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    • 9. 发明授权
    • Vacuum dispensable silicone compositions
    • 真空可分配硅酮组合物
    • US5977226A
    • 1999-11-02
    • US72229
    • 1998-05-04
    • Stanton James DentEdward Joseph BensonAnn Walstrom NorrisYeong Joo Lee
    • Stanton James DentEdward Joseph BensonAnn Walstrom NorrisYeong Joo Lee
    • C08K3/10C08G77/32C08K3/22C08K3/36C08K3/38C08L83/04C08L83/05C08L83/07C08K5/54
    • C08L83/04C08G77/32C08G77/12C08G77/20
    • A vacuum dispensable silicone composition comprising (A) a polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) an organopolysiloxane resin consisting essentially of (a) R.sup.3.sub.2 (CH.sub.2 .dbd.CH)SiO.sub.1/2 siloxane units, (b) R.sup.3.sub.3 SiO.sub.1/2 siloxane units, and (c) SiO.sub.4/2 siloxane units wherein each R.sup.3 is independently selected from the group consisting of monovalent hydrocarbon and monovalent halogenated hydrocarbon groups free of aliphatic unsaturation, the mole ratio of the combination of (a) and (b) units to (c) units is from 0.6 to 1.1, and the resin contains 1 to 5 percent by weight of vinyl groups; (C) an organohydrogenpolysiloxane having an average of at least three silicon-bonded hydrogen atoms per molecule in an amount sufficient to provide from one to three silicon-bonded hydrogen atoms per alkenyl group in components (A) and (B) combined; (D) an adhesion promoter in an amount sufficient to effect adhesion of the composition to a substrate; (E) a hydrosilylation catalyst; (F) a platinum catalyst inhibitor having a boiling point greater than 150 .degree. C. at 0.10 MPa in an amount sufficient to retard curing of the composition at ambient temperature; wherein the composition is substantially free of air.
    • 一种真空可分配硅氧烷组合物,其包含(A)每分子含有平均至少两个硅键合的烯基的聚二有机硅氧烷; (B)基本上由(a)R32(CH2 = CH)SiO + E,fra1 / 2 + EE硅氧烷单元,(b)R33SiO + E,fra1 / 2 + EE硅氧烷单元组成的有机聚硅氧烷树脂和(c )SiO + E,fra 4/2 + EE硅氧烷单元,其中每个R 3独立地选自不含脂肪族不饱和键的一价烃和一价卤代烃基,(a)和(b)的组合的摩尔比, 单元至(c)单元为0.6〜1.1,树脂含有1〜5重量%的乙烯基; (C)每分子平均具有至少三个与硅键合的氢原子的有机氢聚硅氧烷,其量足以在组合物(A)和(B)中每个烯基上提供一至三个与硅键合的氢原子; (D)粘合促进剂,其量足以使组合物与基材粘合; (E)氢化硅烷化催化剂; (F)在0.10MPa下沸点大于150℃的铂催化剂抑制剂,其量足以阻止组合物在环境温度下固化; 其中所述组合物基本上不含空气。