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1. 发明授权

US08569626B2 Contact 有权
标题翻译：联系
公开(公告)号：US08569626B2
公开(公告)日：2013-10-29
申请号：US13139099
申请日：2010-11-16
申请人： Tomohisa Kurita , Hideo Yumi , Tatsuya Nakamura , Kenji Konda , Hiroki Kitano
发明人： Tomohisa Kurita , Hideo Yumi , Tatsuya Nakamura , Kenji Konda , Hiroki Kitano
IPC分类号： H01R4/04
CPC分类号： H01R12/57 , H01R13/2442 , H01R13/245 , H01R43/205 , H05K1/0215 , H05K9/0016 , H05K2201/10189 , H05K2201/10265 , H05K2201/1031 , H05K2203/0195 , Y02P70/611
摘要： A contact includes a solder bonding portion, an elastic contact portion, and a suction portion. An undersurface of the solder bonding portion is a solder bonding face which is to be solder bonded to the conductor pattern. The elastic contact portion is connected to one end of the solder bonding portion and bent over the solder bonding portion. When in contact with a conductive member, the elastic contact portion is pressed against the conductive member while being elastically deformed. The suction portion is connected to the solder bonding portion independently of the elastic contact portion. The suction portion is made a suction face for a suction nozzle of an automatic mounter, with its top end being arranged in parallel to the undersurface of the solder bonding portion on the conductive member side of the elastic contact portion.
摘要翻译：触点包括焊接部分，弹性接触部分和抽吸部分。焊接接合部的下表面是要焊接到导体图案的焊料接合面。弹性接触部分连接到焊接接合部分的一端并在焊接部分上弯曲。当与导电构件接触时，弹性接触部分被弹性变形地压靠在导电构件上。吸引部分独立于弹性接触部分连接到焊接接合部分。吸引部分为自动安装机的吸嘴的吸附面，其顶端平行于弹性接触部分的导电部件侧的焊料接合部分的下表面。

2. 发明申请

US20130206457A1 SURFACE MOUNT CLIP 有权
标题翻译：表面安装夹
公开(公告)号：US20130206457A1
公开(公告)日：2013-08-15
申请号：US13807480
申请日：2011-06-30
申请人： Kenji Konda , Tomohisa Kurita , Hiroki Kitano , Tatsuya Nakamura , Hideo Yumi
发明人： Kenji Konda , Tomohisa Kurita , Hiroki Kitano , Tatsuya Nakamura , Hideo Yumi
IPC分类号： H05K1/18
CPC分类号： H05K1/181 , F16B5/0635 , F16B21/073 , H05K9/0035
摘要： A surface mount clip including: a solder joint part in which a lower surface thereof is to be a solder joint surface to be soldered and connected to a conductor pattern on a printed circuit board; a pair of support parts connected to the solder joint part, and, when the solder joint part is soldered and connected to the printed circuit board, supported in a position above the printed circuit board at an interval between the pair of support parts, the interval allowing a conductive member other than the printed circuit board to be inserted therein; and a resilient contact part that is connected at least to one of the pair of support parts, is resiliently deformed and pressed by the conductive member, when the conductive member is inserted between the pair of support parts, and electrically connects the conductor pattern and the conductive member.
摘要翻译：一种表面安装夹具，包括：焊接部，其下表面为要焊接并焊接到印刷电路板上的导体图案的焊点表面; 连接到焊接部分的一对支撑部件，并且当焊接部件被焊接并连接到印刷电路板时，以一对支撑部件之间的间隔被支撑在印刷电路板上方的位置处，间隔允许除了印刷电路板之外的导电构件插入其中; 并且当所述导电构件插入在所述一对支撑部之间时，所述弹性接触部被至少连接到所述一对支撑部中的一个支撑部中的一个，弹性变形并被所述导电构件按压，并且将所述导体图案和导电构件。

