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    • 1. 发明授权
    • Vertical-channel junction field-effect transistors having buried gates and methods of making
    • 具有掩埋栅极的垂直沟道结场效应晶体管及其制造方法
    • US07638379B2
    • 2009-12-29
    • US11935442
    • 2007-11-06
    • Lin ChengMichael S. Mazzola
    • Lin ChengMichael S. Mazzola
    • H01L21/337
    • H01L29/8083H01L29/0619H01L29/1066H01L29/1608H01L29/66909
    • Semiconductor devices and methods of making the devices are described. The devices can be implemented in SiC and can include epitaxially grown n-type drift and p-type trenched gate regions, and an n-type epitaxially regrown channel region on top of the trenched p-gate regions. A source region can be epitaxially regrown on top of the channel region or selectively implanted into the channel region. Ohmic contacts to the source, gate and drain regions can then be formed. The devices can include edge termination structures such as guard rings, junction termination extensions (JTE), or other suitable p-n blocking structures. The devices can be fabricated with different threshold voltages, and can be implemented for both depletion and enhanced modes of operation for the same channel doping. The devices can be used as discrete power transistors and in digital, analog, and monolithic microwave integrated circuits.
    • 对半导体装置及其制造方法进行说明。 器件可以在SiC中实现,并且可以包括外延生长的n型漂移和p型沟槽栅极区域,以及在沟槽p型栅极区域顶部的n型外延再生长沟道区域。 源极区域可以在沟道区域的顶部外延再生长或选择性地植入沟道区域。 然后可以形成到源极,栅极和漏极区域的欧姆接触。 这些装置可以包括边缘终端结构,例如保护环,连接终止扩展(JTE)或其他合适的p-n阻塞结构。 这些器件可以用不同的阈值电压制造,并且可以针对相同沟道掺杂的耗尽和增强的工作模式来实现。 这些器件可用作分立功率晶体管和数字,模拟和单片微波集成电路。
    • 2. 发明申请
    • VERTICAL-CHANNEL JUNCTION FIELD-EFFECT TRANSISTORS HAVING BURIED GATES AND METHODS OF MAKING
    • 带通孔的垂直通道连接场效应晶体管及其制作方法
    • US20080124853A1
    • 2008-05-29
    • US11935442
    • 2007-11-06
    • Lin ChengMichael S. Mazzola
    • Lin ChengMichael S. Mazzola
    • H01L21/337
    • H01L29/8083H01L29/0619H01L29/1066H01L29/1608H01L29/66909
    • Semiconductor devices and methods of making the devices are described. The devices can be implemented in SiC and can include epitaxially grown n-type drift and p-type trenched gate regions, and an n-type epitaxially regrown channel region on top of the trenched p-gate regions. A source region can be epitaxially regrown on top of the channel region or selectively implanted into the channel region. Ohmic contacts to the source, gate and drain regions can then be formed. The devices can include edge termination structures such as guard rings, junction termination extensions (JTE), or other suitable p-n blocking structures. The devices can be fabricated with different threshold voltages, and can be implemented for both depletion and enhanced modes of operation for the same channel doping. The devices can be used as discrete power transistors and in digital, analog, and monolithic microwave integrated circuits.
    • 对半导体装置及其制造方法进行说明。 器件可以在SiC中实现,并且可以包括外延生长的n型漂移和p型沟槽栅极区域,以及在沟槽p型栅极区域顶部的n型外延再生长沟道区域。 源极区域可以在沟道区域的顶部外延再生长或选择性地植入沟道区域。 然后可以形成到源极,栅极和漏极区域的欧姆接触。 这些装置可以包括边缘终端结构,例如保护环,连接终止扩展(JTE)或其他合适的p-n阻塞结构。 这些器件可以用不同的阈值电压制造,并且可以针对相同沟道掺杂的耗尽和增强的工作模式来实现。 这些器件可用作分立功率晶体管和数字,模拟和单片微波集成电路。
    • 3. 发明授权
    • Junction barrier schottky rectifiers having epitaxially grown P+-N methods of making
    • 具有外延生长P + -N制备方法的结型势垒肖特基整流器
    • US08384182B2
    • 2013-02-26
    • US12146580
    • 2008-06-26
    • Michael S. MazzolaLin Cheng
    • Michael S. MazzolaLin Cheng
    • H01L27/095
    • H01L29/872H01L29/0615H01L29/0619H01L29/0623H01L29/0661H01L29/1608H01L29/8611
    • A junction barrier Schottky (JBS) rectifier device and a method of making the device are described. The device comprises an epitaxially grown first n-type drift layer and p-type regions forming p+-n junctions and self-planarizing epitaxially over-grown second n-type drift regions between and, optionally, on top of the p-type regions. The device may include an edge termination structure such as an exposed or buried P+ guard ring, a regrown or implanted junction termination extension (JTE) region, or a “deep” mesa etched down to the substrate. The Schottky contact to the second n-type drift region and the ohmic contact to the p-type region together serve as an anode. The cathode can be formed by ohmic contact to the n-type region on the backside of the wafer. The devices can be used in monolithic digital, analog, and microwave integrated circuits.
