专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09748208B2 Light-emitting device 有权
公开(公告)号：US09748208B2
公开(公告)日：2017-08-29
申请号：US13167247
申请日：2011-06-23
申请人： Koichi Fukasawa
发明人： Koichi Fukasawa
IPC分类号： H01L33/08 , H01L25/075 , H01L33/60 , H01L33/62
CPC分类号： H01L25/0753 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device includes a substrate, and a plurality of light-emitting arrays or light-emitting groups arranged on the substrate. The light-emitting arrays or light-emitting groups include a plurality of LED elements connected in parallel with a pair of adjacent electrodes. The number of the LED elements constituting each of the light-emitting arrays or the light-emitting groups differs in each of the light-emitting arrays or the light-emitting groups. Of the plurality of light-emitting arrays arranged in parallel with each other or the light-emitting groups arranged in a line, the number of the LED elements of the light-emitting arrays or the light-emitting groups positioned inside the substrate is more than the number of the LED elements of the light-emitting arrays or the light-emitting groups positioned outside the substrate.

2. 发明授权

US08766313B2 Mounting board and structure of the same 有权
标题翻译：安装板和结构相同
公开(公告)号：US08766313B2
公开(公告)日：2014-07-01
申请号：US13581135
申请日：2011-02-23
申请人： Kohsuke Kashitani , Koichi Fukasawa , Jun Takashima , Katsuyuki Kiyozumi
发明人： Kohsuke Kashitani , Koichi Fukasawa , Jun Takashima , Katsuyuki Kiyozumi
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/64 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： A mounting board including a pair of patterned electrodes, a lower surface and an upper surface opposed thereto on which a substrate of an electronic component is to be mounted, a pass-through hole penetrating through the upper surface and the lower surface, and a peripheral side surface that defines the pass-through hole. The pass-through hole includes a plurality of penetrating grooves that are cut into the mounting board and penetrate through the upper and lower surfaces. The plurality of penetrating grooves electrically split the pair of patterned electrodes. The pair of patterned electrodes is partly positioned inside the peripheral side surface, and a connection portion connecting the at least one pair of patterned electrodes and at least one pair of patterned electrodes provided on the upper surface of the substrate of the electronic component is to be disposed inside the peripheral side surface that defines the pass-through hole.
摘要翻译：一种安装板，包括一对图案化电极，下表面和与其相对的上表面，其上安装有电子部件的基板，贯穿上表面和下表面的通孔，侧表面限定了通孔。贯通孔包括多个穿透槽，该贯通槽被切入安装板并穿过上表面和下表面。多个穿透槽电分离该对图案化电极。该一对构图电极部分地位于周边侧表面内，并且连接至少一对图形化电极的连接部分和设置在电子部件的基板的上表面上的至少一对图案化电极为设置在限定通孔的周边侧表面内。

3. 发明申请

US20120313135A1 MOUNTING BOARD AND STRUCTURE OF THE SAME 有权
标题翻译：安装板及其结构
公开(公告)号：US20120313135A1
公开(公告)日：2012-12-13
申请号：US13581135
申请日：2011-02-23
申请人： Kohsuke Kashitani , Koichi Fukasawa , Jun Takashima , Katsuyuki Kiyozumi
发明人： Kohsuke Kashitani , Koichi Fukasawa , Jun Takashima , Katsuyuki Kiyozumi
IPC分类号： H05K1/11 , H01L33/62
CPC分类号： H01L33/62 , H01L33/64 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： A mounting board including a pair of patterned electrodes, a lower surface and an upper surface opposed thereto on which a substrate of an electronic component is to be mounted, a pass-through hole penetrating through the upper surface and the lower surface, and a peripheral side surface that defines the pass-through hole. The pass-through hole includes a plurality of penetrating grooves that are cut into the mounting board and penetrate through the upper and lower surfaces. The plurality of penetrating grooves electrically split the pair of patterned electrodes. The pair of patterned electrodes is partly positioned inside the peripheral side surface, and a connection portion connecting the at least one pair of patterned electrodes and at least one pair of patterned electrodes provided on the upper surface of the substrate of the electronic component is to be disposed inside the peripheral side surface that defines the pass-through hole.
摘要翻译：一种安装板，包括一对图案化电极，下表面和与其相对的上表面，其上安装有电子部件的基板，贯穿上表面和下表面的通孔，侧表面限定了通孔。贯通孔包括多个穿透槽，该贯通槽被切入安装板并穿过上表面和下表面。多个穿透槽电分离该对图案化电极。该一对构图电极部分地位于周边侧表面内，并且连接至少一对图形化电极的连接部分和设置在电子部件的基板的上表面上的至少一对图案化电极为设置在限定通孔的周边侧表面内。

