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1. 发明授权

US07893524B2 Wiring substrate and semiconductor device and method of manufacturing the same 有权
标题翻译：接线基板和半导体器件及其制造方法
公开(公告)号：US07893524B2
公开(公告)日：2011-02-22
申请号：US12263584
申请日：2008-11-03
申请人： Masahiro Sunohara , Yoshihiro Machida
发明人： Masahiro Sunohara , Yoshihiro Machida
IPC分类号： H01L21/00 , H01L21/44 , H01L23/02
CPC分类号： H01L23/49811 , H01L21/4846 , H01L23/42 , H01L23/49822 , H01L24/16 , H01L2224/16225 , H01L2224/73253 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12042 , H01L2924/16152 , H05K1/0271 , H05K1/111 , H05K3/4092 , H05K3/4644 , H05K2201/0133 , H05K2201/0187 , H05K2201/0397 , H05K2201/09036 , H05K2201/10674 , H01L2924/00
摘要： In a wiring substrate of a semiconductor device, a hollow portion is provided under a pad wiring portion including a connection pad, and thus a wiring layer has a cantilever structure in which the pad wiring portion is formed as an aerial wiring, and a semiconductor chip is flip-chip connected to the connection pad. The pad wiring portion including the connection pad is formed on a sacrifice layer which is filled in a recess portion in an interlayer insulating layer of the wiring substrate, then the semiconductor chip is flip-chip connected to the connection pad, and then the hollow portion is provided by removing the sacrifice layer.
摘要翻译：在半导体器件的布线基板中，在包括连接焊盘的焊盘布线部分的下方设置中空部，由此布线层具有悬臂结构，其中焊盘布线部分形成为架空布线，半导体芯片倒装芯片连接到连接板。包括连接焊盘的焊盘布线部分形成在填充在布线基板的层间绝缘层的凹部中的牺牲层上，然后将半导体芯片倒装芯片连接到连接焊盘，然后将中空部分通过去除牺牲层来提供。

2. 发明申请

US20090115073A1 WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：配线基板和半导体装置及其制造方法
公开(公告)号：US20090115073A1
公开(公告)日：2009-05-07
申请号：US12263584
申请日：2008-11-03
申请人： Masahiro SUNOHARA , Yoshihiro Machida
发明人： Masahiro SUNOHARA , Yoshihiro Machida
IPC分类号： H01L23/52 , H01L21/00
CPC分类号： H01L23/49811 , H01L21/4846 , H01L23/42 , H01L23/49822 , H01L24/16 , H01L2224/16225 , H01L2224/73253 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12042 , H01L2924/16152 , H05K1/0271 , H05K1/111 , H05K3/4092 , H05K3/4644 , H05K2201/0133 , H05K2201/0187 , H05K2201/0397 , H05K2201/09036 , H05K2201/10674 , H01L2924/00
摘要： In a wiring substrate of a semiconductor device, a hollow portion is provided under a pad wiring portion including a connection pad, and thus a wiring layer has a cantilever structure in which the pad wiring portion is formed as an aerial wiring, and a semiconductor chip is flip-chip connected to the connection pad. The pad wiring portion including the connection pad is formed on a sacrifice layer which is filled in a recess portion in an interlayer insulating layer of the wiring substrate, then the semiconductor chip is flip-chip connected to the connection pad, and then the hollow portion is provided by removing the sacrifice layer.
摘要翻译：在半导体器件的布线基板中，在包括连接焊盘的焊盘布线部分的下方设置中空部，由此布线层具有悬臂结构，其中焊盘布线部分形成为架空布线，半导体芯片倒装芯片连接到连接板。包括连接焊盘的焊盘布线部分形成在填充在布线基板的层间绝缘层的凹部中的牺牲层上，然后将半导体芯片倒装芯片连接到连接焊盘，然后将中空部分通过去除牺牲层来提供。

3. 发明授权

US08566890B2 Video information control apparatus and method 有权
公开(公告)号：US08566890B2
公开(公告)日：2013-10-22
申请号：US12622802
申请日：2009-11-20
申请人： Yoshihiro Machida , Kouji Kamogawa , Kazunori Iwabuchi
发明人： Yoshihiro Machida , Kouji Kamogawa , Kazunori Iwabuchi
IPC分类号： H04N7/173
CPC分类号： H04L67/06 , G06F17/30781 , H04N7/17318 , H04N21/2743 , H04N21/4312 , H04N21/4314 , H04N21/4828 , H04N21/84
摘要： Video information, which is photographed with using a GPS built-in video camera, is inputted into a video information server. A video information correspondence table is produced, which associated photographing time of the video information inputted, data address of the video information photographed, and photographing position, and is memorized. According to a request from a display apparatus, the memorized video information correspondence table is searched, and thereby obtaining the video information having the information of time and position designated.