    • 描述了结屏障肖特基(JBS)整流器件及制造器件的方法。 该器件包括外延生长的第一n型漂移层和形成p + -n结的p型区域和在p型区域之间和/或任选地在p型区域的顶部上的自平面化外延生长的第二n型漂移区域。 该装置可以包括边缘终端结构,例如暴露或掩埋的P +保护环,再生长或注入的连接终止延伸(JTE)区域,或向底部蚀刻的深台面。 与第二n型漂移区的肖特基接触和与p型区的欧姆接触一起用作阳极。 阴极可以通过欧姆接触形成在晶片背面的n型区域上。 该器件可用于单片数字,模拟和微波集成电路。
    • 7. 发明申请
    • SEMICONDUCTOR DEVICE HAVING HIGH PERFORMANCE CHANNEL
    • 具有高性能通道的半导体器件
    • US20120223330A1
    • 2012-09-06
    • US13039441
    • 2011-03-03
    • Sarit DharSei-Hyung RyuLin ChengAnant Agarwal
    • Sarit DharSei-Hyung RyuLin ChengAnant Agarwal
    • H01L29/161H01L21/22
    • H01L29/107H01L21/225H01L29/1608H01L29/66068H01L29/66477H01L29/66568
    • Semiconductor devices having a high performance channel and method of fabrication thereof are disclosed. Preferably, the semiconductor devices are Metal-Oxide-Semiconductor (MOS) devices, and even more preferably the semiconductor devices are Silicon Carbide (SiC) MOS devices. In one embodiment, a semiconductor device includes a SiC substrate of a first conductivity type, a first well of a second conductivity type, a second well of the second conductivity type, and a surface diffused channel of the second conductivity type formed at the surface of semiconductor device between the first and second wells. A depth and doping concentration of the surface diffused channel are controlled to provide increased carrier mobility for the semiconductor device as compared to the same semiconductor device without the surface diffused channel region when in the on-state while retaining a turn-on, or threshold, voltage that provides normally-off behavior.
    • 公开了具有高性能通道的半导体器件及其制造方法。 优选地,半导体器件是金属氧化物半导体(MOS)器件,并且甚至更优选半导体器件是碳化硅(SiC)MOS器件。 在一个实施例中,半导体器件包括第一导电类型的SiC衬底,第二导电类型的第一阱,第二导电类型的第二阱以及形成在第二导电类型的表面处的第二导电类型的表面扩散沟道 半导体器件在第一和第二阱之间。 控制表面扩散通道的深度和掺杂浓度,以便在处于导通状态同时保持导通状态或阈值时,与没有表面扩散沟道区的相同半导体器件相比,为半导体器件提供增加的载流子迁移率, 电压提供常态动作。
    • 9. 发明申请
    • COMMUNICATION SYSTEM, COMMUNICATION DEVICE, AND METHOD FOR CAPABILITY CONTROL
    • 通信系统,通信设备和能力控制方法
    • US20090094162A1
    • 2009-04-09
    • US12252999
    • 2008-10-16
    • Lin Cheng
    • Lin Cheng
    • H04L9/00G06F15/173
    • G06F21/55G06F21/105G06F21/52G06F2221/2135G06F2221/2143
    • A communication system includes a server for capability control, with a capability control file currently used by a corresponding device being provided in the server. The server includes a capability determination unit adapted to determine whether the summarization of the capabilities currently used by all the devices under the control of the server exceeds the capabilities limited by the capability control file; and a prohibition command sending unit adapted to send to the device a capability prohibition command corresponding to the capabilities. The device includes a capability prohibition unit adapted to prohibit the subsequent usage of the capabilities after receiving the prohibition command. A control method and a communication device are also provided.
    • 通信系统包括用于能力控制的服务器,其中由服务器中提供的对应设备当前使用的能力控制文件。 服务器包括能力确定单元,其适于确定在服务器控制下的所有设备当前使用的能力的汇总是否超过由能力控制文件限制的能力; 以及禁止命令发送单元,其适于向所述设备发送与所述能力相对应的能力禁止命令。 该装置包括能力禁止单元,适用于在接收到禁止命令之后禁止随后使用该能力。 还提供了一种控制方法和通信装置。
    • 10. 发明授权
    • Semiconductor device having high performance channel
    • 具有高性能通道的半导体器件
    • US09478616B2
    • 2016-10-25
    • US13039441
    • 2011-03-03
    • Sarit DharSei-Hyung RyuLin ChengAnant Agarwal
    • Sarit DharSei-Hyung RyuLin ChengAnant Agarwal
    • H01L29/15H01L31/0312H01L29/10H01L21/225H01L29/16H01L29/66
    • H01L29/107H01L21/225H01L29/1608H01L29/66068H01L29/66477H01L29/66568
    • Semiconductor devices having a high performance channel and method of fabrication thereof are disclosed. Preferably, the semiconductor devices are Metal-Oxide-Semiconductor (MOS) devices, and even more preferably the semiconductor devices are Silicon Carbide (SiC) MOS devices. In one embodiment, a semiconductor device includes a SiC substrate of a first conductivity type, a first well of a second conductivity type, a second well of the second conductivity type, and a surface diffused channel of the second conductivity type formed at the surface of semiconductor device between the first and second wells. A depth and doping concentration of the surface diffused channel are controlled to provide increased carrier mobility for the semiconductor device as compared to the same semiconductor device without the surface diffused channel region when in the on-state while retaining a turn-on, or threshold, voltage that provides normally-off behavior.
    • 公开了具有高性能通道的半导体器件及其制造方法。 优选地,半导体器件是金属氧化物半导体(MOS)器件,并且甚至更优选半导体器件是碳化硅(SiC)MOS器件。 在一个实施例中,半导体器件包括第一导电类型的SiC衬底,第二导电类型的第一阱,第二导电类型的第二阱以及形成在第二导电类型的表面处的第二导电类型的表面扩散沟道 半导体器件在第一和第二阱之间。 控制表面扩散通道的深度和掺杂浓度,以便在处于导通状态同时保持导通状态或阈值时,与没有表面扩散沟道区的相同半导体器件相比,为半导体器件提供增加的载流子迁移率, 电压提供常态动作。