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    • 5. 发明授权
    • Chip type solid electrolytic capacitor and its manufacturing method
    • 片式固体电解电容器及其制造方法
    • US06236561B1
    • 2001-05-22
    • US09334771
    • 1999-06-16
    • Masakuni OginoMasahiro YabushitaKoji UeokaTakashi IwakiriTsuyoshi Yoshino
    • Masakuni OginoMasahiro YabushitaKoji UeokaTakashi IwakiriTsuyoshi Yoshino
    • H01G900
    • H01G9/012
    • A chip type solid electrolytic capacitor of the present invention has a section formed in a step-wise manner on a cathode lead frame that is connected with a capacitor element. An anode lead wire of the capacitor element is resistance welded to the top of a reversed V-letter shaped structure formed by folding part of an anode lead frame into halves. Further, with the chip type solid electrolytic capacitor of the present invention, part of respective cathode and anode lead frames is exposed outside in such a way as being made flush with the periphery of a resin package, thereby each serving as a terminal. Accordingly, a space problem due to the terminals has been eliminated and the anode lead wire can be made short, thus allowing the volume of a capacitor element employed to be increased. As a result, a chip type solid electrolytic capacitor having a large capacity with its outer dimensions is kept the same as a prior art capacitor can be obtained.
    • 本发明的芯片式固体电解电容器具有在与电容器元件连接的阴极引线框上逐步形成的部分。 电容器元件的阳极引线被电阻焊接到通过将阳极引线框架的一部分折叠成半部而形成的反向V字形结构的顶部。 此外,对于本发明的芯片型固体电解电容器,将阴极和阳极引线框架的一部分暴露在外部,使其与树脂封装的周边齐平,从而各自用作端子。 因此,由于端子引起的空间问题已被消除,并且可以使阳极引线短,从而允许增加使用的电容器元件的体积。 结果,具有外形尺寸大的芯片型固体电解电容器保持与现有技术的电容器相同。