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1. 发明申请

US20210304926A1 MODULAR CURRENT LIMITING RESISTOR 有权
公开(公告)号：US20210304926A1
公开(公告)日：2021-09-30
申请号：US17268733
申请日：2019-08-13
申请人： LS ELECTRIC CO., LTD.
发明人： Min-Jee KIM
IPC分类号： H01C7/13 , H01C1/014
摘要： The present disclosure relates to a modular current limiting resistor comprising a plurality of plate resistors, wherein the plate resistors each comprise a pair of coupling pieces and a conducting line integrally formed with the coupling pieces and having a zigzag shape between the coupling pieces; a pair of support frames which support the stacked plate resistors; a plurality of coupling members which pass through one of the support frames, pass the coupling pieces, and are inserted into the plate resistors; a plurality of conductor rings disposed between the plate resistors while passing through and being inserted into the coupling members, and which electrically connect the conducting line on each of the plate resistors; and at least one unit module comprising a plurality of insulating rings disposed between the plate resistors while passing through and being inserted into the coupling members so as to insulate the plate resistors.

2. 发明申请

US20210280343A1 SURFACE-MOUNTED RESISTOR 有权
公开(公告)号：US20210280343A1
公开(公告)日：2021-09-09
申请号：US17176274
申请日：2021-02-16
申请人： KOA CORPORATION
发明人： Daigo Hayashi , Jun Ito , Yuko Tezuka
IPC分类号： H01C17/00 , H01C1/144 , H01C1/014
摘要： A highly reliable surface-mounted resistor, which prevents a problem of disconnection between an electrode and a terminal of a chip resistor when heating during mounting, is disclosed. The surface-mounted resistor includes a chip resistor comprising a plate-shaped substrate, a resistance body formed on an upper surface of the substrate, and an electrode connected the resistance body and drawn from the upper surface of the substrate to a lower surface via an end surface, a plate-shaped lead terminal connected to the electrode of the chip resistor, the plate-shaped lead terminal being fixed to the electrode of the substrate on the lower surface side, and an exterior member covering an entire chip resistor and a part of the lead terminal.

3. 发明授权

US10586635B2 Chip resistor and mounting structure thereof 有权
公开(公告)号：US10586635B2
公开(公告)日：2020-03-10
申请号：US16371885
申请日：2019-04-01
申请人： ROHM CO., LTD.
发明人： Masaki Yoneda
IPC分类号： H01C1/012 , H01C1/142 , H01C1/028 , H01C3/12 , H01C1/014 , H01C1/14 , H05K3/34 , H05K1/18
摘要： A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

4. 发明授权

US09449742B2 Electrode component and method for fabricating the same 有权
标题翻译：电极部件及其制造方法
公开(公告)号：US09449742B2
公开(公告)日：2016-09-20
申请号：US14634823
申请日：2015-02-28
申请人： THINKING ELECTRONIC INDUSTRIAL CO., LTD.
发明人： Jen-Heng Huang
IPC分类号： H01C1/142 , H01C7/102 , H01C17/28 , H01B1/02 , H01G4/232 , H01G4/252 , H01C7/12 , H01C17/06 , H01C1/014 , H01C1/144
CPC分类号： H01C1/142 , H01B1/02 , H01C1/014 , H01C1/144 , H01C7/102 , H01C7/12 , H01C17/06 , H01C17/281 , H01C17/283 , H01G4/232 , H01G4/252
摘要： An electrode component includes a ceramic substrate, two electrode layers formed on two opposite surfaces of the ceramic substrate, two pins respectively connected to the two electrode layers, and an insulating layer enclosing the ceramic substrate, the electrode layers and a portion of each pin. Each electrode layer is formed of two or more base metal materials or alloys thereof, and the concentrations of the base metal materials progressively vary across the electrode layer. Accordingly, the production cost is lowered, environmental pollution caused by evaporation and thermal dissolution of organic solvent can be prevented, risk of separable electrode interface at high-voltage discharge is mitigated, and the fabrication process of the electrode layer is shortened while maintaining bonding strength between the electrode layers and the ceramic substrate and solderability between the electrode layers and the pins.
摘要翻译：电极部件包括陶瓷基板，形成在陶瓷基板的两个相对表面上的两个电极层，分别连接到两个电极层的两个引脚以及封装陶瓷基板，电极层和每个引脚的一部分的绝缘层。每个电极层由两种或多种贱金属材料或其合金形成，并且贱金属材料的浓度在电极层上逐渐变化。因此，可以防止生产成本降低，有机溶剂的蒸发和热溶解引起的环境污染，可以缓解高压放电时的分离电极界面的风险，并且电极层的制造工艺缩短同时保持结合强度在电极层和陶瓷基板之间以及电极层和引脚之间的可焊性。

