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1. 发明授权

US10410998B2 Micro-LED module and method for fabricating the same 有权
公开(公告)号：US10410998B2
公开(公告)日：2019-09-10
申请号：US15814157
申请日：2017-11-15
申请人： LUMENS CO., LTD.
发明人： Daewon Kim , Eunsung Shin , Myungji Moon , Hanbeet Chang , Yongpil Kim , Jaesoon Park
IPC分类号： H01L25/075 , H01L27/15 , H01L33/00 , H01L25/00 , H01L33/36 , H01L33/54 , H01L33/62
摘要： A micro-LED module is disclosed. The micro-LED module includes: a micro-LED including a plurality of LED cells, each of which includes a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a submount substrate mounted with the micro-LED; a plurality of electrode pads formed on the micro-LED cells; a plurality of electrodes formed corresponding to the plurality of electrode pads on the submount substrate; a plurality of connection members through which the plurality of electrode pads are connected to the corresponding plurality of electrodes; and a gap fill layer formed in the gap between the micro-LED and the submount substrate and having a bonding strength to the micro-LED and the submount substrate.

2. 发明授权

US10756073B2 Micro LED module with flexible multilayer circuit substrate 有权
公开(公告)号：US10756073B2
公开(公告)日：2020-08-25
申请号：US16011573
申请日：2018-06-18
申请人： LUMENS CO., LTD.
发明人： Daewon Kim , Taehong Jeong
IPC分类号： H01L25/13 , H01L33/62 , H01L23/538
摘要： A micro-LED module is disclosed. The micro-LED module includes a flexible circuit board and a plurality of LED pixels mounted on the flexible circuit board. Each of the plurality of LED pixels includes a first micro-LED chip, a second micro-LED chip, and a third micro-LED chip. Each of the first micro-LED chip, the second micro-LED chip, and the third micro-LED chip has at least one side whose length is 100 μm or less. Each of the first micro-LED chip, the second micro-LED chip, and the third micro-LED chip includes one or more electrode pads having a width of 80 μm or less on the surface facing the flexible circuit board. The flexible circuit board includes a first flexible insulating film including electrode patterns formed on the upper surface thereof and connected to the electrode pads through solder bumps having a diameter of 80 μm or less and a second flexible insulating film connected to the bottom of the first flexible insulating film through a first conductive pattern. The first flexible insulating film includes a first via hole having the same cross-sectional shape and area from the upper to the lower end and a first via formed in the first via hole. The first via hole of the first flexible insulating film is connected to a portion of the first conductive pattern.

3. 发明授权

US10756071B2 LED module and method for fabricating the same 有权
公开(公告)号：US10756071B2
公开(公告)日：2020-08-25
申请号：US16717696
申请日：2019-12-17
申请人： LUMENS CO., LTD.
发明人： Taekyung Yoo , Daewon Kim , Jinmo Kim , Jinwon Choi , Jimin Her , Younghwan Shin , Sol Han , Kyujin Lee
IPC分类号： H01L25/075 , H01L33/62 , H01L21/683 , H01L23/00 , H01L21/677 , H01L27/15 , H01L33/36 , H01L21/67 , H01L33/00 , H01L33/60 , H01L33/08 , H01L33/06 , H01L33/32 , H01L33/30
摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

4. 发明授权

US10756070B2 LED module and method for fabricating the same 有权
公开(公告)号：US10756070B2
公开(公告)日：2020-08-25
申请号：US16576263
申请日：2019-09-19
申请人： LUMENS CO., LTD.
发明人： Taekyung Yoo , Daewon Kim , Jinmo Kim , Jinwon Choi , Jimin Her , Younghwan Shin , Sol Han , Kyujin Lee
IPC分类号： H01L25/075 , H01L33/62 , H01L21/683 , H01L33/00 , H01L21/677 , H01L33/36 , H01L21/67 , H01L23/00 , H01L33/60 , H01L27/15 , H01L33/08 , H01L33/06 , H01L33/32 , H01L33/30
摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

5. 发明授权

US10468392B2 LED module and method for fabricating the same 有权
公开(公告)号：US10468392B2
公开(公告)日：2019-11-05
申请号：US16059017
申请日：2018-08-08
申请人： LUMENS CO., LTD.
发明人： Taekyung Yoo , Daewon Kim , Jinmo Kim , Jinwon Choi , Jimin Her , Younghwan Shin , Sol Han , Kyujin Lee
IPC分类号： H01L27/32 , H01L25/075 , H01L33/62 , H01L21/683 , H01L33/00 , H01L23/00 , H01L33/60 , H01L21/677 , H01L27/15 , H01L33/36 , H01L21/67 , H01L33/08 , H01L33/06 , H01L33/32 , H01L33/30
摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

