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    • 2. 发明授权
    • Semiconductor device capable of avoiding latchup breakdown resulting from negative variation of floating offset voltage
    • 半导体器件能够避免浮动偏移电压的负变化引起的闭锁故障
    • US07190034B2
    • 2007-03-13
    • US11229724
    • 2005-09-20
    • Kazunari HatadeHajime AkiyamaKazuhiro Shimizu
    • Kazunari HatadeHajime AkiyamaKazuhiro Shimizu
    • H01L29/76H01L29/94H01L31/062H01L31/113H01L31/119
    • H01L21/761H01L27/0921H01L2924/0002H01L2924/00
    • A semiconductor device is provided which is capable of avoiding malfunction and latchup breakdown resulting from negative variation of high-voltage-side floating offset voltage (VS). In the upper surface of an n-type impurity region (28), a p+-type impurity region (33) is formed between an NMOS (14) and a PMOS (15) and in contact with a p-type well (29). An electrode (41) resides on the p+-type impurity region (33) and the electrode (41) is connected to a high-voltage-side floating offset voltage (VS). The p+-type impurity region (33) has a higher impurity concentration than the p-type well (29) and is shallower than the p-type well (29). Between the p+-type impurity region (33) and the PMOS (15), an n+-type impurity region (32) is formed in the upper surface of the n-type impurity region (28). An electrode (40) resides on the n+-type impurity region (32) and the electrode (40) is connected to a high-voltage-side floating supply absolute voltage (VB).
    • 提供一种半导体器件,其能够避免由高压侧浮动偏置电压(VS)的负变化引起的故障和闭锁故障。 在n型杂质区(28)的上表面中,在NMOS(14)和PMOS(15)之间形成有与p型杂质区(33)接触的p + p型井(29)。 电极(41)位于p + +型杂质区域(33)上,电极(41)连接到高电压侧浮置偏移电压(VS)。 p型+杂质区域(33)的杂质浓度比p型阱(29)高,比p型阱(29)浅。 在p + + / - 型杂质区域(33)和PMOS(15)之间,形成n + +型杂质区域(32)的上表面 n型杂质区(28)。 电极(40)位于n + + +型杂质区(32)上,电极(40)连接到高压侧浮动电源绝对电压(VB)。
    • 5. 发明申请
    • SEMICONDUCTOR DEVICE CAPABLE OF AVOIDING LATCHUP BREAKDOWN RESULTING FROM NEGATIVE VARIATION OF FLOATING OFFSET VOLTAGE
    • 由浮动偏置电压的负变化导致的避免闩锁断开的半导体器件
    • US20070114614A1
    • 2007-05-24
    • US11623806
    • 2007-01-17
    • Kazunari HatadeHajime AkiyamaKazuhiro Shimizu
    • Kazunari HatadeHajime AkiyamaKazuhiro Shimizu
    • H01L29/94H01L23/58
    • H01L21/761H01L27/0921H01L2924/0002H01L2924/00
    • A semiconductor device is provided which is capable of avoiding malfunction and latchup breakdown resulting from negative variation of high-voltage-side floating offset voltage (VS). In the upper surface of an n-type impurity region (28), a p+-type impurity region (33) is formed between an NMOS (14) and a PMOS (15) and in contact with a p-type well (29). An electrode (41) resides on the p+-type impurity region (33) and the electrode (41) is connected to a high-voltage-side floating offset voltage (VS). The p+-type impurity region (33) has a higher impurity concentration than the p-type well (29) and is shallower than the p-type well (29). Between the p+-type impurity region (33) and the PMOS (15), an n+-type impurity region (32) is formed in the upper surface of the n-type impurity region (28). An electrode (40) resides on the n+-type impurity region (32) and the electrode (40) is connected to a high-voltage-side floating supply absolute voltage (VB).
    • 提供一种半导体器件,其能够避免由高压侧浮动偏置电压(VS)的负变化引起的故障和闭锁故障。 在n型杂质区(28)的上表面中,在NMOS(14)和PMOS(15)之间形成有与p型杂质区(33)接触的p + p型井(29)。 电极(41)位于p + +型杂质区域(33)上,电极(41)连接到高电压侧浮置偏移电压(VS)。 p型+杂质区域(33)的杂质浓度比p型阱(29)高,比p型阱(29)浅。 在p + + / - 型杂质区域(33)和PMOS(15)之间,形成n + +型杂质区域(32)的上表面 n型杂质区(28)。 电极(40)位于n + + +型杂质区(32)上,电极(40)连接到高压侧浮动电源绝对电压(VB)。
    • 6. 发明申请
    • Semiconductor device capable of avoiding latchup breakdown resulting from negative variation of floating offset voltage
    • 半导体器件能够避免浮动偏移电压的负变化引起的闭锁故障
    • US20060011960A1
    • 2006-01-19
    • US11229724
    • 2005-09-20
    • Kazunari HatadeHajime AkiyamaKazuhiro Shimizu
    • Kazunari HatadeHajime AkiyamaKazuhiro Shimizu
    • H01L29/94
    • H01L21/761H01L27/0921H01L2924/0002H01L2924/00
    • A semiconductor device is provided which is capable of avoiding malfunction and latchup breakdown resulting from negative variation of high-voltage-side floating offset voltage (VS). In the upper surface of an n-type impurity region (28), a p+-type impurity region (33) is formed between an NMOS (14) and a PMOS (15) and in contact with a p-type well (29). An electrode (41) resides on the p+-type impurity region (33) and the electrode (41) is connected to a high-voltage-side floating offset voltage (VS). The p+-type impurity region (33) has a higher impurity concentration than the p-type well (29) and is shallower than the p-type well (29). Between the p+-type impurity region (33) and the PMOS (15), an n+-type impurity region (32) is formed in the upper surface of the n-type impurity region (28). An electrode (40) resides on the n+-type impurity region (32) and the electrode (40) is connected to a high-voltage-side floating supply absolute voltage (VB).
