会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明申请
    • Metal wiring layer and method of fabricating the same
    • 金属布线层及其制造方法
    • US20090115066A1
    • 2009-05-07
    • US12290594
    • 2008-10-31
    • Dong-Ju YangShin-Il ChoiSang-Gab KimMin-Seok OhHong-Kee ChinKi-Yeup LeeYu-Gwang JeongSeung-Ha Choi
    • Dong-Ju YangShin-Il ChoiSang-Gab KimMin-Seok OhHong-Kee ChinKi-Yeup LeeYu-Gwang JeongSeung-Ha Choi
    • H01L23/535H01L21/768
    • H01L23/535H01L21/743H01L27/1218H01L27/124H01L2924/0002H01L2924/00
    • A metal wiring layer and a method of fabricating the metal wiring layer are provided. The method includes forming a dielectric layer on a substrate, forming a plurality of dielectric layer patterns and holes therein on the substrate by etching part of the dielectric layer, with a cross sectional area of the holes in the dielectric layer patterns decreasing with increasing distance away from the substrate and the holes exposing the substrate, forming a trench by etching a portion of the substrate exposed through the holes in the dielectric layer patterns, and forming a metal layer which fills the trench and the holes in the dielectric layer patterns. Thus, it is possible to prevent the occurrence of an edge build-up phenomenon by forming a metal layer in a plurality of holes in the dielectric layer patterns having a cross sectional area decreasing with increasing distance away from the substrate. Therefore, it is possible to prevent the transmittance of a liquid crystal layer from decreasing due to a failure to properly fill liquid crystal molecules in the liquid crystal layer, and thus to increase the quality of display.
    • 提供金属布线层和制造金属布线层的方法。 该方法包括在衬底上形成电介质层,通过蚀刻介电层的一部分,在衬底上形成多个介电层图案和孔,电介质层图案中的孔的横截面积随距离的增加而减小 从衬底和暴露衬底的孔,通过蚀刻通过介电层图案中的孔暴露的衬底的一部分形成沟槽,以及形成填充沟槽和介电层图案中的空穴的金属层。 因此,可以通过在电介质层图案中的多个孔中形成金属层来防止边缘积聚现象的发生,该电介质层图案的横截面积随离开距衬底的距离的增加而减小。 因此,可以防止液晶层的透射率由于不能适当地填充液晶层中的液晶分子而降低,从而提高显示质量。
    • 5. 发明授权
    • Metal wiring layer and method of fabricating the same
    • 金属布线层及其制造方法
    • US08211797B2
    • 2012-07-03
    • US12290594
    • 2008-10-31
    • Dong-Ju YangShin-Il ChoiSang-Gab KimMin-Seok OhHong-Kee ChinKi-Yeup LeeYu-Gwang JeongSeung-Ha Choi
    • Dong-Ju YangShin-Il ChoiSang-Gab KimMin-Seok OhHong-Kee ChinKi-Yeup LeeYu-Gwang JeongSeung-Ha Choi
    • H01L21/44
    • H01L23/535H01L21/743H01L27/1218H01L27/124H01L2924/0002H01L2924/00
    • A metal wiring layer and a method of fabricating the metal wiring layer are provided. The method includes forming a dielectric layer on a substrate, forming a plurality of dielectric layer patterns and holes therein on the substrate by etching part of the dielectric layer, with a cross sectional area of the holes in the dielectric layer patterns decreasing with increasing distance away from the substrate and the holes exposing the substrate, forming a trench by etching a portion of the substrate exposed through the holes in the dielectric layer patterns, and forming a metal layer which fills the trench and the holes in the dielectric layer patterns. Thus, it is possible to prevent the occurrence of an edge build-up phenomenon by forming a metal layer in a plurality of holes in the dielectric layer patterns having a cross sectional area decreasing with increasing distance away from the substrate. Therefore, it is possible to prevent the transmittance of a liquid crystal layer from decreasing due to a failure to properly fill liquid crystal molecules in the liquid crystal layer, and thus to increase the quality of display.
    • 提供金属布线层和制造金属布线层的方法。 该方法包括在衬底上形成电介质层,通过蚀刻介电层的一部分,在衬底上形成多个介电层图案和孔,电介质层图案中的孔的横截面积随距离的增加而减小 从衬底和暴露衬底的孔,通过蚀刻通过介电层图案中的孔暴露的衬底的一部分形成沟槽,以及形成填充沟槽和介电层图案中的空穴的金属层。 因此,可以通过在电介质层图案中的多个孔中形成金属层来防止边缘积聚现象的发生,该电介质层图案的横截面积随离开距衬底的距离的增加而减小。 因此,可以防止液晶层的透射率由于不能适当地填充液晶层中的液晶分子而降低,从而提高显示质量。