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1. 发明申请

US20070013460A1 PHASE SHIFTER WITH FLEXIBLE CONTROL VOLTAGE 有权
标题翻译：具有柔性控制电压的相变器
公开(公告)号：US20070013460A1
公开(公告)日：2007-01-18
申请号：US11160845
申请日：2005-07-12
申请人： Kenneth Buer , Chris Grondahl
发明人： Kenneth Buer , Chris Grondahl
IPC分类号： H01P1/18
CPC分类号： H03H11/20 , H03H7/20
摘要： The invention provides a phase shifter with flexible control voltage that is useful with all RF systems that phase shift a RF signal. The phase shifter according to the present invention may comprise transistors used as switching elements. In one aspect, the phase shifter provides the option of controlling a phase shifter with either a positive or a negative voltage control signal. For example, the dc ground of the transistors included in the phase shifter may be floated. The RF grounding of the transistors may be achieved by in-band resonant capacitors. Thus, the control voltage provided to the transistors is flexible in that it may be connected to a positive or negative control voltage, or it may be connected to ground, or it may swing from a positive control voltage to a negative control voltage or vice versa.
摘要翻译：本发明提供了具有灵活控制电压的移相器，其对于相移RF信号的所有RF系统是有用的。根据本发明的移相器可以包括用作开关元件的晶体管。在一个方面，移相器提供了使用正或负电压控制信号来控制移相器的选项。例如，包括在移相器中的晶体管的直流地可以浮置。晶体管的RF接地可以通过带内谐振电容器实现。因此，提供给晶体管的控制电压是灵活的，因为它可以连接到正或负的控制电压，或者它可以连接到地，或者它可以从正的控制电压摆动到负的控制电压，反之亦然。

2. 发明申请

US20070029647A1 RADIO FREQUENCY OVER-MOLDED LEADFRAME PACKAGE 有权
标题翻译：无线频率过模糊的包装
公开(公告)号：US20070029647A1
公开(公告)日：2007-02-08
申请号：US11161420
申请日：2005-08-02
申请人： Richard Torkington , Michael Lyons , Kenneth Buer
发明人： Richard Torkington , Michael Lyons , Kenneth Buer
IPC分类号： H01L23/495
CPC分类号： H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2223/6611 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4911 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/1423 , H01L2924/15313 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要： An over-molded leadframe (e.g., a Quad Flat No-lead (QFN)) package capable of operating at frequencies in the range of about five gigahertz (GHz) to about 300 GHz and a method of making the QFN package are disclosed. The QFN package includes a capacitance lead configured to substantially reduce and/or offset the inductance created by one or more wirebonds used to connect an integrated circuit (IC) chip on the package to an input/output (I/O) lead. The IC chip is connected to the capacitance lead via one or more wirebonds, and the capacitance lead is then connected to the I/O lead via at least a second wirebond. Thus, inductance created by the one or more wirebonds on the package is substantially reduced and/or offset by the capacitance lead prior to a signal being output by the package and/or received by the IC chip.
摘要翻译：公开了能够在约5千兆赫兹（GHz）至约300GHz范围内的频率工作的成型引线框架（例如，四方扁平无引线（QFN））封装以及制造该QFN封装的方法。 QFN封装包括电容引线，其配置为基本上减少和/或偏移由用于将封装上的集成电路（IC）芯片连接到输入/输出（I / O）引线的一个或多个引线结合产生的电感。 IC芯片经由一个或多个引线键连接到电容引线，然后电容引线经由至少第二引线键连接到I / O引线。因此，由封装输出信号和/或由IC芯片接收的信号之前，由封装上的一个或多个引线引起的电感被电容引线基本上减小和/或偏移。

3. 发明申请

US20060244547A1 METHODS FOR PROVIDING BIAS TO A MONOLITHIC MICROWAVE INTEGRATED CIRCUIT 有权
标题翻译：将微分方式提供给单片微波集成电路的方法
公开(公告)号：US20060244547A1
公开(公告)日：2006-11-02
申请号：US11458352
申请日：2006-07-18
申请人： Kenneth Buer
发明人： Kenneth Buer
IPC分类号： H03H7/38
CPC分类号： H01L24/06 , H01L23/50 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2223/6611 , H01L2223/665 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48011 , H01L2224/48091 , H01L2224/48195 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/48844 , H01L2224/48847 , H01L2224/49 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01049 , H01L2924/01058 , H01L2924/01079 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/1305 , H01L2924/1306 , H01L2924/13064 , H01L2924/14 , H01L2924/1423 , H01L2924/19041 , H01L2924/3011 , H01L2924/30111 , H03F3/195 , H03F2200/12 , H01L2924/00014 , H01L2924/20643 , H01L2924/20653 , H01L2924/20654 , H01L2224/48824 , H01L2924/00 , H01L2224/48744
摘要： In general, in accordance with an exemplary aspect of the present invention, a method is provided for providing DC bias to an MMIC power amplifier, the method comprising the steps of: attaching a first end of a bond wire directly to a matching structure; and, attaching a second end of a bond wire to a DC bias source. In another exemplary aspect, a method is provided for RF power amplification comprising the steps of: electrically communicating a DC bias to a MMIC power amplifier, wherein the MMIC power amplifier comprises a RF matching structure, and wherein the DC bias is electrically communicated via a bond wire that is coupled directly to the RF matching structure; and, blocking unwanted RF signals with the bond wire.
摘要翻译：通常，根据本发明的示例性方面，提供了一种用于向MMIC功率放大器提供DC偏压的方法，所述方法包括以下步骤：将接合线的第一端直接附接到匹配结构; 并且将接合线的第二端附接到DC偏压源。在另一示例性方面，提供了一种用于RF功率放大的方法，包括以下步骤：将DC偏压电连接到MMIC功率放大器，其中所述MMIC功率放大器包括RF匹配结构，并且其中所述DC偏压通过直接耦合到RF匹配结构的接合线; 并用接合线阻挡不需要的RF信号。