4. 发明授权

US08170394B2 Multimedia player displaying operation panel depending on contents 有权
标题翻译：多媒体播放器根据内容显示操作面板
公开(公告)号：US08170394B2
公开(公告)日：2012-05-01
申请号：US11508209
申请日：2006-08-23
申请人： Yoshihiro Machida , Nobuhiro Tsutsumi , Kouji Kamogawa
发明人： Yoshihiro Machida , Nobuhiro Tsutsumi , Kouji Kamogawa
IPC分类号： H04N9/80
CPC分类号： H04N21/4312 , G06F3/0481 , G06F3/04847 , G06F3/04886 , G06F2203/04803 , G11B19/025 , G11B27/3027 , G11B27/34 , G11B27/36 , H04N21/4122 , H04N21/4263 , H04N21/434 , H04N21/4345 , H04N21/44222 , H04N21/466 , H04N21/47217
摘要： A digital content reproducing apparatus is provided with a plurality of user operation interfaces, e.g., a linear content operation panel and an interactive content operation panel, a data monitor unit monitors information on digital contents, and upon occurrence of a change, the plurality of user operation panels are automatically and exclusively displayed in an operation panel display area. Accordingly, only usable operation keys can be displayed, user operation learning time can be shortened, since the panel rendering area is made small, a mouse motion distance can be shortened, and easy to use can be improved. Further, since the panel rendering area is made small, the image display area can be made relatively large.
摘要翻译：数字内容再现装置具有多个用户操作界面，例如线性内容操作面板和交互式内容操作面板，数据监视单元监视关于数字内容的信息，并且在发生改变时，多个用户操作面板将自动并专门显示在操作面板显示区域中。因此，只要能够显示可使用的操作键，就可以缩短用户操作学习时间，因为面板渲染区域变小，可以缩短鼠标移动距离，并且可以提高易用性。此外，由于面板渲染区域变小，可以使图像显示区域相对较大。

5. 发明授权

US07663253B2 Board having electronic parts mounted by using under-fill material and method for producing the same 有权
标题翻译：具有通过使用未填充材料安装的电子部件的板及其制造方法
公开(公告)号：US07663253B2
公开(公告)日：2010-02-16
申请号：US11463169
申请日：2006-08-08
申请人： Yoshihiro Machida
发明人： Yoshihiro Machida
IPC分类号： H01L23/28
CPC分类号： H05K1/186 , H01L21/563 , H01L23/3121 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81801 , H01L2224/82 , H01L2224/85 , H01L2224/86 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H05K3/0035 , H05K3/28 , H05K3/305 , H05K2201/0195 , H05K2201/10674 , H05K2201/10977 , H01L2924/00 , H01L2224/05599
摘要： A board 1 according to the present invention includes a board main body 3; electronic parts 5 electrically connected to and mounted on the board main body 3; and an under-fill material 19 with which a part between the board main body 3 and a surface of the electronic parts 5 electrically connected to the board main body is filled. A hole 21 passing through a layer 19a of the under-fill material that flows outside from a connecting area of the electronic parts 5 and the board main body 3 is provided for electrically connecting other parts to the board main body.
摘要翻译：根据本发明的板1包括板主体3; 电连接并安装在板主体3上的电子部件5; 以及填充材料19，其中板主体3与电连接到板主体的电子部件5的表面之间的部分被填充。设置有从电子部件5和板主体3的连接区域流过外部的填充材料的层19a的孔21，用于将其他部分电连接到板主体。

