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1. 发明授权

US10805702B2 Systems and methods for reducing noise in microphones 有权
公开(公告)号：US10805702B2
公开(公告)日：2020-10-13
申请号：US16410748
申请日：2019-05-13
申请人： KNOWLES ELECTRONICS, LLC
发明人： Peter Loeppert , Michael Pedersen , Michael Kuntzman
IPC分类号： H04R1/08 , H04R1/04 , H04R19/04
摘要： A microphone assembly comprises a substrate and an enclosure disposed on the substrate. A port is defined in one of the substrate or the enclosure. An acoustic transducer is configured to generate an electrical signal in response to acoustic activity. The acoustic transducer comprises a membrane separating a front volume from a back volume of the microphone assembly. The front volume is in fluidic communication with the port, and the back volume is filled with a first gas having a thermal conductivity lower than a thermal conductivity of air. An integrated circuit is electrically coupled to the acoustic transducer and configured to receive the electrical signal from the acoustic transducer. At least a portion of a boundary defining at least one of the front volume or the back volume is configured to have compliance so as to allow pressure equalization. The first gas is different from the second gas.

2. 发明授权

US10939214B2 Acoustic transducers with a low pressure zone and diaphragms having enhanced compliance 有权
公开(公告)号：US10939214B2
公开(公告)日：2021-03-02
申请号：US16593263
申请日：2019-10-04
申请人： KNOWLES ELECTRONICS, LLC
发明人： Michael Kuntzman , Michael Pedersen , Sung Bok Lee , Bing Yu , Vahid Naderyan , Peter Loeppert
IPC分类号： H04R19/04 , H04R7/14 , H04R7/18
摘要： An acoustic transducer for generating electrical signals in response to acoustic signals, comprises a first diaphragm having a first corrugation formed therein. A second diaphragm has a second corrugation formed therein, and is spaced apart from the first diaphragm such that a cavity having a pressure lower than atmospheric pressure is formed therebetween. A back plate is disposed between the first diaphragm and the second diaphragm. One or more posts extend from at least one of the first diaphragm or the second diaphragm towards the other through the back plate. The one or more posts prevent each of the first diaphragm and the second diaphragm from contacting the back plate due to movement of the first diaphragm and/or the second diaphragm towards the back plate. Each of the first corrugation and the second corrugation protrude outwardly from the first diaphragm and the second diaphragm, respectively, away from the back plate.

3. 发明申请

US20210006883A1 SYSTEMS AND METHODS FOR REDUCING NOISE IN MICROPHONES 有权
公开(公告)号：US20210006883A1
公开(公告)日：2021-01-07
申请号：US17024043
申请日：2020-09-17
申请人： Knowles Electronics, LLC
发明人： Peter Loeppert , Michael Pedersen , Michael Kuntzman
IPC分类号： H04R1/08 , H04R1/04
摘要： A microphone assembly comprises a substrate and an enclosure disposed on the substrate. A port is defined in one of the substrate or the enclosure. An acoustic transducer is configured to generate an electrical signal in response to acoustic activity. The acoustic transducer comprises a membrane separating a front volume from a back volume of the microphone assembly. The front volume is in fluidic communication with the port, and the back volume is filled with a first gas having a thermal conductivity lower than a thermal conductivity of air. An integrated circuit is electrically coupled to the acoustic transducer and configured to receive the electrical signal from the acoustic transducer. At least a portion of a boundary defining at least one of the front volume or the back volume is configured to have compliance so as to allow pressure equalization. The first gas is different from the second gas.

4. 发明授权

US11206494B2 Microphone device with ingress protection 有权
公开(公告)号：US11206494B2
公开(公告)日：2021-12-21
申请号：US16593381
申请日：2019-10-04
申请人： KNOWLES ELECTRONICS, LLC
发明人： Sung Bok Lee , Vahid Naderyan , Bing Yu , Michael Kuntzman , Yunfei Ma , Wade Conklin , Peter Loeppert
IPC分类号： H04R25/00 , H04R19/04 , H04R7/18 , H04R7/06
摘要： A microphone device includes a base and a microelectromechanical system (MEMS) transducer and an integrated circuit (IC) disposed on the base. The microphone device also includes a cover mounted on the base and covering the MEMS transducer and the IC. The MEMS transducer includes a diaphragm attached to a surface of the substrate and a back plate mounted on the substrate and in a spaced apart relationship with the diaphragm. The diaphragm is attached to the surface of the substrate along at least a portion of a periphery of the diaphragm. The diaphragm can include a silicon nitride insulating layer, and a conductive layer, that faces a conductive layer of the back plate. The MEMS transducer can include a peripheral support structure that is disposed between at least a portion of the diaphragm and the substrate. The diaphragm can include one or more pressure equalizing apertures.

