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1. 发明申请

US20100259337A1 High speed transmission lines with enhanced coupling 有权
标题翻译：具有增强耦合的高速传输线
公开(公告)号：US20100259337A1
公开(公告)日：2010-10-14
申请号：US12384943
申请日：2009-04-10
申请人： Mohammad Tabatabai
发明人： Mohammad Tabatabai
IPC分类号： H01P3/08
CPC分类号： H01P3/026 , H05K1/024 , H05K1/0245 , H05K2201/0191 , H05K2201/0715 , H05K2201/09236 , H05K2201/09318
摘要： According to one exemplary embodiment, a circuit board for reducing dielectric loss, conductor loss, and insertion loss includes a pair of transmission lines. The pair of transmission lines has sufficient thickness to cause substantial broadside electromagnetic coupling between the pair of transmission lines, where the pair of transmission lines is sufficiently separated from a ground plane of the circuit board so as to cause negligible electromagnetic coupling to the ground plane relative to the substantial broadside electromagnetic coupling. The pair of transmission lines thereby reduce dielectric loss, conductor loss, and insertion loss for signals traversing through the transmission line pair. The pair of transmission lines can be separated from the ground plane by, for example, at least 50.0 mils.
摘要翻译：根据一个示例性实施例，用于降低介质损耗，导体损耗和插入损耗的电路板包括一对传输线。这对传输线具有足够的厚度，以在一对传输线之间产生实质的宽边电磁耦合，其中一对传输线与电路板的接地平面充分分离，从而使接地平面的电磁耦合可以忽略不计到实质的宽边电磁耦合。这对传输线因此减少了穿过传输线对的信号的介质损耗，导体损耗和插入损耗。这对传输线可以通过例如至少50.0密耳从地平面分离。

2. 发明授权

US07388448B2 Semi-suspended coplanar waveguide on a printed circuit board 有权
标题翻译：半挂式共面波导在印刷电路板上
公开(公告)号：US07388448B2
公开(公告)日：2008-06-17
申请号：US11714729
申请日：2007-03-07
申请人： Mohammad Tabatabai
发明人： Mohammad Tabatabai
IPC分类号： H01P3/08
CPC分类号： H01P11/003 , H01P3/003 , H05K1/024 , H05K1/0298 , H05K1/0366 , H05K3/4611 , H05K3/4697 , H05K2203/063 , Y10T29/49016 , Y10T29/49155 , Y10T428/24917
摘要： A printed circuit board includes two differential signal traces, a layer of core material, a layer of filler material, and a ground plane. The filler material is replaced by an air core under the differential signal traces.
摘要翻译：印刷电路板包括两个差分信号迹线，一层芯材料，一层填充材料和一个接地平面。填充材料由差分信号迹线下的空气芯代替。

3. 发明申请

US20120306061A1 Apparatus and Method for Grounding an IC Package Lid for EMI Reduction 有权
标题翻译：用于接地IC封装盖的EMI和降低的装置和方法
公开(公告)号：US20120306061A1
公开(公告)日：2012-12-06
申请号：US13149793
申请日：2011-05-31
申请人： Mohammad Tabatabai , Abbas Amirichimeh , Lorenzo Longo
发明人： Mohammad Tabatabai , Abbas Amirichimeh , Lorenzo Longo
IPC分类号： H01L23/552 , H01L21/60 , H01L21/58
CPC分类号： H01L23/10 , H01L23/49816 , H01L23/49827 , H01L23/552 , H01L2224/32225 , H01L2924/15311
摘要： Methods and apparatus for improved electromagnetic interference (EMI) shielding and thermal performance in integrated circuit (IC) packages are described. A die-up or die-down package includes a protective lid, a plurality of ground posts, an IC die, and a substrate. The substrate includes a plurality of ground planes. The IC die is mounted to the substrate. Plurality of ground posts is coupled to plurality of ground planes that surround IC die. Protective lid is coupled to plurality of ground posts. The plurality of ground posts and the protective lid from an enclosure structure that substantially encloses the IC die, and shields EMI from and radiating towards the IC die. The enclosure structure also dissipates heat generated by the IC die during operation.
摘要翻译：描述了用于改善集成电路（IC）封装中的电磁干扰（EMI）屏蔽和热性能的方法和装置。封装或封装的封装包括保护盖，多个接地柱，IC管芯和基板。基板包括多个接地平面。 IC芯片安装到基板上。多个接地柱耦合到围绕IC芯片的多个接地层。保护盖连接到多个接地柱。多个接地柱和保护盖形成基本上封装IC管芯的外壳结构，并且屏蔽EMI以朝向IC管芯辐射。外壳结构还在运行期间消散IC芯片产生的热量。

