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1. 发明授权

US10256029B2 Electronic component and method for manufacturing the same 有权
公开(公告)号：US10256029B2
公开(公告)日：2019-04-09
申请号：US15095425
申请日：2016-04-11
申请人： MURATA MANUFACTURING CO., LTD.
发明人： Norimichi Onozaki , Kaoru Tachibana , Mitsuru Odahara
IPC分类号： H01F5/00 , H01F27/28 , H01F41/04 , H01F41/02
摘要： An electronic component includes a multilayer body having a configuration, in which a plurality of insulator layers containing ferrite ceramic are stacked, and a coil having a configuration, in which a plurality of coil conductor layers containing Ag and being disposed on the insulator layers are connected to at least one via hole conductor penetrating the insulator layers in the stacking direction, and having a spiral shape spiraling in the stacking direction. A first pore area ratio of a side gap interposed between an outer circumferential edge of an annular track formed by stacking the plurality of coil conductor layers and an outer edge of the multilayer body, when viewed in the stacking direction, is 9.0% or more and 20.0% or less, and the second pore area ratio of a portion interposed between two coil conductor layers in the stacking direction is 8.0% or less.

2. 发明授权

US09142344B2 Electronic component 有权
标题翻译：电子元器件
公开(公告)号：US09142344B2
公开(公告)日：2015-09-22
申请号：US14151739
申请日：2014-01-09
申请人： MURATA MANUFACTURING CO., LTD.
发明人： Kaoru Tachibana , Mitsuru Odahara
IPC分类号： H01F5/00 , H01F27/24 , H01F27/28 , H01F17/00 , H01F27/29
CPC分类号： H01F27/2804 , H01F17/0013 , H01F17/0033 , H01F27/292
摘要： An electronic component having a laminate having a plurality of insulator layers. A coil is provided consisting of a plurality of coil conductors that are connected by via-conductors piercing through the insulator layers, the coil winding helically about an axis along a direction of lamination. External electrodes are provided on surfaces of the laminate, in which at least some pairs of the coil conductors that neighbor each other with one of the insulator layers provided therebetween have parallel sections that overlap each other when viewed in the direction of lamination. The parallel sections are connected in parallel by the via-conductors or the external electrodes, and each pair of the coil conductors that neighbor each other with one of the insulator layers provided therebetween do not overlap each other when viewed in the direction of lamination, except for the parallel sections, and connections between the coil conductors and the via-conductors.
摘要翻译：一种电子部件，具有具有多个绝缘体层的层叠体。线圈由多个线圈导体组成，线圈导体通过穿过绝缘体层的通孔导体连接，线圈沿着层叠方向围绕轴线螺旋形缠绕。外部电极设置在层压体的表面上，其中至少一些彼此相邻的一对线圈导体，其中设置有绝缘体层之一之间具有在层叠方向上观察时彼此重叠的平行部分。平行部分通过通孔导体或外部电极并联连接，并且彼此相邻的每对线圈导体之间设置的绝缘体层之间彼此不相互重叠，除了层叠方向外用于并联部分，以及线圈导体和通路导体之间的连接。