5. 发明申请

US20190356974A1 SYSTEMS AND METHODS FOR REDUCING NOISE IN MICROPHONES 审中-公开
公开(公告)号：US20190356974A1
公开(公告)日：2019-11-21
申请号：US16410748
申请日：2019-05-13
申请人： KNOWLES ELECTRONICS, LLC
发明人： Peter Loeppert , Michael Pedersen , Michael Kuntzman
IPC分类号： H04R1/08 , H04R1/04
摘要： A microphone assembly comprises a substrate and an enclosure disposed on the substrate. A port is defined in one of the substrate or the enclosure. An acoustic transducer is configured to generate an electrical signal in response to acoustic activity. The acoustic transducer comprises a membrane separating a front volume from a back volume of the microphone assembly. The front volume is in fluidic communication with the port, and the back volume is filled with a first gas having a thermal conductivity lower than a thermal conductivity of air. An integrated circuit is electrically coupled to the acoustic transducer and configured to receive the electrical signal from the acoustic transducer. At least a portion of a boundary defining at least one of the front volume or the back volume is configured to have compliance so as to allow pressure equalization. The first gas is different from the second gas.

6. 发明授权

US11617042B2 Acoustic transducers with a low pressure zone and diaphragms having enhanced compliance 有权
公开(公告)号：US11617042B2
公开(公告)日：2023-03-28
申请号：US17159983
申请日：2021-01-27
申请人： KNOWLES ELECTRONICS, LLC
发明人： Michael Kuntzman , Michael Pedersen , Sung Bok Lee , Bing Yu , Vahid Naderyan , Peter Loeppert
IPC分类号： H04R19/04 , H04R7/14 , H04R7/18
摘要： An acoustic transducer for generating electrical signals in response to acoustic signals, comprises a first diaphragm having a first corrugation formed therein. A second diaphragm has a second corrugation formed therein, and is spaced apart from the first diaphragm such that a cavity having a pressure lower than atmospheric pressure is formed therebetween. A back plate is disposed between the first diaphragm and the second diaphragm. One or more posts extend from at least one of the first diaphragm or the second diaphragm towards the other through the back plate. The one or more posts prevent each of the first diaphragm and the second diaphragm from contacting the back plate due to movement of the first diaphragm and/or the second diaphragm towards the back plate. Each of the first corrugation and the second corrugation protrude outwardly from the first diaphragm and the second diaphragm, respectively, away from the back plate.

7. 发明授权

US11159867B2 Systems and methods for reducing noise in microphones 有权
公开(公告)号：US11159867B2
公开(公告)日：2021-10-26
申请号：US17024043
申请日：2020-09-17
申请人： Knowles Electronics, LLC
发明人： Peter Loeppert , Michael Pedersen , Michael Kuntzman
IPC分类号： H04R1/08 , H04R1/04 , H04R19/04
摘要： A microphone assembly comprises a substrate and an enclosure disposed on the substrate. A port is defined in one of the substrate or the enclosure. An acoustic transducer is configured to generate an electrical signal in response to acoustic activity. The acoustic transducer comprises a membrane separating a front volume from a back volume of the microphone assembly. The front volume is in fluidic communication with the port, and the back volume is filled with a first gas having a thermal conductivity lower than a thermal conductivity of air. An integrated circuit is electrically coupled to the acoustic transducer and configured to receive the electrical signal from the acoustic transducer. At least a portion of a boundary defining at least one of the front volume or the back volume is configured to have compliance so as to allow pressure equalization. The first gas is different from the second gas.

8. 发明授权

US09516421B1 Acoustic sensing apparatus and method of manufacturing the same 有权
标题翻译：声学传感装置及其制造方法
公开(公告)号：US09516421B1
公开(公告)日：2016-12-06
申请号：US14974499
申请日：2015-12-18
申请人： Knowles Electronics, LLC
发明人： Peter Loeppert , Michael Pedersen
IPC分类号： H04R9/08 , H04R7/20
CPC分类号： H04R17/02 , H01L2224/48137
摘要： An acoustic sensing apparatus includes a diaphragm; a support structure surrounding the diaphragm and a gap disposed there between, the diaphragm and support structure separating a front volume and a back volume; one or more cantilevers disposed in the gap and between the diaphragm and the support structure, a first end of each of the cantilevers coupled to the support structure and being non-moving, and a second end of each of the cantilevers being free to move; a sealing material covering at least the gap between the diaphragm and the support structure, the sealing material creating an acoustic seal between the front volume and the back volume; and a sensor that converts a diaphragm movement into an electrical signal. The second end of each of the cantilevers is coupled to the sealing material.
摘要翻译：声学传感装置包括隔膜; 围绕隔膜的支撑结构和设置在其间的间隙，隔膜和支撑结构分隔前容积和后体积; 一个或多个悬臂设置在间隙中并且在隔膜和支撑结构之间，每个悬臂的第一端联接到支撑结构并且不移动，并且每个悬臂的第二端自由移动; 密封材料至少覆盖隔膜和支撑结构之间的间隙，密封材料在前体积和后体积之间产生声学密封; 以及将膜片运动转换成电信号的传感器。每个悬臂的第二端连接到密封材料上。

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