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    • 2. 发明授权
    • Compact ReRAM based FPGA
    • 紧凑型基于ReRAM的FPGA
    • US09444464B1
    • 2016-09-13
    • US15010222
    • 2016-01-29
    • Microsemi SoC Corporation
    • John L. McCollumFethi Dhaoui
    • G11C11/00H03K19/177G11C13/00
    • H01L27/2454G11C13/003G11C13/0069G11C2213/74G11C2213/78G11C2213/79G11C2213/82H01L21/768H01L45/16H03K19/1776
    • A push-pull resistive random access memory cell circuit includes an output node, a word line, a first bit line, and a second bit line. A first resistive random access memory device is connected between the first bit line and the output node and a second resistive random access memory device is connected between the output node and the second bit line. A first programming transistor has a gate connected to the word line, a drain connected to the output node, and a source. A second programming transistor has a gate connected to the word line, a drain connected to the source of the first programming transistor, and a source. The first and second programming transistors have the same pitch, the same channel length, and the same gate dielectric thickness, the gate dielectric thickness chosen to withstand programming and erase potentials encountered during operation of the push-pull ReRAM cell circuit.
    • 推挽电阻随机存取存储器单元电路包括输出节点,字线,第一位线和第二位线。 第一电阻随机存取存储器件连接在第一位线和输出节点之间,第二电阻随机存取存储器件连接在输出节点和第二位线之间。 第一编程晶体管具有连接到字线的栅极,连接到输出节点的漏极和源极。 第二编程晶体管具有连接到字线的栅极,连接到第一编程晶体管的源极的漏极和源极。 第一和第二编程晶体管具有相同的间距,相同的沟道长度和相同的栅介质厚度,选择栅极电介质厚度以承受在推挽式ReRAM单元电路的操作期间遇到的编程和擦除电位。
    • 6. 发明申请
    • HIGH VOLTAGE DEVICE FABRICATED USING LOW-VOLTAGE PROCESSES
    • 使用低电压工艺制造的高压器件
    • US20160204223A1
    • 2016-07-14
    • US15075972
    • 2016-03-21
    • Microsemi SoC Corporation
    • Fengliang XueFethi DhaouiJohn L. McCollum
    • H01L29/66H01L21/265
    • H01L29/66492H01L21/265H01L29/0653H01L29/0847H01L29/665H01L29/7833H01L29/7835
    • A method for fabricating a high-voltage transistor on a semiconductor substrate includes defining and forming shallow trench isolation regions for all of the transistors, defining and forming well regions for all of the transistors, forming a gate oxide layer in the well regions for all of the transistor, forming gates for all of the transistors over the gate oxide layer, implanting a dopant to form lightly-doped drain regions for all of the transistors, the lightly-doped drain regions for at least drains of the high-voltage transistors being spaced apart from an inner edge of the shallow trench isolation regions, forming gate spacers at sides of the gates of all of the transistors, and implanting a dopant to form sources and drains for all of the transistors, the drains of the high-voltage transistors being formed completely surrounded by the lightly-doped drain regions of the high-voltage transistors.
    • 在半导体衬底上制造高电压晶体管的方法包括限定和形成用于所有晶体管的浅沟槽隔离区,为所有晶体管限定和形成阱区,在阱区中形成用于所有晶体管的栅极氧化物层 所述晶体管在所述栅极氧化物层上形成所有晶体管的栅极,注入掺杂剂以形成所有所述晶体管的轻掺杂漏极区,所述高电压晶体管的至少漏极的所述轻掺杂漏极区间隔开 除了浅沟槽隔离区域的内边缘之外,在所有晶体管的栅极的侧面形成栅极间隔物,并且注入掺杂剂以形成所有晶体管的源极和漏极,高压晶体管的漏极为 完全被高电压晶体管的轻掺杂漏区包围。
    • 9. 发明申请
    • COMPACT ReRAM BASED FPGA
    • 基于ReRAM的FPGA
    • US20160269031A1
    • 2016-09-15
    • US15010222
    • 2016-01-29
    • Microsemi SoC Corporation
    • John L. McCollumFethi Dhaoui
    • H03K19/177G11C13/00
    • H01L27/2454G11C13/003G11C13/0069G11C2213/74G11C2213/78G11C2213/79G11C2213/82H01L21/768H01L45/16H03K19/1776
    • A push-pull resistive random access memory cell circuit includes an output node, a word line, a first bit line, and a second bit line. A first resistive random access memory device is connected between the first bit line and the output node and a second resistive random access memory device is connected between the output node and the second bit line. A first programming transistor has a gate connected to the word line, a drain connected to the output node, and a source. A second programming transistor has a gate connected to the word line, a drain connected to the source of the first programming transistor, and a source. The first and second programming transistors have the same pitch, the same channel length, and the same gate dielectric thickness, the gate dielectric thickness chosen to withstand programming and erase potentials encountered during operation of the push-pull ReRAM cell circuit.
    • 推挽电阻随机存取存储器单元电路包括输出节点,字线,第一位线和第二位线。 第一电阻随机存取存储器件连接在第一位线和输出节点之间,第二电阻随机存取存储器件连接在输出节点和第二位线之间。 第一编程晶体管具有连接到字线的栅极,连接到输出节点的漏极和源极。 第二编程晶体管具有连接到字线的栅极,连接到第一编程晶体管的源极的漏极和源极。 第一和第二编程晶体管具有相同的间距,相同的沟道长度和相同的栅介质厚度,选择栅极电介质厚度以承受在推挽式ReRAM单元电路的操作期间遇到的编程和擦除电位。