6. 发明授权

US07660514B2 Video recorder and method for reserve-recording a broadcast program 有权
标题翻译：用于预约录制广播节目的录像机和方法
公开(公告)号：US07660514B2
公开(公告)日：2010-02-09
申请号：US11296689
申请日：2005-12-08
申请人： Masayuki Inoue , Yoshihiro Machida , Kouji Kamogawa
发明人： Masayuki Inoue , Yoshihiro Machida , Kouji Kamogawa
IPC分类号： H04N5/91 , H04N7/00
CPC分类号： H04N5/782 , H04N5/76
摘要： A video recorder for recording a program video in a built-in HDD (hard disk drive) or the like on the basis of EPG data is easily put in a reserve-recording mode. To this end, reserve-recording candidate data is generated from the EPG data with use of recorded program information to facilitate selection of the reserve-recording mode. In a method for reserve-recording a broadcast program, similar program information is extracted from the EPG data on the basis of recorded title data held as the recorded program information, the extracted similar program data is converted to a data format usable for the reserve-recording, and is stored as reserve-recording candidate data upon reserve-recording.
摘要翻译：基于EPG数据的用于在内置HDD（硬盘驱动器）等中记录节目视频的录像机容易进入保留记录模式。为此，使用记录的节目信息从EPG数据生成预约记录候选数据，以便于选择预约记录模式。在用于保存记录广播节目的方法中，根据作为记录节目信息保存的记录标题数据，从EPG数据中提取类似的节目信息，所提取的类似节目数据被转换为可用于预约播放节目的数据格式，记录，并且作为保留记录候选数据被储存。

7. 发明申请

US20090044222A1 Broadcasting Receiver 审中-公开
标题翻译：广播接收机
公开(公告)号：US20090044222A1
公开(公告)日：2009-02-12
申请号：US12179601
申请日：2008-07-25
申请人： Yoshihiro Machida , Koji Kamogawa , Kazunori Iwabuchi
发明人： Yoshihiro Machida , Koji Kamogawa , Kazunori Iwabuchi
IPC分类号： H04N5/445 , H04N7/173
CPC分类号： H04N21/631 , H04N5/4401 , H04N21/4622 , H04N21/4821 , H04N21/6112 , H04N21/6125
摘要： A broadcasting receiver capable of receiving the broadcasting services via both broadcast wave and the Internet is provided, which may allow a user to select a desired broadcasting service irrespectively of the difference in transmission channel between the broadcast wave and the Internet. The broadcasting receiver includes a channel table to record at least a channel for the digital broadcasting service via the broadcast wave and a piece of access point name information for the digital broadcasting service via the Internet correspondingly to a channel number selected by a user, in which streaming data output of the tuner or the Internet communication device is selected based on the user's choice on the channel number. Further, when the same broadcasting service is provided via both the broadcast wave and the Internet, the broadcasting service of the better receiving condition is received.
摘要翻译：提供能够通过广播波和因特网接收广播服务的广播接收机，这可以允许用户选择所需的广播服务，而不管广播波和因特网之间的传输信道的差异。广播接收机包括：频道表，用于经由广播波至少记录数字广播服务的频道，以及与用户选择的频道号相对应的经由互联网的数字广播服务的接入点名称信息，其中基于用户对频道号的选择来选择调谐器或因特网通信设备的流数据输出。此外，当经由广播波和因特网两者提供相同的广播服务时，接收到更好的接收条件的广播服务。

8. 发明申请

US20080230897A1 METHOD OF MANUFACTURING ELECTRONIC DEVICE, SUBSTRATE AND SEMICONDUCTOR DEVICE 有权
标题翻译：制造电子器件，衬底和半导体器件的方法
公开(公告)号：US20080230897A1
公开(公告)日：2008-09-25
申请号：US12044397
申请日：2008-03-07
申请人： Yoshihiro Machida
发明人： Yoshihiro Machida
IPC分类号： H01L23/488 , H01L21/44
CPC分类号： H01L21/6835 , H01L21/4853 , H01L24/11 , H01L2221/68359 , H01L2221/68377 , H01L2224/0231 , H01L2224/02333 , H01L2224/0401 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01037 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/014
摘要： A method includes a step of forming a bump 104 having a projection 104B on an electrode pad 103 provided on a semiconductor chip 101, a step of exposing a part of the projection 104B to an upper surface of an insulating layer 105 formed on the semiconductor chip 101, a step of forming a conductive layer 107A on the upper surface of the insulating layer 105 and an exposed part of a tip portion 104D, a step of removing a protruded portion of the conductive layer 107A which is opposed to the tip portion 104D by means of a grinding roll 112, thereby exposing the projection from the conductive layer 107A, and a step of forming a conductive layer 108A through electrolytic plating using the conductive layer 107A as a feeding layer and patterning the conductive layer 108A.
摘要翻译：一种方法包括在设置在半导体芯片101上的电极焊盘103上形成具有突出部104B的突起104的步骤，将突起部104B的一部分暴露于形成在半导体芯片101上的绝缘层105的上表面的步骤半导体芯片101，在绝缘层105的上表面上形成导电层107A和顶端部分104D的露出部分的步骤，除去导电层107A的突出部分的步骤通过研磨辊112使尖端部分104D，从而使导电层107A的突起露出，以及通过使用导电层107A作为馈电层的电解电镀形成导电层108A的步骤，并使导电层108 A.