    • 提供一种半导体器件,其能够避免由高压侧浮动偏置电压(VS)的负变化引起的故障和闭锁故障。 在n型杂质区(28)的上表面中,在NMOS(14)和PMOS(15)之间形成有与p型杂质区(33)接触的p + p型井(29)。 电极(41)位于p + +型杂质区域(33)上,电极(41)连接到高电压侧浮置偏移电压(VS)。 p型+杂质区域(33)的杂质浓度比p型阱(29)高,比p型阱(29)浅。 在p + + / - 型杂质区域(33)和PMOS(15)之间,形成n + +型杂质区域(32)的上表面 n型杂质区(28)。 电极(40)位于n + + +型杂质区(32)上,电极(40)连接到高压侧浮动电源绝对电压(VB)。
    • 8. 发明授权
    • Semiconductor device
    • 半导体器件
    • US07829955B2
    • 2010-11-09
    • US11554659
    • 2006-10-31
    • Kazunari Hatade
    • Kazunari Hatade
    • H01L29/76
    • H01L29/7393H01L27/088H01L29/0696H01L29/7394
    • A horizontal semiconductor device having multiple unit semiconductor elements, each of said unit semiconductor element formed by an IGBT including: a semiconductor substrate of a first conductivity type; a semiconductor region of a second conductivity type formed on the semiconductor substrate; a collector layer of the first conductivity type formed within the semiconductor region; a ring-shaped base layer of the first conductivity type formed within the semiconductor region such that the base layer is off said collector layer but surrounds said collector layer; and a ring-shaped first emitter layer of the second conductivity type formed in said base layer, wherein movement of carriers between the first emitter layer and the collector layer is controlled in a channel region formed in the base layer, and the unit semiconductor elements are disposed adjacent to each other.
    • 一种具有多个单位半导体元件的水平半导体器件,由IGBT形成的每个所述单位半导体元件包括:第一导电类型的半导体衬底; 形成在半导体衬底上的第二导电类型的半导体区域; 形成在半导体区域内的第一导电类型的集电极层; 形成在半导体区域内的第一导电类型的环形基底层,使得基底层离开所述集电极层但围绕所述集电极层; 以及形成在所述基底层中的第二导电类型的环形的第一发射极层,其中在所述第一发射极层和所述集电极层之间的载流子的移动被控制在形成在所述基极层中的沟道区域中,并且所述单位半导体元件 彼此相邻放置。
    • 9. 发明授权
    • Semiconductor device
    • 半导体器件
    • US07652350B2
    • 2010-01-26
    • US11461598
    • 2006-08-01
    • Kazunari Hatade
    • Kazunari Hatade
    • H01L29/745
    • H01L29/7393H01L29/0696H01L29/7394
    • A semiconductor device including a horizontal unit semiconductor element, the horizontal unit semiconductor element including: a) a semiconductor substrate of a first conductivity type; b) a semiconductor region of a second conductivity type formed on the semiconductor substrate; c) a collector layer of the first conductivity type formed within the semiconductor region; d) a base layer of the first conductivity type having an endless shape and formed within the semiconductor region such that the base layer is off the collector layer but surrounds the collector layer; and e) a first emitter layer of the second conductivity type formed in the base layer, the horizontal unit semiconductor element controlling, within a channel region formed in the base layer, movement of carriers between the first emitter layer and the collector layer, wherein the first emitter layer is formed by plural unit emitter layers which are formed along the base layer.
    • 一种包括水平单元半导体元件的半导体器件,所述水平单元半导体元件包括:a)第一导电类型的半导体衬底; b)形成在半导体衬底上的第二导电类型的半导体区域; c)形成在半导体区域内的第一导电类型的集电极层; d)具有环形形状并形成在半导体区域内的第一导电类型的基底层,使得基底层离开集电极层但围绕集电极层; 以及e)形成在所述基底层中的所述第二导电类型的第一发射极层,所述水平单元半导体元件控制在所述基极层中形成的沟道区内,所述第一发射极层和所述集电极层之间的载流子的移动, 第一发射极层由沿着基极层形成的多个单位发射极层形成。