4. 发明申请

US20050098880A1 Direct contact semiconductor cooling 有权
标题翻译：直接接触半导体冷却
公开(公告)号：US20050098880A1
公开(公告)日：2005-05-12
申请号：US10849097
申请日：2004-05-19
申请人： Richard Torkington , Jon Filreis , Kenneth Buer
发明人： Richard Torkington , Jon Filreis , Kenneth Buer
IPC分类号： H01L23/24 , H01L23/44 , H01L23/053
CPC分类号： H01L23/44 , H01L2224/48091 , H01L2924/1305 , H01L2924/00014 , H01L2924/00
摘要： Thermal spreading resistance, associated with small geometry electronic features that generate heat on a semiconductor, may be reduced through the addition of a thermally conductive fluid. For example, a dielectric fluid may be used within a volume between a semiconductor package and the semiconductor substrate. Therefore, direct thermal cooling may be employed to reduce the thermal spreading resistance often encountered in MMIC power amplifier devices. Furthermore, exemplary methods to achieve this sealing are described herein.
摘要翻译：通过添加导热流体可以减少与在半导体上产生热量的小几何电子特征相关联的热扩散阻力。例如，可以在半导体封装和半导体衬底之间的体积内使用电介质流体。因此，可以采用直接热冷却来降低MMIC功率放大器器件中经常遇到的耐热扩散电阻。此外，本文描述了实现该密封的示例性方法。

5. 发明申请

US20110111715A1 OUTDOOR UNIT INSTALLATION AID FEATURE 审中-公开
标题翻译：室外装置安装辅助功能
公开(公告)号：US20110111715A1
公开(公告)日：2011-05-12
申请号：US12613706
申请日：2009-11-06
申请人： Kenneth Buer , Ramana Darapu
发明人： Kenneth Buer , Ramana Darapu
IPC分类号： H04B17/00
CPC分类号： H01Q1/1257 , H01Q19/12
摘要： In an exemplary embodiment, an outdoor unit of an antenna system includes an audio device that generates a sound that aids in the aiming of the antenna system. The sound is based on the strength of the received signal. Furthermore, in an exemplary embodiment, the sound indicates the signal strength using tone, pitch, repetition, volume, and the like. This sound can be used by a person to aim an antenna system in order to receive a better signal. The person installing the antenna system can be a professional installer, a layperson, or the consumer because the installer does not require any special skills or equipment.
摘要翻译：在示例性实施例中，天线系统的室外单元包括产生有助于天线系统瞄准的声音的音频设备。声音基于接收信号的强度。此外，在示例性实施例中，声音指示使用音调，音调，重复，音量等的信号强度。这个声音可以被一个人用来瞄准天线系统，以便接收更好的信号。安装天线系统的人可以是专业安装人员，外行人员或消费者，因为安装人员不需要任何特殊技能或设备。

6. 发明申请

US20070015471A1 SINGLE OSCILLATOR TRANSCEIVER 有权
标题翻译：单振荡器收发器
公开(公告)号：US20070015471A1
公开(公告)日：2007-01-18
申请号：US11465760
申请日：2006-08-18
申请人： Dean Cook , Kenneth Buer
发明人： Dean Cook , Kenneth Buer
IPC分类号： H04B1/40
CPC分类号： H04B1/408 , H04B1/403
摘要： A frequency plan is provided for particular use in a transceiver. Advantageously, a single oscillator may be used to generate desired frequency signals. One or more power splitters receive the signal and equally divide the signal into first and second signals having a frequency substantially equal to the original. Multipliers on each arm of the transceiver receive a signal and increase the frequency of the signal. In one exemplary embodiment, multiple signals having different frequencies may be transmitted over the same cable due in part to the generated frequency separation between the signals. In another exemplary embodiment, multiple signals may be transmitted over multiple cables. Additionally, multiple signals over one or more cables may be transmitted at or below 3 GHz.
摘要翻译：提供频率计划用于收发器中的特定用途。有利地，可以使用单个振荡器来产生期望的频率信号。一个或多个功率分配器接收信号并且将信号等分成具有基本上等于原始频率的频率的第一和第二信号。收发器的每个臂上的乘数接收信号并增加信号的频率。在一个示例性实施例中，具有不同频率的多个信号可以通过相同的电缆传输，部分是由于信号之间产生的频率间隔。在另一示例性实施例中，多个信号可以通过多个电缆传输。此外，一根或多根电缆上的多个信号可以在3 GHz或以下传输。

