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1. 发明授权

US10164149B1 LED panel 有权
公开(公告)号：US10164149B1
公开(公告)日：2018-12-25
申请号：US15960514
申请日：2018-04-23
申请人： LUMENS CO., LTD.
发明人： Taekyung Yoo , Daewon Kim , Yelim Won
IPC分类号： G01D11/28 , H01L33/08 , H01L33/50 , H01L33/38 , H01L33/12 , H01L23/00
摘要： An LED panel is disclosed. The LED panel includes LED chips and a mount substrate on which the LED chips are mounted by flip bonding. Each of the LED chips includes a sapphire substrate, a plurality of light emitting cells disposed below the sapphire substrate, and an etched portion formed between the plurality of light emitting cells. Each of the LED chips includes a plurality of color cells formed corresponding to the plurality of light emitting cells on the sapphire substrate to change or maintain the color of light from the corresponding light emitting cells and a plurality of light collecting portions formed corresponding to the plurality of light emitting cells and the plurality of color cells on the bottom surface of the substrate and adapted to collect light from the corresponding light emitting cells on the corresponding color cells.

2. 发明授权

US10319706B2 Micro-LED module and method for fabricating the same 有权
公开(公告)号：US10319706B2
公开(公告)日：2019-06-11
申请号：US15818738
申请日：2017-11-20
申请人： LUMENS CO., LTD.
发明人： Taekyung Yoo , Daewon Kim , Seongbok Yoon , Yelim Won , Myungji Moon , Hanbeet Chang , Yongpil Kim , Jaesoon Park
IPC分类号： H01L25/16 , H01L23/00 , H01L33/38 , H01L33/00 , H01L33/62 , H01L33/32 , H01L33/42 , H01L27/092 , H01L27/15
摘要： A method for fabricating a micro-LED module is disclosed. The method includes: preparing a micro-LED including a plurality of electrode pads and a plurality of LED cells; preparing a submount substrate including a plurality of electrodes corresponding to the plurality of electrode pads; and flip-bonding the micro-LED to the submount substrate through a plurality of solders located between the plurality of electrode pads and the plurality of electrodes. The flip-bonding includes heating the plurality of solders by a laser.

3. 发明申请

US20180233496A1 MICRO-LED MODULE AND METHOD FOR FABRICATING THE SAME 审中-公开
公开(公告)号：US20180233496A1
公开(公告)日：2018-08-16
申请号：US15818738
申请日：2017-11-20
申请人： LUMENS CO., LTD.
发明人： Taekyung Yoo , Daewon Kim , Seongbok Yoon , Yelim Won , Myungji Moon , Hanbeet Chang , Yongpil Kim , Jaesoon Park
IPC分类号： H01L25/16 , H01L33/00 , H01L33/38 , H01L23/00 , H01L33/62
CPC分类号： H01L25/167 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L27/092 , H01L27/156 , H01L33/007 , H01L33/32 , H01L33/38 , H01L33/42 , H01L33/62 , H01L2224/0345 , H01L2224/03912 , H01L2224/0401 , H01L2224/05082 , H01L2224/05147 , H01L2224/05166 , H01L2224/1146 , H01L2224/1181 , H01L2224/11849 , H01L2224/13147 , H01L2224/1357 , H01L2224/13611 , H01L2224/13639 , H01L2224/16145 , H01L2224/81191 , H01L2224/81224 , H01L2224/81365 , H01L2224/81815 , H01L2224/81986 , H01L2924/014 , H01L2933/0066
摘要： A method for fabricating a micro-LED module is disclosed. The method includes: preparing a micro-LED including a plurality of electrode pads and a plurality of LED cells; preparing a submount substrate including a plurality of electrodes corresponding to the plurality of electrode pads; and flip-bonding the micro-LED to the submount substrate through a plurality of solders located between the plurality of electrode pads and the plurality of electrodes. The flip-bonding includes heating the plurality of solders by a laser.

4. 发明授权

US09985175B1 LED panel 有权
公开(公告)号：US09985175B1
公开(公告)日：2018-05-29
申请号：US15857544
申请日：2017-12-28
申请人： LUMENS CO., LTD.
发明人： Taekyung Yoo , Daewon Kim , Yelim Won
IPC分类号： G01D11/28 , H01L33/08 , H01L33/38 , H01L23/00 , H01L33/12 , H01L33/50
CPC分类号： H01L33/08 , H01L24/17 , H01L27/156 , H01L33/12 , H01L33/382 , H01L33/387 , H01L33/46 , H01L33/50 , H01L33/504 , H01L33/58
摘要： An LED panel is disclosed. The LED panel includes LED chips and a mount substrate on which the LED chips are mounted by flip bonding. Each of the LED chips includes a sapphire substrate, a plurality of light emitting cells disposed below the sapphire substrate, and an etched portion formed between the plurality of light emitting cells. Each of the LED chips includes a plurality of color cells formed corresponding to the plurality of light emitting cells on the sapphire substrate to change or maintain the color of light from the corresponding light emitting cells and a plurality of light collecting portions formed corresponding to the plurality of light emitting cells and the plurality of color cells on the bottom surface of the substrate and adapted to collect light from the corresponding light emitting cells on the corresponding color cells.

5. 发明授权

US11152544B2 Methods for fabricating CSP LEDs 有权
公开(公告)号：US11152544B2
公开(公告)日：2021-10-19
申请号：US16794622
申请日：2020-02-19
申请人： LUMENS CO., LTD.
发明人： Daewon Kim , Yelim Won
IPC分类号： H01L33/48 , H01L33/50 , H01L27/15 , H01L25/075 , H01L25/00
摘要： Disclosed is a method for fabricating CSP LEDs. The method includes: preparing a plurality of flip-type LED chips, each of which includes a substrate and a semiconductor stack structure formed under the substrate and has a first conductive connection area and a second conductive connection area formed under the semiconductor stack structure; arraying the first conductive connection areas and the second conductive connection areas of the plurality of flip-type LED chips on a temporary support sheet; forming a wavelength converting member, which includes a side surface portion surrounding the side surfaces of the substrate and the semiconductor stack structure, an intermediate portion overlying the side surface portion to cover the upper surface of the substrate, and an upper surface portion overlying the intermediate portion, on the temporary support sheet; and removing the temporary support sheet and forming first electrode pads and second electrode pads in the first conductive connection areas and the second conductive connection areas of the flip-type LED chips, respectively. The first electrode pads and the second electrode pads protrude more downward than the lower surface of the wavelength converting member.

6. 发明授权

US10818830B2 LED chip with improved bonding strength and LED module using the LED chip 有权
公开(公告)号：US10818830B2
公开(公告)日：2020-10-27
申请号：US16829478
申请日：2020-03-25
申请人： LUMENS CO., LTD.
发明人： Daewon Kim , Yelim Won
IPC分类号： H01L33/62 , H01L33/40 , H01L33/38 , H01L23/00 , H01L33/44
摘要： An LED module is disclosed. The LED module includes: a mount substrate including electrodes; an LED chip including a semiconductor stacked structure, a passivation layer covering the outer surface of the semiconductor stacked structure, and electrode pads connected to the outer surface of the semiconductor stacked structure through openings formed in the passivation layer; and solder bumps connecting the electrode pads to the corresponding electrodes and formed using a solder material represented by Sn-M (where M is a metal).

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