4. 发明申请

US20110019420A1 LIGHT-EMITTING DIODE APPARATUS 有权
标题翻译：发光二极管装置
公开(公告)号：US20110019420A1
公开(公告)日：2011-01-27
申请号：US12840800
申请日：2010-07-21
申请人： Norikazu KADOTANI , Koichi Fukasawa , Sadato Imai
发明人： Norikazu KADOTANI , Koichi Fukasawa , Sadato Imai
IPC分类号： F21S4/00
CPC分类号： F21V29/85 , F21K9/232 , F21V29/74 , F21V29/89 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/62 , H01L2224/48137 , H01L2224/48091 , H01L2924/00014
摘要： An LED light source apparatus comprises a circular base having thermal conductivity, an insulative substrate concentric with the base and including a pass-through hole provided to pass through an upper surface and a lower surface of the substrate, at least one mounting area formed having a central portion of an upper surface of the base exposed from the pass-through hole of the substrate, and a plurality of LED elements mounted on the mounting area and electrically connected to electrodes provided on the upper surface of the substrate, the pass-through hole being formed in a circular shape concentric with the base and the substrate.
摘要翻译： LED光源装置包括具有导热性的圆形基底，与基底同心的绝缘基底，并且包括设置成穿过基底的上表面和下表面的通孔，至少一个安装区域形成为具有从基板的通孔露出的基板的上表面的中心部分和安装在安装区域上并与设置在基板的上表面上的电极电连接的多个LED元件，通孔形成为与基底和基底同心的圆形。

5. 发明授权

US07804102B2 Illumination device and method for manufacturing the same 有权
标题翻译：照明装置及其制造方法
公开(公告)号：US07804102B2
公开(公告)日：2010-09-28
申请号：US12260918
申请日：2008-10-29
申请人： Norikazu Kadotani , Koichi Fukasawa , Hirohiko Ishii
发明人： Norikazu Kadotani , Koichi Fukasawa , Hirohiko Ishii
IPC分类号： H01L29/22 , H01L33/00
CPC分类号： G02B6/0065 , F21K9/00 , F21K9/61 , F21Y2115/10 , G02B6/0023 , G02B6/0055 , G02B6/0078 , G02B6/0083 , H01L33/60 , H01L2224/48091 , H01L2924/00014
摘要： An illumination device includes a circuit board (11), an LED element (12) mounted on the circuit board, a light-transmitting sealing resin (16) covering the LED element and containing a fluorescent material, a light reflector (14) covering the light-transmitting sealing resin and reflecting light emitted from the LED element, and a light-guiding part (13) comprising a light-transmitting plate connected to the light-transmitting sealing resin, the light-guiding part guiding the light emitted from the LED element and including a light emission surface (13a) configured to emit the light.
摘要翻译：照明装置包括电路板（11），安装在电路板上的LED元件（12），覆盖LED元件并包含荧光材料的透光密封树脂（16），覆盖该LED元件的光反射器透光密封树脂和从LED元件发射的反射光，以及导光部（13），其包括连接到透光密封树脂的透光板，导光部引导从LED发射的光并且包括被配置为发射光的发光表面（13a）。