9. 发明申请

US20070096292A1 Electronic-part built-in substrate and manufacturing method therefor 审中-公开
标题翻译：电子部件内置基板及其制造方法
公开(公告)号：US20070096292A1
公开(公告)日：2007-05-03
申请号：US11586628
申请日：2006-10-26
申请人： Yoshihiro Machida
发明人： Yoshihiro Machida
IPC分类号： H01L23/12
CPC分类号： H01L23/5389 , H01L21/4857 , H01L23/3677 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L2221/68345 , H01L2224/05568 , H01L2224/05573 , H01L2224/13144 , H01L2224/16225 , H01L2224/16235 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81001 , H01L2224/81801 , H01L2224/82 , H01L2224/85 , H01L2224/86 , H01L2225/06568 , H01L2225/1058 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/18161 , H01L2924/19041 , H01L2924/19105 , H01L2924/3511 , H05K3/4682 , H05K3/4697 , H05K2201/10674 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The electronic-part built-in substrate includes a coreless substrate 11 in which a wiring pattern 31 is formed in laminated insulating layers 26 and 27, a semiconductor chip 14 electrically connected to the wiring pattern 31, a resin layer 13 configured to cover a first main surface of the coreless substrate 11 and to have an accommodating portion 57 that accommodates the semiconductor chip 14, and a sealing resin 19 that seals the semiconductor chip 14 accommodated in the accommodating portion 57.
摘要翻译：电子部件内置基板包括：无芯基板11，其中布线图案31形成在层叠绝缘层26和27中;半导体芯片14，电连接到布线图案31;树脂层13，被配置为覆盖第一无芯基板11的主表面和容纳半导体芯片14的容纳部分57以及密封容纳在容纳部分57中的半导体芯片14的密封树脂19。

10. 发明申请

US20070045811A1 LAMINATED PRODUCT IN STRUCTURE INCLUDING GLASS-CLOTH CONTAINED RESIN LAYER AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：包含玻璃包含树脂层的结构中的层压产品及其制造方法
公开(公告)号：US20070045811A1
公开(公告)日：2007-03-01
申请号：US11463166
申请日：2006-08-08
申请人： Yoshihiro Machida , Kosaku Harayama , Takaharu Yamano
发明人： Yoshihiro Machida , Kosaku Harayama , Takaharu Yamano
IPC分类号： H01L23/52
CPC分类号： H05K3/4673 , H05K1/0366 , H05K3/0032 , H05K3/0035 , H05K3/4644 , H05K2201/0195
摘要： The laminated product in a structure including a glass-cloth contained resin layer according to this invention is a laminated product in which a wiring layer and an insulating layer alternately laminated are included and different wiring layers are electrically connected to each other by a via hole passing through the insulating layer, characterized in that at least one insulating layer 11 is formed of a laminated body including an insulating resin layer 7 on a lower wiring layer 5 and a glass-cloth contained resin layer 9 thereon, and in the laminated body, a via hole 17 continuously passes through from the upper glass-cloth contained resin layer 9 to the lower insulating resin layer 7.
摘要翻译：根据本发明的包括玻璃布的树脂层的结构的层压产品是其中包括交替层叠的布线层和绝缘层的层压产品，并且不同的布线层通过通孔穿过而彼此电连接通过绝缘层，其特征在于，至少一个绝缘层11由在下布线层5上的绝缘树脂层7和其上的玻璃布包含树脂层9的层叠体形成，并且在层叠体中，通孔17从上玻璃布包含的树脂层9连续地通过到下绝缘树脂层7。

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