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1. 发明授权

US09743191B2 Acoustic apparatus with diaphragm supported at a discrete number of locations 有权
公开(公告)号：US09743191B2
公开(公告)日：2017-08-22
申请号：US14873816
申请日：2015-10-02
申请人： Knowles Electronics, LLC
发明人： Sagnik Pal , Sung Bok Lee
IPC分类号： H04R25/00 , H04R7/24 , H04R19/00 , H04R7/12 , H04R1/04
CPC分类号： H04R7/24 , H04R1/04 , H04R7/122 , H04R19/005
摘要： An acoustic apparatus includes a back plate, a diaphragm, and at least one pillar. The diaphragm and the back plate are disposed in spaced relation to each other. At least one pillar is configured to at least temporarily connect the back plate and the diaphragm across the distance. The diaphragm stiffness is increased as compared to a diaphragm stiffness in absence of the pillar. The at least one pillar provides a clamped boundary condition when the diaphragm is electrically biased and the clamped boundary is provided at locations where the diaphragm is supported by the at least one pillar.

2. 发明申请

US20170230758A1 MICROPHONE AND PRESSURE SENSOR 审中-公开
公开(公告)号：US20170230758A1
公开(公告)日：2017-08-10
申请号：US15424602
申请日：2017-02-03
申请人： Knowles Electronics, LLC
发明人： Michael Kuntzman , Wade Conklin , Sung Bok Lee
IPC分类号： H04R19/04 , H04R1/28 , H04R29/00
CPC分类号： H04R19/04 , H04R1/2873 , H04R29/004 , H04R2201/003
摘要： The present disclosure generally relates to acoustic assemblies. One acoustic assembly includes a base and a first die disposed on the base. The first die comprises a microelectromechanical system (MEMS) microphone that includes a first diaphragm and a first back plate. The MEMS microphone has a barometric release. The acoustic assembly also includes a second die disposed on the base. The second die comprises a pressure sensor. The acoustic assembly further includes a cover coupled to the base and enclosing the first dies and the second die. A back volume is formed between the base, the first die, the second die, and the cover. The pressure sensor is configured to sense a pressure of the back volume.

3. 发明申请

US20170026760A1 MICROPHONE WITH HUMIDITY SENSOR 审中-公开
标题翻译：带湿度传感器的麦克风
公开(公告)号：US20170026760A1
公开(公告)日：2017-01-26
申请号：US15216630
申请日：2016-07-21
申请人： Knowles Electronics, LLC
发明人： John J. Albers , Joshua Watson , Kurt B. Friel , Norman Dennis Talag , Sung Bok Lee
IPC分类号： H04R23/00 , G01N27/22
CPC分类号： H04R23/00 , G01N27/121 , G01N27/223 , H04R19/005 , H04R2201/003
摘要： Various embodiments relating to microphone with integrated sensor are disclosed herein. In one implementation, a sensor is disposed in, on, integrated with, and/or at the lid of a micro electro mechanical system (MEMS) microphone. In another implementation, a sensor is disposed at or integrated with an insert, over which a micro electro mechanical system (MEMS) device is disposed in a MEMS microphone. In disposing the sensor at the lid or insert, significant space savings are achieved. Consequently, a small-sized microphone is provided and achieved allowing the microphone deployed in applications where miniaturization is required or advantageous.
摘要翻译：本文公开了与具有集成传感器的麦克风相关的各种实施例。在一个实施方案中，将传感器设置在微机电系统（MEMS）麦克风的一个或多个盖上。在另一个实施方案中，传感器设置在插入件上或与插入件集成在一起，微机电系统（MEMS）装置在该插入件上设置在MEMS麦克风中。将传感器设置在盖子或插件上时，可以节省大量空间。因此，提供并实现了小型麦克风，使麦克风部署在需要小型化或有利的应用中。