6. 发明授权

US10103131B2 LED Module and method for fabricating the same 有权
公开(公告)号：US10103131B2
公开(公告)日：2018-10-16
申请号：US15905556
申请日：2018-02-26
申请人： LUMENS CO., LTD.
发明人： Taekyung Yoo , Daewon Kim , Jinmo Kim , Jinwon Choi , Jimin Her , Younghwan Shin , Sol Han , Kyujin Lee
IPC分类号： H01L27/32 , H01L25/075 , H01L33/62 , H01L21/683 , H01L33/00 , H01L23/00 , H01L33/60 , H01L21/677 , H01L27/15 , H01L33/36 , H01L21/67 , H01L33/08 , H01L33/06 , H01L33/32 , H01L33/30
摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

7. 发明授权

US11069664B2 Micro-LED module and method for fabricating the same 有权
公开(公告)号：US11069664B2
公开(公告)日：2021-07-20
申请号：US16524790
申请日：2019-07-29
申请人： LUMENS CO., LTD.
发明人： Daewon Kim , Eunsung Shin , Myungji Moon , Hanbeet Chang , Yongpil Kim , Jaesoon Park
IPC分类号： H01L25/075 , H01L25/00 , H01L33/36 , H01L33/54 , H01L27/15 , H01L33/00 , H01L25/04 , H01L33/08 , H01L33/62 , H01L27/32 , H01L21/447
摘要： A micro-LED module is disclosed. The micro-LED module includes: a micro-LED including a plurality of LED cells, each of which includes a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a submount substrate mounted with the micro-LED; a plurality of electrode pads formed on the micro-LED cells; a plurality of electrodes formed corresponding to the plurality of electrode pads on the submount substrate; a plurality of connection members through which the plurality of electrode pads are connected to the corresponding plurality of electrodes; and a gap fill layer formed in the gap between the micro-LED and the submount substrate and having a bonding strength to the micro-LED and the submount substrate.

8. 发明授权

US10468393B2 LED module and method for fabricating the same 有权
公开(公告)号：US10468393B2
公开(公告)日：2019-11-05
申请号：US16059019
申请日：2018-08-08
申请人： LUMENS CO., LTD.
发明人： Taekyung Yoo , Daewon Kim , Jinmo Kim , Jinwon Choi , Jimin Her , Younghwan Shin , Sol Han , Kyujin Lee
IPC分类号： H01L27/32 , H01L25/075 , H01L33/62 , H01L21/683 , H01L33/00 , H01L23/00 , H01L33/60 , H01L21/677 , H01L27/15 , H01L33/36 , H01L21/67 , H01L33/08 , H01L33/06 , H01L33/32 , H01L33/30
摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

9. 发明授权

US10319706B2 Micro-LED module and method for fabricating the same 有权
公开(公告)号：US10319706B2
公开(公告)日：2019-06-11
申请号：US15818738
申请日：2017-11-20
申请人： LUMENS CO., LTD.
发明人： Taekyung Yoo , Daewon Kim , Seongbok Yoon , Yelim Won , Myungji Moon , Hanbeet Chang , Yongpil Kim , Jaesoon Park
IPC分类号： H01L25/16 , H01L23/00 , H01L33/38 , H01L33/00 , H01L33/62 , H01L33/32 , H01L33/42 , H01L27/092 , H01L27/15
摘要： A method for fabricating a micro-LED module is disclosed. The method includes: preparing a micro-LED including a plurality of electrode pads and a plurality of LED cells; preparing a submount substrate including a plurality of electrodes corresponding to the plurality of electrode pads; and flip-bonding the micro-LED to the submount substrate through a plurality of solders located between the plurality of electrode pads and the plurality of electrodes. The flip-bonding includes heating the plurality of solders by a laser.

10. 发明授权

US10096586B2 LED display modules and methods for making the same 有权
公开(公告)号：US10096586B2
公开(公告)日：2018-10-09
申请号：US15713633
申请日：2017-09-23
申请人： LUMENS CO., LTD.
发明人： Daewon Kim , Jinmo Kim , Jinwon Choi , Younghwan Shin , Jimin Her , Sol Han , Kyujin Lee
IPC分类号： H01L25/16 , H01L33/50 , H01L25/00 , H01L25/075 , H01L23/00
摘要： An LED display module is disclosed. The LED display module includes: an active matrix substrate including a plurality of control units; a plurality of pairs of solder bumps arranged in a matrix on the active matrix substrate by transfer printing; a plurality of LED chips including pairs of electrodes connected to the corresponding plurality of pairs of solder bumps and arranged in a matrix on the active matrix substrate by transfer printing; grid barriers formed on the active matrix substrate to isolate the plurality of LED chips into individual chip units; and a multi-color cell layer including a plurality of color cells and aligned with the active matrix substrate such that the plurality of color cells match the plurality of LED chips in a one-to-one relationship. The plurality of color cells include first color cells, second color cells, and third color cells disposed consecutively in one direction.

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