4. 发明申请

US20120146748A1 Transmission Line Pairs with Enhanced Coupling 有权
标题翻译：传输线对增强耦合
公开(公告)号：US20120146748A1
公开(公告)日：2012-06-14
申请号：US13400965
申请日：2012-02-21
申请人： Mohammad Tabatabai
发明人： Mohammad Tabatabai
IPC分类号： H01P3/08
CPC分类号： H01P3/026 , H05K1/024 , H05K1/0245 , H05K2201/0191 , H05K2201/0715 , H05K2201/09236 , H05K2201/09318
摘要： According to one exemplary embodiment, a circuit board for reducing dielectric loss, conductor loss, and insertion loss includes a pair of transmission lines. The pair of transmission lines has sufficient thickness to cause substantial broadside electromagnetic coupling between the pair of transmission lines, where the pair of transmission lines is sufficiently separated from a ground plane of the circuit board so as to cause negligible electromagnetic coupling to the ground plane relative to the substantial broadside electromagnetic coupling. The pair of transmission lines thereby reduce dielectric loss, conductor loss, and insertion loss for signals traversing through the transmission line pair. The pair of transmission lines can be separated from the ground plane by, for example, at least 50.0 mils.
摘要翻译：根据一个示例性实施例，用于降低介质损耗，导体损耗和插入损耗的电路板包括一对传输线。这对传输线具有足够的厚度，以在一对传输线之间产生实质的宽边电磁耦合，其中一对传输线与电路板的接地平面充分分离，从而使接地平面的电磁耦合可以忽略不计到实质的宽边电磁耦合。这对传输线因此减少了穿过传输线对的信号的介质损耗，导体损耗和插入损耗。这对传输线可以通过例如至少50.0密耳从地平面分离。

5. 发明授权

US07202755B2 Semi-suspended coplanar waveguide on a printed circuit board 有权
标题翻译：半挂式共面波导在印刷电路板上
公开(公告)号：US07202755B2
公开(公告)日：2007-04-10
申请号：US11148564
申请日：2005-06-09
申请人： Mohammad Tabatabai
发明人： Mohammad Tabatabai
IPC分类号： H01P3/08
CPC分类号： H01P11/003 , H01P3/003 , H05K1/024 , H05K1/0298 , H05K1/0366 , H05K3/4611 , H05K3/4697 , H05K2203/063 , Y10T29/49016 , Y10T29/49155 , Y10T428/24917
摘要： A printed circuit board includes two differential signal traces, a layer of core material, a layer of filler material, and a ground plane. The filler material is replaced by an air core under the differential signal traces.
摘要翻译：印刷电路板包括两个差分信号迹线，一层芯材料，一层填充材料和一个接地平面。填充材料由差分信号迹线下的空气芯代替。

6. 发明授权

US08525611B2 Enhanced electromagnetic coupling between a transmission line pair with reduced electromagnetic coupling to ground 有权
标题翻译：传输线对之间增强的电磁耦合，减少电磁耦合到地面
公开(公告)号：US08525611B2
公开(公告)日：2013-09-03
申请号：US13400965
申请日：2012-02-21
申请人： Mohammad Tabatabai
发明人： Mohammad Tabatabai
IPC分类号： H01P3/08
CPC分类号： H01P3/026 , H05K1/024 , H05K1/0245 , H05K2201/0191 , H05K2201/0715 , H05K2201/09236 , H05K2201/09318
摘要： According to one exemplary embodiment, a circuit board for reducing dielectric loss, conductor loss, and insertion loss includes a pair of transmission lines. The pair of transmission lines has sufficient thickness to cause substantial broadside electromagnetic coupling between the pair of transmission lines, where the pair of transmission lines is sufficiently separated from a ground plane of the circuit board so as to cause negligible electromagnetic coupling to the ground plane relative to the substantial broadside electromagnetic coupling. The pair of transmission lines thereby reduce dielectric loss, conductor loss, and insertion loss for signals traversing through the transmission line pair. The pair of transmission lines can be separated from the ground plane by, for example, at least 50.0 mils.
摘要翻译：根据一个示例性实施例，用于降低介质损耗，导体损耗和插入损耗的电路板包括一对传输线。这对传输线具有足够的厚度，以在一对传输线之间产生实质的宽边电磁耦合，其中一对传输线与电路板的接地平面充分分离，从而使接地平面的电磁耦合可以忽略不计到实质的宽边电磁耦合。这对传输线因此减少了穿过传输线对的信号的介质损耗，导体损耗和插入损耗。这对传输线可以通过例如至少50.0密耳从地平面分离。