6. 发明申请

US20090108283A1 ILLUMINATION DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：照明装置及其制造方法
公开(公告)号：US20090108283A1
公开(公告)日：2009-04-30
申请号：US12260918
申请日：2008-10-29
申请人： Norikazu KADOTANI , Koichi Fukasawa , Hirohiko Ishii
发明人： Norikazu KADOTANI , Koichi Fukasawa , Hirohiko Ishii
IPC分类号： H01L33/00
CPC分类号： G02B6/0065 , F21K9/00 , F21K9/61 , F21Y2115/10 , G02B6/0023 , G02B6/0055 , G02B6/0078 , G02B6/0083 , H01L33/60 , H01L2224/48091 , H01L2924/00014
摘要： An illumination device includes a circuit board (11), an LED element (12) mounted on the circuit board, a light-transmitting sealing resin (16) covering the LED element and containing a fluorescent material, a light reflector (14) covering the light-transmitting sealing resin and reflecting light emitted from the LED element, and a light-guiding part (13) comprising a light-transmitting plate connected to the light-transmitting sealing resin, the light-guiding part guiding the light emitted from the LED element and including a light emission surface (13a) configured to emit the light.
摘要翻译：照明装置包括电路板（11），安装在电路板上的LED元件（12），覆盖LED元件并包含荧光材料的透光密封树脂（16），覆盖该LED元件的光反射器透光密封树脂和从LED元件发射的反射光，以及导光部（13），其包括连接到透光密封树脂的透光板，导光部引导从LED发射的光并且包括被配置为发射光的发光表面（13a）。

7. 发明申请

US20080179617A1 SEMICONDUCTOR LIGHT-EMITTING DEVICE 有权
标题翻译：半导体发光器件
公开(公告)号：US20080179617A1
公开(公告)日：2008-07-31
申请号：US12016620
申请日：2008-01-18
申请人： Norikazu KADOTANI , Atsushi Nishida , Koichi Fukasawa , Hirohiko Ishii
发明人： Norikazu KADOTANI , Atsushi Nishida , Koichi Fukasawa , Hirohiko Ishii
IPC分类号： H01L33/00
CPC分类号： H01L33/56 , H01L24/32 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2924/12036 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor light-emitting device includes: a printed-wiring board 3; a light-emitting diode element 2 mounted on the printed-wiring board 3; and a resin body for sealing the light-emitting diode element 2. The resin body is composed of a first resin body 7 arranged around the light-emitting diode element 2, and a second resin body 8 which seals the light-emitting diode 2 and the first resin body 7. An upper edge of the first resin body 7 disposed at a lower position of the junction is configured to be at least on or beyond an imaginary line that connects the junction and a lower edge of the second resin body.
摘要翻译：半导体发光器件包括：印刷电路板3; 安装在印刷电路板3上的发光二极管元件2; 以及用于密封发光二极管元件2的树脂体。树脂体由布置在发光二极管元件2周围的第一树脂体7和密封发光二极管2的第二树脂体8和第一树脂体7的第一树脂体7的上边缘被配置为至少在连接第二树脂体的连接点和下边缘的假想线的上方或上方。

8. 发明申请

US20070241361A1 Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode 有权
标题翻译：包括发光二极管元件的发光二极管和发光二极管器件以及用于制造发光二极管的方法
公开(公告)号：US20070241361A1
公开(公告)日：2007-10-18
申请号：US11808581
申请日：2007-06-12
申请人： Nodoka Oishi , Koichi Fukasawa , Sadato Imai
发明人： Nodoka Oishi , Koichi Fukasawa , Sadato Imai
IPC分类号： H01L33/00
CPC分类号： H01L33/64 , H01L33/486 , H01L33/62 , H01L33/648 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： A light emitting diode has a base made of heat conductive material, a wire plate made of an insulation material and secured to an upper surface of the base. Conductive patterns are secured to the wire plate, and a light emitting diode element is secured to the base at an exposed mounting area. The light emitting diode element is electrically connected to the conductive patterns.
摘要翻译：发光二极管具有由导热材料制成的基座，由绝缘材料制成的线板并固定到基座的上表面。导电图案被固定到线板，并且发光二极管元件在暴露的安装区域固定到基座。发光二极管元件电连接到导电图案。