3. 发明授权

US09167698B2 Surface mount clip 有权
标题翻译：表面安装夹
公开(公告)号：US09167698B2
公开(公告)日：2015-10-20
申请号：US13807480
申请日：2011-06-30
申请人： Kenji Konda , Tomohisa Kurita , Hiroki Kitano , Tatsuya Nakamura , Hideo Yumi
发明人： Kenji Konda , Tomohisa Kurita , Hiroki Kitano , Tatsuya Nakamura , Hideo Yumi
IPC分类号： H05K1/18 , H05K9/00 , F16B5/06 , F16B21/07
CPC分类号： H05K1/181 , F16B5/0635 , F16B21/073 , H05K9/0035
摘要： A surface mount clip including: a solder joint part in which a lower surface thereof is to be a solder joint surface to be soldered and connected to a conductor pattern on a printed circuit board. A pair of support parts are connected to the solder joint part and, when the solder joint part is soldered and connected to the printed circuit board, are supported in a position above the printed circuit board at an interval between the pair of support parts. The interval allows a conductive member, other than the printed circuit board, to be inserted therein. A resilient contact part, that is connected at least to one of the pair of support parts, is resiliently deformed and pressed by the conductive member, when the conductive member is inserted between the pair of support parts, and electrically connects the conductor pattern and the conductive member.
摘要翻译：一种表面安装夹具，包括：焊接部，其下表面为要焊接并焊接在印刷电路板上的导体图案的焊点表面。一对支撑部分连接到焊接部分，并且当焊接部分被焊接并连接到印刷电路板时，以一对支撑部分之间的间隔被支撑在印刷电路板上方的位置。间隔允许除了印刷电路板之外的导电构件插入其中。当导电构件插入在该对支撑部分之间时，弹性接触部分至少连接到一对支撑部件中的一个支撑部件之间弹性变形并被导电部件按压，并将导体图案和导电构件。

4. 发明申请

US20120217050A1 CONTACT 有权
标题翻译：联系
公开(公告)号：US20120217050A1
公开(公告)日：2012-08-30
申请号：US13139099
申请日：2010-11-16
申请人： Tomohisa Kurita , Hideo Yumi , Tatsuya Nakamura , Kenji Konda , Hiroki Kitano
发明人： Tomohisa Kurita , Hideo Yumi , Tatsuya Nakamura , Kenji Konda , Hiroki Kitano
IPC分类号： H05K1/18
CPC分类号： H01R12/57 , H01R13/2442 , H01R13/245 , H01R43/205 , H05K1/0215 , H05K9/0016 , H05K2201/10189 , H05K2201/10265 , H05K2201/1031 , H05K2203/0195 , Y02P70/611
摘要： A contact includes a solder bonding portion, an elastic contact portion, and a suction portion. An undersurface of the solder bonding portion is a solder bonding face which is to be solder bonded to the conductor pattern. The elastic contact portion is connected to one end of the solder bonding portion and bent over the solder bonding portion. When in contact with a conductive member, the elastic contact portion is pressed against the conductive member while being elastically deformed. The suction portion is connected to the solder bonding portion independently of the elastic contact portion. The suction portion is made a suction face for a suction nozzle of an automatic mounter, with its top end being arranged in parallel to the undersurface of the solder bonding portion on the conductive member side of the elastic contact portion.
摘要翻译：触点包括焊接部分，弹性接触部分和抽吸部分。焊接接合部的下表面是要焊接到导体图案的焊料接合面。弹性接触部分连接到焊接接合部分的一端并在焊接部分上弯曲。当与导电构件接触时，弹性接触部分被弹性变形地压靠在导电构件上。吸引部分独立于弹性接触部分连接到焊接接合部分。吸引部分为自动安装机的吸嘴的吸附面，其顶端平行于弹性接触部分的导电部件侧的焊料接合部分的下表面。

5. 发明授权

US08808011B2 Contact and bonding structure of the contact 有权
标题翻译：触点接触和接合结构
公开(公告)号：US08808011B2
公开(公告)日：2014-08-19
申请号：US13520246
申请日：2011-11-04
申请人： Hiroki Kitano , Hideo Yumi , Tatsuya Nakamura
发明人： Hiroki Kitano , Hideo Yumi , Tatsuya Nakamura
IPC分类号： H01R12/00 , H01R13/24 , H01R12/57 , H01R12/58 , H05K3/34 , H05K1/02 , H05K1/18
CPC分类号： H05K1/0213 , H01R4/028 , H01R12/57 , H01R12/58 , H01R13/2421 , H05K1/182 , H05K3/341 , H05K2201/09072 , H05K2201/1031 , Y02P70/611 , Y02P70/613 , Y10S439/947
摘要： A contact capable of electrically connecting an electrically conductive portion provided on a plate-like member with an electrically conductive member different from the plate-like member. The contact includes a main body; a movable portion held by the main body so as to be reciprocal in directions of increasing and decreasing of a projecting amount thereof outwardly of the main body; and a biasing mechanism that biases the movable portion in such a direction that the projecting amount of the movable portion increases. The main body includes a tubular portion, a solder inflow suppressing portion, and a soldering portion.
摘要翻译：一种能够将设置在板状构件上的导电部分与不同于板状构件的导电构件电连接的接点。触点包括主体; 可动部，其由主体保持，以便在主体的外侧的突出量的增加和减少的方向上往复; 以及偏压机构，其以可移动部分的突出量增加的方向偏压可动部分。主体包括管状部分，焊料流入抑制部分和焊接部分。