7. 发明授权

US08125289B2 Transmission line pairs with enhanced coupling therebetween and negligible coupling to ground 有权
标题翻译：具有增强的耦合的传输线对与可接地的耦合可忽略不计
公开(公告)号：US08125289B2
公开(公告)日：2012-02-28
申请号：US12384943
申请日：2009-04-10
申请人： Mohammad Tabatabai
发明人： Mohammad Tabatabai
IPC分类号： H01P3/08
CPC分类号： H01P3/026 , H05K1/024 , H05K1/0245 , H05K2201/0191 , H05K2201/0715 , H05K2201/09236 , H05K2201/09318
摘要： According to one exemplary embodiment, a circuit board for reducing dielectric loss, conductor loss, and insertion loss includes a pair of transmission lines. The pair of transmission lines has sufficient thickness to cause substantial broadside electromagnetic coupling between the pair of transmission lines, where the pair of transmission lines is sufficiently separated from a ground plane of the circuit board so as to cause negligible electromagnetic coupling to the ground plane relative to the substantial broadside electromagnetic coupling. The pair of transmission lines thereby reduce dielectric loss, conductor loss, and insertion loss for signals traversing through the transmission line pair. The pair of transmission lines can be separated from the ground plane by, for example, at least 50.0 mils.
摘要翻译：根据一个示例性实施例，用于降低介质损耗，导体损耗和插入损耗的电路板包括一对传输线。这对传输线具有足够的厚度，以在一对传输线之间产生实质的宽边电磁耦合，其中一对传输线与电路板的接地平面充分分离，从而使接地平面的电磁耦合可以忽略不计到实质的宽边电磁耦合。这对传输线因此减少了穿过传输线对的信号的介质损耗，导体损耗和插入损耗。这对传输线可以通过例如至少50.0密耳从地平面分离。

8. 发明授权

US06924712B2 Semi-suspended coplanar waveguide on a printed circuit board 有权
标题翻译：半挂式共面波导在印刷电路板上
公开(公告)号：US06924712B2
公开(公告)日：2005-08-02
申请号：US10354068
申请日：2003-01-30
申请人： Mohammad Tabatabai
发明人： Mohammad Tabatabai
IPC分类号： H01P3/00 , H05K1/00 , H05K1/02 , H05K1/03 , H05K3/46 , H01P3/08
CPC分类号： H01P11/003 , H01P3/003 , H05K1/024 , H05K1/0298 , H05K1/0366 , H05K3/4611 , H05K3/4697 , H05K2203/063 , Y10T29/49016 , Y10T29/49155 , Y10T428/24917
摘要： A printed circuit board includes two differential signal traces, a layer of core material, a layer of filler material, and a ground plane. The filler material is replaced by an air core under the differential signal traces.
摘要翻译：印刷电路板包括两个差分信号迹线，一层芯材料，一层填充材料和一个接地平面。填充材料由差分信号迹线下的空气芯代替。

9. 发明授权

US09009514B2 System and method for switching in an energy efficient network 有权
标题翻译：用于切换节能网络的系统和方法
公开(公告)号：US09009514B2
公开(公告)日：2015-04-14
申请号：US13603390
申请日：2012-09-04
申请人： Mohammad Tabatabai , Richard Togashi
发明人： Mohammad Tabatabai , Richard Togashi
IPC分类号： G06F1/32 , G06F1/26
CPC分类号： G06F1/3203 , G06F1/266 , G06F1/3206
摘要： A system and method for switching in an energy efficient network. Rapid switching between multiple operating modes can generate a voltage spike or voltage lag on an on-board inductor. Suppression of the voltage spike or voltage lag can be enabled through the activation of by a physical layer device of an inductor bypass path at a time proximate to the switching between multiple operating modes.
摘要翻译：一种用于切换节能网络的系统和方法。多种工作模式之间的快速切换可以在板载感应器上产生电压尖峰或电压滞后。通过在接近多个操作模式之间的切换时的电感器旁路路径的物理层装置来激活电压尖峰或电压滞后的抑制。

10. 发明授权

US08669646B2 Apparatus and method for grounding an IC package lid for EMI reduction 有权
标题翻译： IC封装盖接地用于EMI降低的装置和方法
公开(公告)号：US08669646B2
公开(公告)日：2014-03-11
申请号：US13149793
申请日：2011-05-31
申请人： Mohammad Tabatabai , Abbas Amirichimeh , Lorenzo Longo
发明人： Mohammad Tabatabai , Abbas Amirichimeh , Lorenzo Longo
IPC分类号： H01L23/552 , H01L21/00
CPC分类号： H01L23/10 , H01L23/49816 , H01L23/49827 , H01L23/552 , H01L2224/32225 , H01L2924/15311
摘要： Methods and apparatus for improved electromagnetic interference (EMI) shielding and thermal performance in integrated circuit (IC) packages are described. A die-up or die-down package includes a protective lid, a plurality of ground posts, an IC die, and a substrate. The substrate includes a plurality of ground planes. The IC die is mounted to the substrate. Plurality of ground posts is coupled to plurality of ground planes that surround IC die. Protective lid is coupled to plurality of ground posts. The plurality of ground posts and the protective lid from an enclosure structure that substantially encloses the IC die, and shields EMI from and radiating towards the IC die. The enclosure structure also dissipates heat generated by the IC die during operation.
摘要翻译：描述了用于改善集成电路（IC）封装中的电磁干扰（EMI）屏蔽和热性能的方法和装置。封装或封装的封装包括保护盖，多个接地柱，IC管芯和基板。基板包括多个接地平面。 IC芯片安装到基板上。多个接地柱耦合到围绕IC芯片的多个接地层。保护盖连接到多个接地柱。多个接地柱和保护盖形成基本上封装IC管芯的外壳结构，并且屏蔽EMI以朝向IC管芯辐射。外壳结构还在运行期间消散IC芯片产生的热量。

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