7. 发明申请

US20060030275A1 High power parallel block-up converter 审中-公开
标题翻译：大功率并联封装转换器
公开(公告)号：US20060030275A1
公开(公告)日：2006-02-09
申请号：US11004488
申请日：2004-12-03
申请人： Kenneth Buer , Dean Cook , Noel Lopez
发明人： Kenneth Buer , Dean Cook , Noel Lopez
IPC分类号： H04B1/38
CPC分类号： H03F1/0277 , H03F1/0205 , H03F3/211 , H03F2203/21106 , H03F2203/21142
摘要： An apparatus, method and system to increase the power of transmission signals at a reduced cost. The apparatus includes two or more transceivers, transmitters and/or block-up converters connected in parallel to increase the total output power and/or receiving power of the apparatus. The method and system each, respectively, utilize the apparatus to improve the power and reliability of transmitted communication signals.
摘要翻译：一种降低传输信号功率的装置，方法和系统。该装置包括并联连接的两个或多个收发器，发射器和/或阻断转换器，以增加设备的总输出功率和/或接收功率。该方法和系统分别利用该装置来提高发送的通信信号的功率和可靠性。

8. 发明申请

US20060220766A1 DIELECTRIC RESONATOR RF INTERCONNECT 有权
标题翻译：电介质谐振器RF互连
公开(公告)号：US20060220766A1
公开(公告)日：2006-10-05
申请号：US10907425
申请日：2005-03-31
申请人： Kenneth Buer , David Laidig
发明人： Kenneth Buer , David Laidig
IPC分类号： H01P7/10
CPC分类号： H01P7/10
摘要： A RF interconnect comprising a dielectric resonator is disclosed. The dielectric resonator may be included in an interconnect housing. The dielectric resonator includes metalized side surfaces useful for securing the dielectric resonator in an aperture formed in the interconnect housing. The dimensions or material selected for the dielectric resonator may be predetermined to enable the dielectric resonator to operate as a filter or waveguide, as desired.
摘要翻译：公开了一种包括介质谐振器的RF互连。介质谐振器可以包括在互连壳体中。介质谐振器包括用于将介质谐振器固定在互连壳体中形成的孔中的金属化侧表面。选择用于介质谐振器的尺寸或材料可以是预定的，以使介电谐振器能够根据需要作为滤波器或波导进行操作。

9. 发明申请

US20050017817A1 OFF-CHIP BIAS FEED SYSTEM 有权
标题翻译：离线偏置进料系统
公开(公告)号：US20050017817A1
公开(公告)日：2005-01-27
申请号：US10711306
申请日：2004-09-09
申请人： Kenneth Buer
发明人： Kenneth Buer
IPC分类号： H01L23/66 , H03H7/38
CPC分类号： H01L24/06 , H01L23/50 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2223/6611 , H01L2223/665 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48011 , H01L2224/48091 , H01L2224/48195 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/48844 , H01L2224/48847 , H01L2224/49 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01049 , H01L2924/01058 , H01L2924/01079 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/1305 , H01L2924/1306 , H01L2924/13064 , H01L2924/14 , H01L2924/1423 , H01L2924/19041 , H01L2924/3011 , H01L2924/30111 , H03F3/195 , H03F2200/12 , H01L2924/00014 , H01L2924/20643 , H01L2924/20653 , H01L2924/20654 , H01L2224/48824 , H01L2924/00 , H01L2224/48744
摘要： In general, the present invention provides an RF signal amplification system having an improved layout. The size of the MMIC can be reduced without loss of functionality and/or additional functionality can be added to the MMIC without increasing the size of the MMIC. The MMIC is configured with an off-chip bias feed system. The MMIC is configured with landing zones for receiving a bond wire such that on-chip bias circuitry can be reduced and/or eliminated.
摘要翻译：通常，本发明提供了一种具有改进布局的RF信号放大系统。可以减少MMIC的大小而不会损失功能，并且/或者可以在不增加MMIC的大小的情况下将附加功能添加到MMIC。 MMIC配置有片外偏置馈电系统。 MMIC配置有用于接收接合线的着陆区，使得可以减少和/或消除片上偏置电路。

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