会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 6. 发明申请
    • ULTRASONIC TRANSDUCER CHIP ASSEMBLY, ULTRASOUND PROBE, ULTRASONIC IMAGING SYSTEM AND ULTRASOUND ASSEMBLY AND PROBE MANUFACTURING METHODS
    • 超声波传感器芯片组件,超声波探头,超声波成像系统和超声波组件和探头制造方法
    • US20170043375A1
    • 2017-02-16
    • US15305414
    • 2015-05-05
    • KONINKLIJKE PHILIPS N.V.TECHNISCHE UNIVERSITEIT DELFT
    • Johannes Wilhelmus WeekampVincent Adrianus HennekenAlfons Wouter GroenlandMarcus Cornelis Louwerse
    • B06B1/06A61B8/00H01L41/293H01L41/047H01L41/113
    • Disclosed is an ultrasonic transducer assembly comprising an ultrasonic transducer chip (100) having a main surface comprising a plurality of ultrasound transducer elements (112) and a plurality of first contacts (120) for connecting to said ultrasound transducer elements; a contact chip (400) having a further main surface comprising a plurality of second contacts (420); an backing member (300) comprising ultrasound absorbing and/or scattering bodies (310), said backing member comprising a first surface (302) on which the transducer chip is mounted and a second surface (306) on which the contact chip is mounted; and a flexible interconnect (200) extending over said backing member from the main surface to the further main surface, the flexible interconnect comprising a plurality of conductive tracks (210), each conductive track connecting one of said first contacts to a second contact. An ultrasound probe including such an assembly, an ultrasonic imaging system including such an ultrasound probes and manufacturing methods of such an assembly and probe are also disclosed.
    • 公开了一种超声换能器组件,其包括具有包括多个超声换能器元件(112)的主表面和用于连接到所述超声换能器元件的多个第一触点(120)的超声换能器芯片(100) 具有另外的主表面的接触芯片(400)包括多个第二触点(420); 包括超声波吸收和/或散射体(310)的背衬构件(300),所述背衬构件包括其上安装有所述换能器芯片的第一表面(302)和安装所述接触芯片的第二表面(306) 以及柔性互连(200),其在所述背衬构件上从主表面延伸到另一主表面,所述柔性互连件包括多个导电轨道(210),每个导电轨道将所述第一触点中的一个连接到第二触点。 还公开了包括这种组件的超声波探头,包括这种超声波探头的超声波成像系统和这种组件和探头的制造方法。