4. 发明申请

US20150304753A1 Microphone Assembly With Barrier To Prevent Contaminant Infiltration 审中-公开
标题翻译：麦克风装配屏障，以防止污染物渗透
公开(公告)号：US20150304753A1
公开(公告)日：2015-10-22
申请号：US14755673
申请日：2015-06-30
申请人： Knowles Electronics, LLC
发明人： Peter V. Loeppert , Ryan M. McCall , Daniel Giesecke , Sandra F. Vos , John B. Szczech , Sung Bok Lee , Peter Van Kessel
IPC分类号： H04R1/08
CPC分类号： H04R1/08 , H04R1/04 , H04R1/086 , H04R2201/003
摘要： A micro-electro-mechanical system (MEMS) microphone includes a rectangular substrate with a rigid base layer, a first metal layer, a second metal layer, one or more electrical pathways, an acoustic port, and a patterned flexible printed circuit board material. The MEMS microphone also includes a MEMS microphone die and a solid single-piece rectangular cover.
摘要翻译：微电子机械系统（MEMS）麦克风包括具有刚性基底层，第一金属层，第二金属层，一个或多个电路径，声学端口和图案化的柔性印刷电路板材料的矩形基板。 MEMS麦克风还包括一个MEMS麦克风模具和一个实心的单件矩形盖子。

5. 发明授权

US08969980B2 Vented MEMS apparatus and method of manufacture 有权
标题翻译：通风MEMS装置及其制造方法
公开(公告)号：US08969980B2
公开(公告)日：2015-03-03
申请号：US13623598
申请日：2012-09-20
申请人： Knowles Electronics, LLC
发明人： Sung Bok Lee
IPC分类号： H01L29/84 , B81B7/00 , H04R19/00 , H04R19/04
CPC分类号： B81B7/0029 , B81B2201/0257 , B81B2203/0127 , H01L2224/48091 , H01L2924/15151 , H04R19/005 , H04R19/04 , H04R2201/003 , H01L2924/00014
摘要： A micro-electromechanical system (MEMS) device includes a housing and a base. The base includes a port opening extending therethrough and the port opening communicates with the external environment. The MEMS die is disposed on the base and over the opening. The MEMS die includes a diaphragm and a back plate and the MEMS die, the base, and the housing form a back volume. At least one vent extends through the MEMS die and not through the diaphragm. The at least one vent communicates with the back volume and the port opening and is configured to allow venting between the back volume and the external environment.
摘要翻译：微机电系统（MEMS）装置包括壳体和基座。基座包括延伸穿过其中的端口开口，并且端口开口与外部环境连通。 MEMS管芯设置在基座上并在开口上方。 MEMS管芯包括隔膜和背板，并且MEMS管芯，基座和壳体形成后部体积。至少一个通气孔延伸穿过MEMS管芯而不通过隔膜。所述至少一个通风口与所述后部体积和所述端口开口相通并且被构造成允许所述后部体积与所述外部环境之间的排气。

6. 发明申请

US20140133687A1 APPARATUS FOR PREVENTION OF PRESSURE TRANSIENTS IN MICROPHONES 有权
标题翻译：防止麦克风压力过渡的装置
公开(公告)号：US20140133687A1
公开(公告)日：2014-05-15
申请号：US14075818
申请日：2013-11-08
申请人： Knowles Electronics, LLC
发明人： Sung Bok Lee
IPC分类号： H04R1/04
CPC分类号： H04R1/083 , H04R2201/003
摘要： An acoustic device includes a substrate, a microelectromechanical system (MEMS) apparatus, a cover, a port, and a valve. The MEMS apparatus includes a diaphragm and a back plate. The cover is coupled to the substrate and encloses the MEMS apparatus. The port is disposed through the substrate and the MEMS apparatus is disposed over the port. The valve is disposed over the port and opposite the MEMS apparatus. The valve is configured to assume a closed position during the occurrence of a high pressure event and prevent a pressure transient from damaging the MEMS apparatus. The valve is configured to assume an open position during the absence of a high pressure event.
摘要翻译：声学装置包括基板，微机电系统（MEMS）装置，盖，端口和阀。 MEMS装置包括隔膜和背板。盖子耦合到基板并且封装MEMS装置。端口设置在基板上，MEMS装置设置在端口上。阀设置在端口上并与MEMS装置相对。阀被配置为在高压事件发生期间处于闭合位置，并且防止压力瞬变损坏MEMS装置。阀被配置为在没有高压事件期间呈现打开位置。