5. 发明申请

US20160125984A1 SLIDE-TYPE VARIABLE RESISTOR 有权
标题翻译：滑动型可变电阻
公开(公告)号：US20160125984A1
公开(公告)日：2016-05-05
申请号：US14629825
申请日：2015-02-24
申请人： YU-CHEN CHUANG
发明人： TZU-HSUAN HUANG , WEI-LIANG LIU , CHIEN-CHIH HO
IPC分类号： H01C10/44 , H01C1/02 , H01C1/014
CPC分类号： H01C10/44 , H01C1/014 , H01C1/02
摘要： A slide-type variable resistor comprises a shell, two side guiding tracks, two end locking parts, a variable resistor circuit base, and a manipulating device. The two side guiding tracks are symmetrically assembled in the allocation space. The two end locking parts are symmetrically pressing against the two side guiding tracks respectively to have the two side guiding tracks positioned in the allocation space. The variable resistor circuit base is assembled to the shell and utilized for pressing against the two end locking parts to have the two end locking parts and the two side guiding tracks fixed in the allocation space. The manipulating device comprises a brush base, at least a brush, and a bar. The brush base has two symmetrically positioned sliding tracks slidably positioned in the two side guiding tracks. The brush is connected to the brush base and has elastic recovery to press against the variable resistor circuit base. The bar is connected to the brush base and extended outward from the position restriction hole of the shell.
摘要翻译：滑动型可变电阻器包括壳体，两个侧导轨，两个端部锁定部件，可变电阻器电路基座和操纵装置。两侧引导轨道对称地组装在分配空间中。两端锁定部件分别对称地压靠在两个侧导轨上，以使两侧引导轨定位在分配空间中。可变电阻器电路基座组装到壳体上，用于压靠两端锁定部件，以使两端锁定部分和两侧导轨固定在分配空间中。操纵装置包括刷基，至少刷和条。电刷底座具有可滑动地定位在两个侧导轨中的两个对称定位的滑动轨道。刷子连接到刷子基座，并具有弹性恢复以压靠可变电阻器电路基座。该杆连接到刷子基座并从壳体的位置限制孔向外延伸。

6. 发明授权

US09184362B2 Electronic-component mounting structure 有权
标题翻译：电子部件安装结构
公开(公告)号：US09184362B2
公开(公告)日：2015-11-10
申请号：US13966317
申请日：2013-08-14
申请人： Murata Manufacturing Co., Ltd.
发明人： Tadamasa Miura
IPC分类号： H01L23/12 , H01L35/02 , H01C1/014 , H01C1/14 , H01C7/00 , H01C1/144 , H01L23/00
CPC分类号： H01L35/02 , H01C1/014 , H01C1/14 , H01C1/1406 , H01C1/1413 , H01C1/144 , H01C7/008 , H01L24/16 , H01L2924/00013 , H01L2924/0002 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： An electronic-component mounting structure includes an electronic component which includes a metal substrate, a semiconductor ceramic layer located on the metal substrate, a pair of split electrodes located on the semiconductor ceramic layer, and plating films located on the split electrodes and the metal substrate, and a mounting body on which lands to be connected to the respective split electrodes of the electronic component are provided. The position of a peripheral end portion of each land to be connected to the corresponding split electrode is located farther inside than the position of a peripheral end portion of the split electrode. In addition, a plane area of the land is smaller than that of the split electrode.
摘要翻译：一种电子部件安装结构，包括电子部件，其包括金属基板，位于金属基板上的半导体陶瓷层，位于半导体陶瓷层上的一对分裂电极以及位于分割电极和金属基板上的镀膜以及安装体，其上设置有与电子部件的各个分割电极连接的焊盘。要连接到相应的分裂电极的每个焊盘的外围端部的位置位于比分裂电极的外周端部的位置更远的位置。此外，焊盘的平面面积小于分割电极的平面面积。

7. 发明授权

US6159386A Electrical resistance with at least two contact fields on a ceramic substrate and process for manufacturing the same 失效
标题翻译：在陶瓷基板上具有至少两个接触场的电阻及其制造方法
公开(公告)号：US6159386A
公开(公告)日：2000-12-12
申请号：US329561
申请日：1999-06-10
申请人： Karlheinz Wienand , Karlheinz Ullrich , Margit Sander , Stefan Dietmann
发明人： Karlheinz Wienand , Karlheinz Ullrich , Margit Sander , Stefan Dietmann
IPC分类号： G01K7/18 , H01C1/014 , H01C7/02 , H01C7/22 , H01C13/00 , H01C17/00 , H01C17/06
CPC分类号： G01K7/183 , H01C17/06 , H01C7/008 , H01C7/06 , H01C7/22 , H05K1/167 , H05K2201/0394 , H05K3/0029
摘要： A temperature-dependent measuring resistance with rapid response time is at least partially arranged on an electrically insulating surface of a ceramic substrate, wherein a portion of the conductor path spans a recess situated in the substrate in a bridge-like manner, and the remaining portion of the conductor path in the edge area of the substrate adjacent to the recess is provided with connection contact fields. The conductor path comprises a platinum or gold layer, wherein the conductor path is partially provided with a cover layer of glass, and wherein the connection contact fields are exposed. In a further embodiment, the conductor path is arranged together with the connection contact fields either on a screen-printed glass membrane or on a thin film membrane applied in a PVD process, which covers the surface of the ceramic substrate and spans the recess. The cover layer is likewise selectively applied by screen printing in case there is a glass membrane. In the case of a thin film membrane, the cover layer is also applied selectively by a PVD process and can be the same material as the thin film membrane. The ceramic substrate preferably comprises aluminum oxide.
摘要翻译：具有快速响应时间的温度依赖测量电阻至少部分地布置在陶瓷衬底的电绝缘表面上，其中导体路径的一部分以桥状方式跨越位于衬底中的凹部，其余部分在与凹部相邻的基板的边缘区域中的导体路径设置有连接接触区域。导体路径包括铂或金层，其中导体路径部分地设置有玻璃覆盖层，并且其中暴露连接接触区域。在另一个实施例中，导体路径与丝网印刷玻璃膜上的连接接触区域或涂覆在PVD工艺中的薄膜上一起布置，该薄膜膜覆盖陶瓷基板的表面并跨越凹部。在有玻璃膜的情况下，也可以通过丝网印刷选择性地施加覆盖层。在薄膜膜的情况下，覆盖层也通过PVD工艺选择性地施加，并且可以是与薄膜膜相同的材料。陶瓷基板优选包含氧化铝。

