, and (iii) a thermally conductive membrane containing the resin composition.

7. 发明申请

US20160304762A1 HIGHLY-THERMALLY-CONDUCTIVE RESIN COMPOSITION, AND RESIN MATERIAL FOR HEAT DISSIPATION/HEAT TRANSFER AND THERMALLY CONDUCTIVE FILM COMPRISING SAME 有权
标题翻译：高导热性树脂组合物和用于散热/热传递和包含其的导热膜的树脂材料
公开(公告)号：US20160304762A1
公开(公告)日：2016-10-20
申请号：US15101270
申请日：2014-11-13
申请人： KANEKA CORPORATION
发明人： Shusuke Yoshihara , Syoji Ubukata , Kazuaki Matsumoto
IPC分类号： C09K5/14 , C08G63/78 , C08J5/18 , C08K3/38 , C08K7/18 , C08G63/193 , C08K3/22
CPC分类号： C09K5/14 , C08G63/185 , C08G63/193 , C08G63/78 , C08J5/18 , C08J2367/02 , C08K3/04 , C08K3/041 , C08K3/22 , C08K3/28 , C08K3/38 , C08K7/18 , C08K2003/222 , C08K2003/2227 , C08K2003/282 , C08K2003/385 , C08K2201/001 , C08K2201/005 , C08L67/02
摘要： The present invention relates to: (i) a resin composition having excellent thermal conductivity and capable of being processed into a thin-walled and flexible molded article, the resin composition containing: (a) a resin consisting of 40 to 60 mol % of a unit (A) having a biphenyl group, and 5 to 40 mol % of a linear unit (B), and 5 to 40 mol % of a linear unit (C), where a thermal conductivity of the resin itself is not less than 0.4 W/(m·K); and (b) an inorganic filler having thermal conductivity of not less than 1 W/(m·K), (ii) a heat-dissipating or heat-transferring resin material containing the resin composition, and (iii) a thermally conductive membrane containing the resin composition.
摘要翻译：本发明涉及：（i）具有优异导热性且能够加工成薄壁且柔性的模制品的树脂组合物，该树脂组合物含有：（a）由40至60摩尔％的具有联苯基的单元（A）和5〜40摩尔％的线性单元（B），以及5〜40摩尔％的线性单元（C），其中树脂本身的导热率不小于0.4 W /（m·K）; 和（b）导热率不小于1W /（m·K）的无机填料，（ii）含有该树脂组合物的散热或传热树脂材料，和（iii）含有树脂组合物。

8. 发明授权

US10355188B2 LED lamp heat sink 有权
公开(公告)号：US10355188B2
公开(公告)日：2019-07-16
申请号：US15520709
申请日：2015-10-23
申请人： Kaneka Corporation
发明人： Toshiaki Ezaki , Kazuaki Matsumoto
IPC分类号： C09K5/14 , C08L67/02 , H01L33/64 , F28F21/02 , C08K7/00 , C08L67/00 , H01L23/373 , F28F21/06
摘要： The present invention provides an LED lamp heat sink which has excellent thermal conductivity and moldability, is light in weight, and can be produced at low cost. The LED lamp heat sink is partially or wholly made of a thermally conductive resin composition and cools an LED module. The thermally conductive resin composition contains at least: 10 to 50 wt. % of thermoplastic polyester resin (A) having a number average molecular weight of 12,000 to 70,000; 10 to 50 wt. % of polyester-polyether copolymer (B); and 40 to 70 wt. % of scale-like graphite (C) having a fixed carbon content of 98 wt. % or more and an aspect ratio of 21 or more. Specific gravity of the thermally conductive resin composition is 1.7 to 2.0. Heat conductivity of the thermally conductive resin composition in a surface direction is 15 W/(m·K) or more.

9. 发明申请

US20170317257A1 LED LAMP HEAT SINK 审中-公开
公开(公告)号：US20170317257A1
公开(公告)日：2017-11-02
申请号：US15520709
申请日：2015-10-23
申请人： Kaneka Corporation
发明人： Toshiaki Ezaki , Kazuaki Matsumoto
IPC分类号： H01L33/64 , F28F21/02 , C09K5/14 , F28F21/06 , C08L67/02
CPC分类号： H01L33/641 , C08K7/00 , C08L67/00 , C08L67/02 , C09K5/14 , F28F21/02 , F28F21/06 , H01L23/373 , H01L33/64 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides an LED lamp heat sink which has excellent thermal conductivity and moldability, is light in weight, and can be produced at low cost. The LED lamp heat sink is partially or wholly made of a thermally conductive resin composition and cools an LED module. The thermally conductive resin composition contains at least: 10 to 50 wt. % of thermoplastic polyester resin (A) having a number average molecular weight of 12,000 to 70,000; 10 to 50 wt. % of polyester-polyether copolymer (B); and 40 to 70 wt. % of scale-like graphite (C) having a fixed carbon content of 98 wt. % or more and an aspect ratio of 21 or more. Specific gravity of the thermally conductive resin composition is 1.7 to 2.0. Heat conductivity of the thermally conductive resin composition in a surface direction is 15 W/(m·K) or more.

10. 发明授权

US09234095B2 Thermally-conductive organic additive, resin composition, and cured product 有权
标题翻译：导热性有机添加剂，树脂组合物和固化物
公开(公告)号：US09234095B2
公开(公告)日：2016-01-12
申请号：US14507156
申请日：2014-10-06
申请人： KANEKA CORPORATION
发明人： Shusuke Yoshihara , Kazuaki Matsumoto
IPC分类号： C08L63/00 , C08L67/02 , C08K3/00 , C09K5/14 , C09K19/38 , F28F21/06
CPC分类号： C08L67/02 , C09K5/14 , C09K19/3804 , F28F21/06
摘要： A resin composition includes (A) a thermally-conductive organic additive including a liquid crystalline thermoplastic resin which has a mainly-chain structure, wherein a main chain of the liquid crystalline thermoplastic resin contains mainly a repeating unit represented by the general formula (1): -M-Sp- (1) where M represents a mesogenic group and Sp represents a spacer, (B) a thermosetting resin; and (C) an inorganic filler.
摘要翻译：树脂组合物包括（A）包含具有主链结构的液晶热塑性树脂的导热有机添加剂，其中液晶热塑性树脂的主链主要包含由通式（1）表示的重复单元，：-M-Sp-（1）其中M表示介晶基团，Sp表示间隔基，（B）热固性树脂; 和（C）无机填料。

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