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1. 发明授权

US09799449B2 Multilayered ceramic capacitor with improved lead frame attachment 有权
公开(公告)号：US09799449B2
公开(公告)日：2017-10-24
申请号：US14498514
申请日：2014-09-26
申请人： Kemet Electronics Corporation
发明人： R. Allen Hill , Philip M. Lessner , Reggie Phillips , Keith Brown , James B. Byrd
IPC分类号： H01G2/06 , H01G4/008 , H01G4/232 , H01G4/30
CPC分类号： H01G2/06 , H01G4/008 , H01G4/232 , H01G4/2325 , H01G4/30 , Y10T29/43
摘要： A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat.

2. 发明授权

US10068708B2 Method for stacking electronic components 有权
公开(公告)号：US10068708B2
公开(公告)日：2018-09-04
申请号：US15007355
申请日：2016-01-27
申请人： Kemet Electronics Corporation
发明人： Maurice Perea , R Allen Hill , Reggie Phillips
IPC分类号： H01G7/00 , H01G4/30 , H01C1/14 , H01G4/232 , H01C1/014
摘要： A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes: providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination; providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads; providing a molded case comprising a cavity and a bottom; and forming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate with the barbs protruding towards the electronic components and the leads extending through the bottom.

3. 发明申请

US20160141106A1 Method for Stacking Electronic Components 审中-公开
标题翻译：堆叠电子元件的方法
公开(公告)号：US20160141106A1
公开(公告)日：2016-05-19
申请号：US15007355
申请日：2016-01-27
申请人： Kemet Electronics Corporation
发明人： Maurice Perea , R Allen Hill , Reggie Phillips
IPC分类号： H01G4/30
CPC分类号： H01G4/30 , H01C1/014 , H01C1/14 , H01G4/232 , Y10T29/417 , Y10T29/43
摘要： A method of forcing a stacked electronic component, and an electronic component formed by the method, therein the method includes:providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination;providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads;providing a molded case comprising a cavity and a bottom; and terming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate which the barbs protruding towards the electronic components and the leads extending through the bottom.
摘要翻译：一种强制堆叠电子元件的方法，以及通过该方法形成的电子部件，其中所述方法包括：提供多个电子部件，其中每个电子部件包括第一外部端接和第二外部端接; 提供第一引线框架板和第二引线框架板，其中第一引线框架板和第二引线框架板包括倒钩和引线; 提供包括空腔和底部的模制外壳; 并且将第一引线框架板和第二引线框架板之间的阵列中的电子部件的三明治命名为倒钩朝向电子部件突出的引线，并且引线延伸穿过底部。

4. 发明申请

US20150036263A1 Multilayered Ceramic Capacitor with Improved Lead Frame Attachment 有权
标题翻译：具有改进的引线框架附件的多层陶瓷电容器
公开(公告)号：US20150036263A1
公开(公告)日：2015-02-05
申请号：US14498514
申请日：2014-09-26
申请人： Kemet Electronics Corporation
发明人： R. Allen Hill , Philip M. Lessner , Reggie Phillips , Keith Brown , James B. Byrd
IPC分类号： H01G2/06 , H01G4/008 , H01G4/30
CPC分类号： H01G2/06 , H01G4/008 , H01G4/232 , H01G4/2325 , H01G4/30 , Y10T29/43
摘要： A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat.
摘要翻译：描述了具有改进的引线框架附件的电容器，其中改进的引线框架附件减轻了缺陷。电容器包括具有交替极性的平行导电内部电极与导电内部电极之间的电介质。第一铜底涂层与第一极性的导电内部电极电接触，并且第二铜底涂层与第二极性的导电内部电极电接触。第一引线与第一铜底涂层电接触，在第一引线和第一铜底涂层之间具有第一焊料。第二引线与第二铜底涂层电接触，在第二引线和第二铜底涂层之间具有第二焊料。

5. 发明授权

US09847175B2 Method for stacking electronic components 有权
公开(公告)号：US09847175B2
公开(公告)日：2017-12-19
申请号：US14152389
申请日：2014-01-10
申请人： Kemet Electronics Corporation
发明人： Maurice Perea , R Allen Hill , Reggie Phillips
IPC分类号： H01G7/00 , H01G4/30 , H01C1/14 , H01G4/232 , H01C1/014
CPC分类号： H01G4/30 , H01C1/014 , H01C1/14 , H01G4/232 , Y10T29/417 , Y10T29/43
摘要： A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes: providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination; providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads; providing a molded case comprising a cavity and a bottom; and forming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate with the barbs protruding towards the electronic components and the leads extending through the bottom.

6. 发明申请

US20140123453A1 Method for Stacking Electronic Components 有权
标题翻译：堆叠电子元件的方法
公开(公告)号：US20140123453A1
公开(公告)日：2014-05-08
申请号：US14152389
申请日：2014-01-10
申请人： Kemet Electronics Corporation
发明人： Maurice Perea , R. Allen Hill , Reggie Phillips
IPC分类号： H01G4/30
CPC分类号： H01G4/30 , H01C1/014 , H01C1/14 , H01G4/232 , Y10T29/417 , Y10T29/43
摘要： A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes:providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination; providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads; providing a molded case comprising a cavity and a bottom; and forming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate with the barbs protruding towards the electronic components and the leads extending through the bottom.
摘要翻译：一种形成层叠电子元件的方法，以及通过该方法形成的电子部件，其中该方法包括：提供多个电子部件，其中每个电子部件包括第一外部端接和第二外部端接; 提供第一引线框架板和第二引线框架板，其中第一引线框架板和第二引线框架板包括倒钩和引线; 提供包括空腔和底部的模制外壳; 以及在所述第一引线框架板和所述第二引线框架板之间以阵列形式形成电子部件的夹层，所述倒钩朝向所述电子部件突出并且所述引线延伸穿过所述底部。

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