6. 发明申请

US20130264098A1 CONTACT AND BONDING STRUCTURE OF THE CONTACT 有权
标题翻译：联系人的接触和结合结构
公开(公告)号：US20130264098A1
公开(公告)日：2013-10-10
申请号：US13520246
申请日：2011-11-04
申请人： Hiroki Kitano , Hideo Yumi , Tatsuya Nakamura
发明人： Hiroki Kitano , Hideo Yumi , Tatsuya Nakamura
IPC分类号： H05K1/02
CPC分类号： H05K1/0213 , H01R4/028 , H01R12/57 , H01R12/58 , H01R13/2421 , H05K1/182 , H05K3/341 , H05K2201/09072 , H05K2201/1031 , Y02P70/611 , Y02P70/613 , Y10S439/947
摘要： A contact capable of electrically connecting an electrically conductive portion provided on a plate-like member with an electrically conductive member different from the plate-like member. The contact includes a main body; a movable portion held by the main body so as to be reciprocal in directions of increasing and decreasing of a projecting amount thereof outwardly of the main body; and a biasing mechanism that biases the movable portion in such a direction that the projecting amount of the movable portion increases. The main body includes a tubular portion, a solder inflow suppressing portion, and a soldering portion.
摘要翻译：一种能够将设置在板状构件上的导电部分与不同于板状构件的导电构件电连接的接点。触点包括主体; 可动部，其由主体保持，以便在主体的外侧的突出量的增加和减少的方向上往复; 以及偏压机构，其以可移动部分的突出量增加的方向偏压可动部分。主体包括管状部分，焊料流入抑制部分和焊接部分。

7. 发明授权

US07503774B2 Surface mount contact member 有权
标题翻译：表面安装接触件
公开(公告)号：US07503774B2
公开(公告)日：2009-03-17
申请号：US12167410
申请日：2008-07-03
申请人： Hideo Yumi , Kenji Konda
发明人： Hideo Yumi , Kenji Konda
IPC分类号： H01R12/00
CPC分类号： H01R13/2421 , Y10S439/94
摘要： A surface mount contact member includes a metal base and a conductive coil spring. The metal base is provided with a nozzle suction surface to be sucked by a suction nozzle and a soldering surface that can be soldered. The soldering surface is faced downward when the nozzle suction surface is faced upward. The conductive coil spring is attached to the metal base in an electrically conductive manner with the nozzle suction surface being exposed to an inner peripheral side of the coil spring.
摘要翻译：表面安装接触构件包括金属基底和导电螺旋弹簧。金属基座设置有可由吸嘴吸附的喷嘴吸附面和可焊接的焊接面。当喷嘴吸力面向上时，焊接面向下。导电螺旋弹簧以导电的方式附接到金属基座，喷嘴吸附表面暴露于螺旋弹簧的内周侧。

8. 发明授权

US09455389B2 Thermoelectric conversion element, manufacturing method for the thermoelectric conversion element, and thermoelectric conversion module 有权
标题翻译：热电转换元件，热电转换元件的制造方法和热电转换模块
公开(公告)号：US09455389B2
公开(公告)日：2016-09-27
申请号：US13678635
申请日：2012-11-16
申请人： Yasuhiro Kawaguchi , Hideo Yumi , Hiroki Kitano , Kenta Takagi , Kimihiro Ozaki
发明人： Yasuhiro Kawaguchi , Hideo Yumi , Hiroki Kitano , Kenta Takagi , Kimihiro Ozaki
IPC分类号： H01L35/32 , H01L35/34 , H01L35/20
CPC分类号： H01L35/32 , H01L35/20 , H01L35/34
摘要： In a thermoelectric conversion module, each of a p-type element and an n-type element is configured by aligning a plurality of particles in series and connecting the particles to each other. Around a connection part in which the particles are connected to each other, a protrusion is protruded. The protrusion has a shape of continuously extending around the entire periphery of the connection part. The protrusion may be partly interrupted, but in such a case, a circumferential length of one interrupted portion is less than one half of the periphery of the connection part.
摘要翻译：在热电转换模块中，p型元件和n型元件通过将多个粒子串联并将粒子彼此连接而构成。在其中颗粒彼此连接的连接部分周围，突出部突出。该突起部具有连续部的周围连续延伸的形状。突起可以部分地中断，但是在这种情况下，一个中断部分的圆周长度小于连接部分周边的一半。