9. 发明授权

US06396082B1 Light-emitting diode 失效
标题翻译：发光二极管
公开(公告)号：US06396082B1
公开(公告)日：2002-05-28
申请号：US09787873
申请日：2001-03-23
申请人： Koichi Fukasawa , Junji Miyashita , Kousuke Tsuchiya
发明人： Koichi Fukasawa , Junji Miyashita , Kousuke Tsuchiya
IPC分类号： H01L2715
CPC分类号： H01L33/486 , H01L33/507 , H01L33/508 , H01L33/54 , H01L33/58 , H01L2224/48091 , H01L2224/48227 , H01L2224/49107 , H01L2224/73265 , H05K1/182 , H01L2924/00014
摘要： A light emitting diode 21 in which a through hole 25 is provided in a glass epoxy substrate 22 which extends from the upper surface 26a to the lower surface 26b thereof, a transparent resin section 27 is used to fill the through hole 25, a light emitting diode element 29 made of a gallium nitride based compound semiconductor with a transparent element substrate of sapphire glass 30 is fixed on top of the transparent resin section 27 using a transparent adhesive 37, and light blocking electrodes 33, 34 are provided on the upper surface of the light emitting diode element 29, and light emitted from the light emitting diode element 29 passes through the transparent resin section 27 and is guided out through a bottom surface 26b of the glass epoxy substrate 22. When the light emitting diode 21 is mounted onto a motherboard 41, by dropping the resin sealing body 38 of the light emitting diode 21 down into an insertion hole 42 formed in the motherboard 41, the height dimension of the mounted light emitting diode 21 mounted can be reduced.
摘要翻译：在从上表面26a延伸到下表面26b的玻璃环氧树脂基板22中设置有通孔25的发光二极管21，透明树脂部27用于填充通孔25，发光由具有蓝宝石玻璃透明元件基板的氮化镓基化合物半导体制成的二极管元件29使用透明粘合剂37固定在透明树脂部分27的顶部上，并且遮光电极33,34设置在发光二极管元件29和从发光二极管元件29发射的光通过透明树脂部分27并通过玻璃环氧基板22的底表面26b导出。当将发光二极管21安装到母板41通过将发光二极管21的树脂密封体38下降到形成在母板41中的插入孔42中，安装的高度尺寸可以减少安装的发光二极管21。

10. 发明授权

US08258522B2 Light-emitting diode apparatus 有权
标题翻译：发光二极管装置
公开(公告)号：US08258522B2
公开(公告)日：2012-09-04
申请号：US12821345
申请日：2010-06-23
申请人： Norikazu Kadotani , Koichi Fukasawa , Sadato Imai
发明人： Norikazu Kadotani , Koichi Fukasawa , Sadato Imai
IPC分类号： H01L33/00
CPC分类号： F21V29/76 , F21K9/00 , H01L25/0753 , H01L33/62 , H01L2224/48137 , H05K1/021 , H05K1/0259 , H05K2201/10106 , H01L2224/48091 , H01L2924/00014
摘要： An LED apparatus includes a base having thermal conductivity, an insulative substrate provided on one surface of the base and including electrodes provided on a surface of the substrate, at least one base-mounting area that is an exposed part of the base, exposed within a pass-through hole provided in the substrate, a plurality of LED elements mounted on the base in the base-mounting area and some of the LED elements in a unit electrically connected to the electrodes in series, a plurality of the units are electrically connected in parallel, and a frame disposed to surround the base-mounting area and configured to form a light-emitting area.
摘要翻译： LED装置包括具有导热性的底座，设置在基座的一个表面上并包括设置在基板的表面上的电极的绝缘基板，至少一个底座安装区域，该底座安装区域是基座的暴露部分，设置在基板中的通孔，安装在基座安装区域的基座上的多个LED元件和与电极串联电连接的单元中的一些LED元件，多个单元电连接并且设置成围绕基座安装区域并被配置为形成发光区域的框架。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式