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    • 9. 发明授权
    • Imaging module, fabricating method therefor, and imaging device
    • 成像模块,其制造方法和成像装置
    • US08796798B2
    • 2014-08-05
    • US13007846
    • 2011-01-17
    • Daiki MinegishiYasuhiro SatohEiji MochizukiMasayuki FujishimaHiroshi Miura
    • Daiki MinegishiYasuhiro SatohEiji MochizukiMasayuki FujishimaHiroshi Miura
    • H01L31/0232H01L27/146
    • H01L27/14618H01L2924/0002H01L2924/00
    • An imaging module includes an imaging chip including a micro-lens guiding incident light and an imaging element in a semiconductor substrate and converting the incident light into an electric signal, and a polarizing glass chip including a polarizing filter glass having a polarizer determining a polarization direction of the incident light arranged on a transparent substrate such that the polarizer faces the micro-lens and a spacer member connected to the polarizing filter glass to adjust a gap between the polarizer and the micro-lens of the imaging chip. In the imaging module, a melt-bonding surface of the spacer member is melt-bonded to the semiconductor substrate such that the polarizer of the polarizing glass chip and the micro-lens of the imaging chip are arranged close to each other via the gap, and the imaging element and the micro-lens of the imaging chip are sealed by the polarizing glass chip.
    • 一种成像模块包括:成像芯片,包括在半导体衬底中引导入射光和成像元件的微透镜,并将入射光转换为电信号;以及偏振玻璃芯片,其包括具有偏振器的偏振滤光片玻璃, 配置在透明基板上的入射光使得偏振器面向微透镜,以及与偏振滤光片玻璃连接的间隔构件,以调节偏振片与成像芯片的微透镜之间的间隙。 在成像模块中,间隔件的熔融粘合表面熔融粘合到半导体衬底上,使得偏振玻璃芯片的偏振器和成像芯片的微透镜经由间隙彼此靠近配置, 并且成像芯片的成像元件和微透镜被偏光玻璃芯片密封。