8. 发明授权

US6020809A Mounting structure for thermistor with positive resistance-to-temperature characteristic 失效
公开(公告)号：US6020809A
公开(公告)日：2000-02-01
申请号：US247730
申请日：1999-02-09
申请人： Michio Miyazaki , Haruyuki Takeuchi , Tadao Bekku
发明人： Michio Miyazaki , Haruyuki Takeuchi , Tadao Bekku
IPC分类号： H01C1/01 , H01C1/014 , H01C1/14 , H01C7/02 , H05K1/02 , H05K1/18 , H05K3/34 , H01C7/10
CPC分类号： H01C1/01 , H01C1/014 , H01C1/1406 , H05K1/0201 , H05K1/181 , H05K2201/062 , H05K2201/10378 , H05K2201/10643 , H05K2201/10659 , H05K2201/2036 , H05K3/341 , Y02P70/611
摘要： A thermistor with positive resistance-to-temperature characteristic used in a overcurrent protection circuit has electrodes on mutually opposite main surfaces and is mounted to a substrate having electrically conductive members such that deterioration of its voltage resistance due to heat emission can be controlled. A spacer with smaller thermal conductivity than the substrate and penetrated by a conductor piece with a small cross-sectional area is inserted between solder materials connecting to one of the thermistor electrodes. The other electrode is contacted by an elongated connecting member through its sectional surface transverse to its longitudinal direction such that the cross-sectional area of electrical conduction is reduced.

9. 发明授权

US5165052A Slide-in resistor grid 失效
标题翻译：滑入电阻网格
公开(公告)号：US5165052A
公开(公告)日：1992-11-17
申请号：US691382
申请日：1991-04-25
申请人： Victor V. Kirilloff , Robert Cummins , Richard S. Dawson , William A. Benson
发明人： Victor V. Kirilloff , Robert Cummins , Richard S. Dawson , William A. Benson
IPC分类号： F02B3/06 , H01C1/014 , H01C3/10
CPC分类号： H01C3/10 , H01C1/014 , F02B3/06
摘要： A resistor grid for dynamic braking of diesel electric locomotives has a rigid frame comprising outer metal side pieces and metal dividers within the frame between which are positioned columns of fan-folded resistor ribbon. The dividers carry support plates having transverse aligned tabs along both sides fixed normal to the support plate, each tab having a notch in its inside edge, supported plates which slide in those slots longitudinally, the supported plates and the folds of the resistor ribbon carrying studs and bushings which interfit by movement normal to those plates.
摘要翻译：用于柴油机车动力制动的电阻网格具有刚性框架，该框架包括框架内的外金属侧片和金属分隔件，它们之间位于风扇折叠电阻带的定位柱之间。分隔器携带支撑板，其两侧的横向对齐的突片两边固定在支撑板上，每个突片在其内侧边缘都有一个凹口，支撑的板在这些槽的纵向上滑动，支撑的板和电阻带携带螺柱的折叠以及与这些板材正常运动相互配合的衬套。

10. 发明授权

US11545488B2 Integrated circuit and semiconductor device including same 有权
公开(公告)号：US11545488B2
公开(公告)日：2023-01-03
申请号：US17224558
申请日：2021-04-07
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Chang-Bum Kim , Sunghoon Kim , Daeseok Byeon
IPC分类号： H01L27/07 , H01L29/06 , H01C1/012 , H01C1/014 , H01C7/00 , H01C13/02 , H01L49/02
摘要： An integrated circuit includes; a substrate including a single active region, a first active resistor formed on the substrate, and a transistor including a first junction area in the single active region. The first active resistor and the transistor are electrically connected through the first junction area. The first active resistor is formed between a first node and a second node included in the first junction area. The first node is connected to a first contact, and the second node is connected to a second contact.

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