3. 发明授权

US09455082B2 Electronic component 有权
标题翻译：电子元器件
公开(公告)号：US09455082B2
公开(公告)日：2016-09-27
申请号：US14887455
申请日：2015-10-20
申请人： MURATA MANUFACTURING CO., LTD.
发明人： Kaoru Tachibana , Hiroki Hashimoto
IPC分类号： H01F5/00 , H01F21/02 , H01F27/28 , H01F17/00
CPC分类号： H01F27/2804 , H01F17/0013 , H01F2027/2809
摘要： An electronic component having; a multilayer body including insulating layers stacked on one another; a spiral coil including coil conductors provided on the insulating layers and a first via-hole conductor piercing through at least one of the insulating layers to connect the coil conductors to each other; a parallel conductor provided on one of the insulating layers; and a second via-hole conductor piercing through at least one of the insulating layers to connect the parallel conductor in parallel to one of the coil conductors provided on the insulating layer different from the insulating layer on which the parallel conductor is provided. A portion of the coil conductor not connected in parallel to the parallel conductor at least partly has a greater width than a portion of the coil conductor connected in parallel to the parallel conductor other than a contact point with the second via-hole conductor.
摘要翻译：电子部件具有：包括彼此堆叠的绝缘层的多层体; 螺旋线圈，其包括设置在绝缘层上的线圈导体和穿过至少一个绝缘层的第一通孔导体，以将线圈导体彼此连接; 设置在绝缘层之一上的平行导体; 以及穿过至少一个所述绝缘层的第二通孔导体，以将所述并联导体平行地连接到设置在与设置有所述平行导体的绝缘层不同的绝缘层上的线圈导体之一。线圈导体未平行于平行导体的部分至少部分地具有比除与第二通孔导体的接触点平行于平行导体连接的线圈导体的部分更大的宽度。

4. 发明授权

US10886061B2 Multilayer electronic component manufacturing method and multilayer electronic component 有权
公开(公告)号：US10886061B2
公开(公告)日：2021-01-05
申请号：US15840916
申请日：2017-12-13
申请人： Murata Manufacturing Co., Ltd.
发明人： Kaoru Tachibana
IPC分类号： H01F5/00 , H01F27/29 , H01F27/245 , H01F27/28 , H01F41/02 , H01F27/32 , H01F17/00 , H01G4/232 , H01C17/00 , H01G4/30 , H01G4/12 , H01G4/228 , H01C1/14 , H01C7/18
摘要： A multilayer electronic component manufacturing method includes forming a multilayer body including a plurality of ceramic layers, and forming a groove by removing a part of a bottom surface of the multilayer body. The method further includes segmenting the multilayer body by dividing the multilayer body into a plurality of chip regions, and forming an outer electrode conductor layer on the bottom surface of the multilayer body after formation of the groove and segmentation.

5. 发明授权

US10886060B2 Multilayer electronic component manufacturing method and multilayer electronic component 有权
公开(公告)号：US10886060B2
公开(公告)日：2021-01-05
申请号：US15840777
申请日：2017-12-13
申请人： Murata Manufacturing Co., Ltd.
发明人： Kaoru Tachibana
IPC分类号： H01F5/00 , H01F27/29 , H01F27/245 , H01F27/28 , H01F41/04 , H01F17/00 , H01G4/12 , H01C1/14 , H01C17/00 , H01G4/30 , H01G4/228
摘要： A multilayer electronic component manufacturing method includes forming a multilayer body including a plurality of ceramic layers, and forming an outer electrode conductor layer on a bottom surface of the multilayer body. The method further includes forming a groove by removing at least a part of the outer electrode conductor layer in a part of the outer electrode conductor layer and a part of the bottom surface of the multilayer body after the outer electrode conductor layer is formed, and segmenting the multilayer body by dividing the multilayer body into a plurality of chip regions.

6. 发明授权

US10763033B2 Multilayer coil component and inspection system for multilayer coil component 有权
公开(公告)号：US10763033B2
公开(公告)日：2020-09-01
申请号：US16160630
申请日：2018-10-15
申请人： Murata Manufacturing Co., Ltd.
发明人： Kaoru Tachibana , Kouta Nakao
IPC分类号： H01F27/28 , H01F27/245 , G01N22/00 , H01F27/29 , H01F17/00
摘要： A multilayer coil component includes magnetic layers and inner electrode layers that are alternately laminated on one another. The inner electrode layers are electrically connected to each other to constitute a helical coil conductor. The coil conductor is buried in an element body composed of the magnetic layers. Outer electrodes having folded portions are disposed on both end portions of the element body. The inner electrode layers of the coil conductor have protrusions protruding from both outer edges extending in a length direction of the element body.

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