7. 发明申请

US20210168515A1 COMPOSITE DIAPHRAGMS HAVING BALANCED STRESS 有权
公开(公告)号：US20210168515A1
公开(公告)日：2021-06-03
申请号：US16887822
申请日：2020-05-29
申请人： Knowles Electronics, LLC
发明人： Peter V. Loeppert , Sung Bok Lee
IPC分类号： H04R11/04
摘要： An acoustic transducer comprises a transducer substrate defining an aperture therein. A diaphragm is disposed on the transducer substrate. The diaphragm comprises a diaphragm inner portion disposed over the aperture such that an outer edge of the diaphragm inner portion is located radially inwards of a rim of the aperture, the diaphragm inner portion having a first stress. A diaphragm outer portion extends radially from the outer edge of the diaphragm inner portion to at least the rim of the aperture, the diaphragm outer portion having a second stress different from the first stress.

8. 发明授权

US10939214B2 Acoustic transducers with a low pressure zone and diaphragms having enhanced compliance 有权
公开(公告)号：US10939214B2
公开(公告)日：2021-03-02
申请号：US16593263
申请日：2019-10-04
申请人： KNOWLES ELECTRONICS, LLC
发明人： Michael Kuntzman , Michael Pedersen , Sung Bok Lee , Bing Yu , Vahid Naderyan , Peter Loeppert
IPC分类号： H04R19/04 , H04R7/14 , H04R7/18
摘要： An acoustic transducer for generating electrical signals in response to acoustic signals, comprises a first diaphragm having a first corrugation formed therein. A second diaphragm has a second corrugation formed therein, and is spaced apart from the first diaphragm such that a cavity having a pressure lower than atmospheric pressure is formed therebetween. A back plate is disposed between the first diaphragm and the second diaphragm. One or more posts extend from at least one of the first diaphragm or the second diaphragm towards the other through the back plate. The one or more posts prevent each of the first diaphragm and the second diaphragm from contacting the back plate due to movement of the first diaphragm and/or the second diaphragm towards the back plate. Each of the first corrugation and the second corrugation protrude outwardly from the first diaphragm and the second diaphragm, respectively, away from the back plate.

9. 发明授权

US10654712B2 Elevated MEMS device in a microphone with ingress protection 有权
公开(公告)号：US10654712B2
公开(公告)日：2020-05-19
申请号：US16137206
申请日：2018-09-20
申请人： Knowles Electronics, LLC
发明人： John J. Albers , Brandon Harrington , Sung Bok Lee
IPC分类号： B81B7/02 , H04R19/04 , H04R19/00 , B81C1/00 , H04R1/08
摘要： A micro electro mechanical system (MEMS) microphone includes a base including a port extending through the base, a shim assembly, an ingress protection element, and a MEMS device. The shim assembly is disposed on the base and over the port. The shim assembly has a plurality of walls that form a hollow interior cavity. The shim assembly also has a top surface and a bottom surface coupled to the base. The ingress protection element extends over and is coupled to the top of the shim assembly to enclose the cavity of the shim assembly. The shim assembly elevates the ingress protection element above the base and is effective to prevent the passage of contaminants there through. The MEMS device includes a diaphragm and a back plate and is disposed over the ingress protection element.

10. 发明申请

US20190191245A1 APPARATUS AND METHOD TO BIAS MEMS MOTORS 审中-公开
公开(公告)号：US20190191245A1
公开(公告)日：2019-06-20
申请号：US16219794
申请日：2019-03-11
申请人： Knowles Electronics, LLC
发明人： Wade Conklin , Michael Kuntzman , Sung Bok Lee
IPC分类号： H04R3/04 , H04R3/06 , H04R19/04 , H04R1/24
CPC分类号： H04R3/04 , H04R1/245 , H04R3/06 , H04R19/04 , H04R2201/003
摘要： A microphone includes a micro electro mechanical system (MEMS) motor. The MEMS motor includes a diaphragm and at least one back plate. The diaphragm is formed with a tension caused by a film stress of the diaphragm. The diaphragm is electrically biased according to a voltage to adjust or compensate for the film stress.

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