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    • 4. 发明授权
    • Floating gate structures
    • 浮门结构
    • US07989289B2
    • 2011-08-02
    • US12165272
    • 2008-06-30
    • Tejas KrishnamohanKrishna ParatKyu MinSrivardhan GowdaThomas M. GraettingerNirmal Ramaswamy
    • Tejas KrishnamohanKrishna ParatKyu MinSrivardhan GowdaThomas M. GraettingerNirmal Ramaswamy
    • H01L21/336H01L29/788
    • H01L21/28052H01L21/28273H01L29/66825H01L29/7881
    • Floating gate structures are generally described. In one example, an electronic device includes a semiconductor substrate, a tunnel dielectric coupled with the semiconductor substrate, and a floating gate structure comprising at least a first region having a first electron energy level or electron workfunction or carrier capture efficiency coupled with the tunnel dielectric and a second region having a second electron energy level or electron workfunction or carrier capture efficiency coupled with the first region wherein the first electron energy level or electron workfunction or carrier capture efficiency is less than the second electron energy level or electron workfunction or carrier capture efficiency. Such electronic device may reduce the thickness of the floating gate structure or reduce leakage current through an inter-gate dielectric, or combinations thereof, compared with a floating gate structure that comprises only polysilicon.
    • 通常描述浮栅结构。 在一个示例中,电子设备包括半导体衬底,与半导体衬底耦合的隧道电介质,以及浮栅结构,其至少包括具有第一电子能级或电子功函数的第一区域或与隧道电介质耦合的载流子捕获效率 以及第二区域,其具有与第一区域耦合的第二电子能级或电子功能函数或载流子捕获效率,其中第一电子能级或电子功函数或载流子捕获效率小于第二电子能级或电子功函数或载流子俘获效率 。 与仅包含多晶硅的浮动栅极结构相比,这种电子器件可以减小浮置栅极结构的厚度或减小通过栅极间电介质或其组合的泄漏电流。
    • 6. 发明授权
    • Semiconductor device with high on current and low leakage
    • 半导体器件具有高导通电流和低漏电流
    • US07728387B1
    • 2010-06-01
    • US11761830
    • 2007-06-12
    • Tejas KrishnamohanKrishna Chandra Saraswat
    • Tejas KrishnamohanKrishna Chandra Saraswat
    • H01L31/119
    • H01L29/1054H01L29/78
    • Various semiconductor devices and methods of manufacture are employed. According to an example embodiment of the present invention, a MOS-compatible semiconductor device exhibits high channel mobility and low leakage. The device includes a channel region having a high-mobility strained material layer and a tunneling mitigation layer on the strained material layer to mitigate tunnel leakage. The strained material has a lattice structure that is strained to match the lattice structure of the tunneling mitigation layer. An insulator layer is on the tunneling mitigation layer, and an electrode is over the insulator and adapted to apply a voltage bias to the channel region to switch the device between conductive and nonconductive states. Current is transported in the conductive state as predominantly facilitated via the mobility of the strained material layer, and wherein tunneling current in the nonconductive state is mitigated by the tunneling mitigation layer.
    • 采用各种半导体器件和制造方法。 根据本发明的示例性实施例,MOS兼容半导体器件表现出高的沟道迁移率和低的泄漏。 该装置包括在应变材料层上具有高迁移率应变材料层和隧道缓解层的沟道区,以减轻隧道泄漏。 应变材料具有应变以匹配隧道缓解层的晶格结构的晶格结构。 绝缘体层位于隧道缓解层上,并且电极在绝缘体上方并且适于向通道区域施加电压偏置,以在导电状态和非导通状态之间切换器件。 电流以导电状态传输,主要通过应变材料层的迁移率促进,并且其中非导电状态的隧穿电流被隧道缓解层减轻。