9. 发明授权

US06465738B2 Grounding terminal and mounting structure of the same on a printed circuit board 失效
标题翻译：接地端子及其安装结构在印刷电路板上
公开(公告)号：US06465738B2
公开(公告)日：2002-10-15
申请号：US09951785
申请日：2001-09-13
申请人： Hideo Yumi
发明人： Hideo Yumi
IPC分类号： H01R400
CPC分类号： H05K3/341 , H01R4/64 , H01R12/57 , H01R13/24 , H01R43/0256 , H05K1/0215 , H05K2201/09663 , H05K2201/1031 , Y02P70/611 , Y02P70/613 , Y10T29/49149
摘要： The present invention realizes proper grounding of a printed circuit board to a grounding conductor by solving the problems in soldering a grounding terminal to a printed circuit board by reflow soldering, relating to a mounting structure of a grounding terminal on a printed circuit board formed by soldering a grounding terminal to the printed circuit board. Two joint surfaces having different surface areas are formed within the joint part of the grounding terminal, and the grounding terminal is soldered to the conductive pattern on the printed circuit board corresponding to the joint surfaces by using the solder having an amount corresponding to the surface area of each joint surface. Also, the bending area as the center of elastic deformation of the contact part of the grounding terminal is formed at a predetermined distance away from the relatively small joint surface of the joint part.
摘要翻译：本发明通过将通过回流焊接将接地端子焊接到印刷电路板的问题与印刷电路板上的接地端子的安装结构相关联，从而实现印刷电路板与接地导体的接地到印刷电路板的接地端子。在接地端子的接合部分内形成具有不同表面积的两个接合表面，并且通过使用具有对应于表面积的量的焊料将接地端子焊接到与接合表面相对应的印刷电路板上的导电图案上的每个接合面。而且，作为接地端子的接触部的弹性变形的中心的弯曲区域形成为远离接合部的较小的接合面的规定的距离。

10. 发明授权

US06300579B1 Grounding terminal and mounting structure of the same on a printed circuit board 有权
标题翻译：接地端子及其安装结构在印刷电路板上
公开(公告)号：US06300579B1
公开(公告)日：2001-10-09
申请号：US09301807
申请日：1999-04-28
申请人： Hideo Yumi
发明人： Hideo Yumi
IPC分类号： H01R1204
CPC分类号： H05K3/341 , H01R4/64 , H01R12/57 , H01R13/24 , H01R43/0256 , H05K1/0215 , H05K2201/09663 , H05K2201/1031 , Y02P70/611 , Y02P70/613 , Y10T29/49149
摘要： The present invention realizes proper grounding of a printed circuit board to a grounding conductor by solving the problems in soldering a grounding terminal to a printed circuit board by reflow soldering, relating to a mounting structure of a grounding terminal on a printed circuit board formed by soldering a grounding terminal to the printed circuit board. Two joint surfaces having different surface areas are formed within the joint part of the grounding terminal, and the grounding terminal is soldered to the conductive pattern on the printed circuit board corresponding to the joint surfaces by using the solder having an amount corresponding to the surface area of each joint surface. Also, the bending area as the center of elastic deformation of the contact part of the grounding terminal is formed at a predetermined distance away from the relatively small joint surface of the joint part.
摘要翻译：本发明通过将通过回流焊接将接地端子焊接到印刷电路板的问题与印刷电路板上的接地端子的安装结构相关联，从而实现印刷电路板与接地导体的接地到印刷电路板的接地端子。在接地端子的接合部分内形成具有不同表面积的两个接合表面，并且通过使用具有对应于表面积的量的焊料将接地端子焊接到与接合表面相对应的印刷电路板上的导电图案上的每个接合面。而且，作为接地端子的接触部的弹性变形的中心的弯曲区域形成为远离接合部的较小的接合面的规定的距离。

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