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    • 7. 发明授权
    • Method of fabricating semiconductor device
    • 制造半导体器件的方法
    • US06977199B2
    • 2005-12-20
    • US10900151
    • 2004-07-28
    • Takeshi KishidaYusuke Kawase
    • Takeshi KishidaYusuke Kawase
    • H01L21/8242H01L21/02H01L27/108
    • H01L28/91H01L27/10817H01L27/10852H01L28/84
    • On a silicon oxide film including the interior of an opening a semispherical RGP film is deposited. At a temperature lower than that allowing a crystal of silicon to be grown a BPTEOS film is deposited to fill the opening. Then a portion other than the semispherical RGP film introduced in the opening is chemically mechanically polished and thus removed. This contributes to reduced crystal growth of silicon at the semispherical RGP film and hence reduced scattering and/or removal of the RGP film for example when a CMP step is performed. Subsequently the semispherical RGP film is annealed to grow a crystal of silicon to form a generally spherical RGP film. Thus a storage node can have an increased surface area and a capacitor can have increased capacity.
    • 在包含开口内部的氧化硅膜上沉积半球形RGP膜。 在低于允许生长硅晶体的温度下,沉积BPTEOS膜以填充开口。 然后将引入到开口中的半球形RGP膜以外的部分化学机械抛光并因此被除去。 这有助于在半球形RGP膜处降低硅的晶体生长,并因此例如当执行CMP步骤时减少RGP膜的散射和/或去除。 随后将半球形RGP膜退火以生长硅晶体,以形成通常为球形的RGP膜。 因此,存储节点可以具有增加的表面积,并且电容器可以具有增加的容量。